Micron Technology (MU)

Company ID: 297 | CIK: 0000723125
10-Q view:
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Segments are charted by their disclosed metrics (revenue, segment profit, etc.). Each line is a single segment. Reconciliation/corporate items are excluded. Major customers are shown as a percentage of revenue. Operational KPIs are grouped by metric concept; sub-metrics appear as separate lines.

Geographic Segments

No 10-Q data

Business Unit / Product Segments

Major Customers (% of Revenue)

Operational KPIs

PC systems ASP change (arpu)

No 10-K data

Contract Manufacturing Backlog (backlog)

Customer cash deposits (bookings)

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Planned Utah facility capacity (capacity)

Capital spending guidance (capital_expenditures)

No 10-K data

Top ten customer revenue concentration (customers)

Full-time employees (headcount)

Finished goods inventory (inventory_units)

Short-term debt outstanding (loans_outstanding)

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Building construction commitments (order_book)

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Construction commitments (orders_received)

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128 Meg SDRAM sales mix (other)

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128 Meg SDRAM sales share (other)

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128 Meg SDRAM share of net sales (other)

128M SDRAM sales mix (other)

No 10-K data

16 Meg DRAM revenue share (other)

No 10-K data

16 Meg DRAM sales mix (other)

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16 Meg DRAM sales share (other)

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16 Meg DRAM share of memory sales (other)

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16 Meg SDRAM sales mix (other)

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16 Meg SDRAM share of memory sales (other)

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256 Meg DDR share of net sales (other)

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3D NAND share of Trade NAND sales (other)

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4 Meg DRAM price decline (other)

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4 Meg DRAM sales mix (other)

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64 Meg SDRAM product mix (other)

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64 Meg SDRAM revenue share (other)

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64 Meg SDRAM sales mix (other)

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64 Meg SDRAM sales share (other)

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64 Meg SDRAM share of memory sales (other)

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64Mb SDRAM product mix (other)

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ASP change per megabit (other)

No 10-K data

ASP per megabit change (other)

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ASP per megabit decline (other)

No 10-K data

Active U.S. patents (other)

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Active foreign patents (other)

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Amortization expense (other)

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Annualized cost savings from restructure (other)

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Antidilutive potential shares (other)

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Average selling price change (other)

Average selling price decline (other)

Average selling price growth (other)

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Average selling price per gigabit (other)

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Average selling price per megabit (other)

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Average selling price per megabit change (other)

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Average selling price per megabit growth (other)

No 10-Q data

Average selling prices (other)

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Bit shipment change (other)

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Bit shipment volume change (other)

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Board Diversity (other)

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Building construction commitments (other)

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Buyback authorization remaining (other)

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Buyback authorization used (other)

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Capital expenditure commitments (other)

Capital expenditure estimate (other)

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Capital expenditure guidance (other)

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Capital expenditure plan (other)

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Capital expenditures (other)

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Capital expenditures estimate (other)

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Capital expenditures guidance (other)

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Capital spending (other)

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Capital spending guidance (other)

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Capital spending plan (other)

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Capital spending target (other)

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Cash and equivalents (other)

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Cash and investments (other)

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Cash and liquid investments (other)

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Cash and marketable investments (other)

Cash and short-term investments (other)

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Cash from operations (other)

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Cash held by foreign subsidiaries (other)

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China-headquartered customer revenue (other)

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Common Stock Outstanding (other)

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Common shares outstanding (other)

Computer market share of sales (other)

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Computing market share of net sales (other)

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Computing market share of sales (other)

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Consolidated gross margin (other)

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Contract liabilities (other)

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Contractual building construction commitments (other)

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Contractual equipment purchase commitments (other)

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Cost per gigabit (other)

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Cost per gigabit change (other)

Cost reduction per gigabit (other)

No 10-Q data

Countries of operation (other)

Credit facility limit (other)

No 10-K data

Customer deposit commitments (other)

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Customer labs (other)

Customer prepayments (other)

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DDR SDRAM share of DRAM sales (other)

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DDR share of DRAM sales (other)

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DDR/DDR2 share of sales (other)

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DRAM ASP change (other)

DRAM ASP decline (other)

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DRAM ASP growth (other)

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DRAM ASP per gigabit (other)

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DRAM ASP per gigabit change (other)

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DRAM Average Selling Price (other)

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DRAM Average selling prices per gigabit (other)

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DRAM Cost Per Gigabit (other)

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DRAM Cost per Gigabit (other)

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DRAM Cost per gigabit (other)

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DRAM average selling price (other)

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DRAM average selling price change (other)

DRAM average selling prices (other)

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DRAM bit shipments change (other)

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DRAM bit volume change (other)

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DRAM cost change (other)

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DRAM cost per gigabit (other)

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DRAM cost per gigabit change (other)

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DRAM cost per gigabit reduction (other)

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DRAM gigabit production change (other)

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DRAM gigabit production growth (other)

DRAM gigabits change (other)

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DRAM gigabits sold (other)

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DRAM gigabits sold change (other)

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DRAM net sales change (other)

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DRAM price change (other)

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DRAM production change (other)

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DRAM purchases from Inotera (other)

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DRAM sales mix (other)

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DRAM share of net sales (other)

DRAM wafer starts mix (other)

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Data center revenue share (other)

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Depreciation expense (other)

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Desktop shipment change (other)

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Diluted share count (other)

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Direct purchaser settlement payment (other)

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Distributor resale revenue share (other)

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Diversified product share of sales (other)

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Effective tax rate (other)

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End-market revenue mix (other)

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Equipment purchase commitments (other)

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Equity awards available (other)

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Equity plan shares available (other)

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Estimated capital expenditures (other)

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Estimated capital spending (other)

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Export Sales (other)

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Export sales (other)

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FY2018 capex guidance (other)

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Facility construction commitments (other)

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Fiscal period length (other)

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Fixed-rate debt (other)

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Foreign Patents (other)

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Foreign Patents Owned (other)

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Foreign currency assets (other)

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Foreign patents (other)

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Foreign patents owned (other)

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Foreign sales mix (other)

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Foreign sales percentage (other)

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Foreign sales share (other)

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Fortune 500 rank (other)

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Gigabit production growth (other)

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Gigabits sold growth (other)

Government incentive commitments (other)

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Gross margin (other)

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Gross margin percentage (other)

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Headcount reduction (other)

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Headcount reduction target (other)

IM Flash cash and investments (other)

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IM Flash cash and securities (other)

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IM Flash ownership (other)

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IM Flash ownership interest (other)

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IM Flash sales to Intel (other)

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IMFS cost and supply share (other)

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IMFS output share (other)

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IMFS ownership (other)

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IMFS ownership share (other)

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IMFT distributions (other)

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IMFT ownership (other)

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IMFT ownership share (other)

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Idle facility net book value (other)

No 10-K data

Imaging ASP change (other)

No 10-K data

Imaging share of net sales (other)

No 10-K data

Inotera DRAM purchases (other)

No 10-K data

Inotera ownership (other)

No 10-K data

Inotera ownership interest (other)

No 10-K data

Inotera share of DRAM gigabit production (other)

No 10-K data

Inotera share of DRAM production (other)

Inotera stake market value (other)

No 10-K data

Intangible amortization expense (other)

No 10-K data

Intel NAND ASP change (other)

No 10-K data

Intel NAND cost change (other)

No 10-K data

Intel NAND gigabits change (other)

No 10-K data

Intel R&D cost-sharing reimbursement (other)

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Intel R&D reimbursements (other)

No 10-K data

Intel contributions to IM Flash (other)

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Intelligent edge revenue share (other)

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International net sales share (other)

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International sales (other)

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International sales concentration (other)

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International sales mix (other)

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International sales percentage (other)

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International sales share (other)

International share of net sales (other)

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Inventories (other)

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Inventory NRV write-down (other)

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Inventory growth (other)

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Inventory write-down (other)

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Inventory write-down charge (other)

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Inventory write-down remaining (other)

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Inventory write-downs (other)

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JV assembly/test services (other)

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JV product purchases (other)

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JV production share (other)

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JV share of memory production (other)

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Joint venture capital contributions required (other)

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Joint venture cash (other)

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Joint venture production share (other)

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Joint venture supply share (other)

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Lehi facility cost to complete (other)

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Lehi facility investment (other)

Lehi facility investment to date (other)

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Lehi facility unamortized cost (other)

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Lehi facility unamortized costs (other)

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Lehi underutilization costs (other)

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Lower costs from sale of inventory written down (other)

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MEI cash and investments (other)

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MMJ share of wafer capacity (other)

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Manufacturing countries (other)

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Manufacturing sites (other)

Market value held by nonaffiliates (other)

No 10-Q data

Megabit production growth (other)

Megabit production share (other)

No 10-K data

Megabit sales growth (other)

Megabit sales mix (other)

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Megabit shipment growth (other)

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Megabit shipments growth (other)

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Megabits produced growth (other)

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Megabits shipped growth (other)

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Megabits sold growth (other)

Memory ASP change (other)

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Memory ASP decline (other)

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Memory ASP per megabit (other)

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Memory average selling price change (other)

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Memory gross margin (other)

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Memory sales growth (other)

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Memory sales into PC market (other)

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Memory sales into PC markets (other)

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Memory sales mix (other)

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Memory sales to PC market (other)

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Memory sales to PC markets (other)

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Memory share of net sales (other)

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Memory sold to PC markets (other)

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Mobile market share of sales (other)

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Mobile revenue share (other)

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NAND ASP change (other)

No 10-K data

NAND ASP growth (other)

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NAND ASP per gigabit change (other)

No 10-K data

NAND Flash ASP change (other)

NAND Flash ASP decline (other)

No 10-K data

NAND Flash ASP per gigabit (other)

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NAND Flash average selling price (other)

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NAND Flash average selling price change (other)

NAND Flash average selling prices (other)

No 10-K data

NAND Flash cost per gigabit (other)

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NAND Flash cost per gigabit change (other)

No 10-K data

NAND Flash cost per gigabit reduction (other)

No 10-Q data

NAND Flash gigabit production change (other)

No 10-K data

NAND Flash gigabit production growth (other)

NAND Flash gigabits sold (other)

No 10-K data

NAND Flash gigabits sold change (other)

No 10-K data

NAND Flash sales growth (other)

No 10-K data

NAND Flash sales to Intel (other)

No 10-K data

NAND Flash units sold change (other)

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NAND average selling price change (other)

NAND bit shipments change (other)

No 10-K data

NAND cost change (other)

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NAND cost per gigabit (other)

No 10-K data

NAND cost per gigabit change (other)

No 10-K data

NAND gigabits change (other)

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NAND gigabits sold change (other)

No 10-K data

NAND net sales change (other)

No 10-K data

NAND price change (other)

No 10-K data

NAND production change (other)

No 10-K data

NAND sales to Intel (other)

No 10-K data

NAND sales volume change (other)

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NAND share of net sales (other)

No 10-K data

NAND trade ASP per gigabit change (other)

No 10-K data

NAND trade cost per gigabit change (other)

No 10-K data

NAND trade gigabits sold change (other)

No 10-K data

Net property, plant and equipment (other)

No 10-Q data

Net sales by end market (other)

Net sales by market (other)

Net sales by product (other)

No 10-K data

Net sales growth (other)

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Net sales mix by market (other)

No 10-Q data

Net sales outside United States (other)

No 10-K data

Non-US patents owned (other)

No 10-Q data

Not placed in service (other)

No 10-K data

Notebook shipment change (other)

No 10-K data

Number of Reportable Segments (other)

Outstanding Shares (other)

No 10-Q data

Outstanding shares (other)

Ownership interest (other)

No 10-K data

Ownership percentage (other)

No 10-K data

PC ASP change (other)

No 10-K data

PC average selling price change (other)

No 10-K data

PC gross margin (other)

No 10-K data

PC or peripheral market share of semiconductor sales (other)

No 10-Q data

PC revenue share (other)

No 10-K data

PC sales into PC/peripheral markets (other)

No 10-K data

PC system average selling price (other)

No 10-K data

PC systems ASP change (other)

No 10-K data

PC systems share of net sales (other)

No 10-Q data

PC systems unit sales change (other)

No 10-K data

PC unit sales change (other)

No 10-K data

PC unit sales growth (other)

No 10-K data

PP&E purchase commitments (other)

No 10-K data

Patents granted (other)

Patents owned (other)

No 10-Q data

Per megabit pricing (other)

No 10-K data

Per megabit pricing decline (other)

No 10-K data

Planned capital spending (other)

No 10-K data

Primary product sales mix (other)

No 10-K data

Product revenue mix (other)

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Product sales mix (other)

No 10-K data

Production share by facility (other)

No 10-K data

Property plant and equipment additions (other)

No 10-K data

Purchase commitments (other)

No 10-K data

Purchase obligations (other)

No 10-K data

Purchase obligations for PP&E (other)

No 10-K data

Purchases from Inotera (other)

No 10-K data

Quarterly dividend per share (other)

No 10-K data

Remaining expansion capex (other)

No 10-K data

Remaining share repurchase authorization (other)

No 10-K data

Repurchase authorization remaining (other)

No 10-K data

Research and development expenditures (other)

No 10-Q data

Restricted net assets (other)

No 10-K data

Restricted stock awards (other)

No 10-K data

Restricted stock awards outstanding (other)

No 10-K data

Restructure charges (other)

No 10-K data

Restructure cost savings (other)

No 10-K data

Restructuring charges (other)

No 10-K data

Revenue by end market (other)

Revenue by end market mix (other)

No 10-K data

Revenue by end market share (other)

No 10-K data

Revenue by market segment (other)

No 10-K data

Revenue by product (other)

No 10-K data

Revenue by technology (other)

No 10-K data

Revenue from Huawei (other)

No 10-K data

Revenue from resale by customers with return rights (other)

No 10-K data

Revenue mix by market (other)

No 10-K data

Revenue mix by market segment (other)

No 10-K data

Revolver availability (other)

No 10-K data

Revolving credit facility (other)

No 10-K data

Revolving credit facility availability (other)

No 10-K data

Revolving credit facility available (other)

No 10-K data

Revolving credit facility capacity (other)

No 10-K data

SDRAM share of DRAM wafer starts (other)

No 10-K data

SDRAM share of semiconductor net sales (other)

No 10-K data

SDRAM share of semiconductor sales (other)

No 10-K data

SDRAM transition (other)

No 10-K data

SDRAM wafer starts (other)

No 10-K data

SDRAM wafer starts mix (other)

No 10-K data

SDRAM wafer starts share (other)

No 10-K data

SRAM share of net sales (other)

No 10-Q data

SSD sales growth (other)

No 10-K data

Sales outside United States (other)

No 10-Q data

Sales outside the United States (other)

No 10-Q data

Sales to Aptina (other)

No 10-K data

Sales to Intel (other)

No 10-K data

Segment share of net sales (other)

No 10-K data

Semiconductor gross margin (other)

No 10-K data

Share of net sales (other)

No 10-K data

Share of wafer production (other)

No 10-Q data

Share repurchase authorization remaining (other)

No 10-K data

Shareholders of record (other)

No 10-Q data

Shares available for awards (other)

No 10-K data

Shares available for future awards (other)

No 10-K data

Shares of common stock outstanding (other)

No 10-K data

Shares outstanding (other)

Shares repurchased (other)

No 10-K data

Shares reserved for equity plans (other)

No 10-K data

Shares reserved under equity plans (other)

No 10-K data

Shares reserved under stock plans (other)

No 10-K data

Shelf registration limit (other)

No 10-K data

Stock options granted (other)

No 10-K data

Stock options outstanding (other)

No 10-K data

Stock-based compensation (other)

No 10-K data

Stock-based compensation expense (other)

No 10-K data

TECH JV share of production (other)

No 10-K data

TECH cash and investments (other)

No 10-K data

TECH cash and securities (other)

No 10-K data

TECH joint venture output share (other)

No 10-Q data

TECH joint venture ownership (other)

No 10-K data

TECH joint venture share of megabits produced (other)

TECH joint venture share of production (other)

TECH joint venture supply share (other)

No 10-K data

TECH ownership (other)

No 10-K data

TECH ownership interest (other)

No 10-K data

TECH production share (other)

No 10-K data

TECH share of DRAM wafer production (other)

No 10-Q data

TECH share of megabits produced (other)

No 10-K data

TECH share of memory production (other)

No 10-K data

TECH share of production (other)

No 10-K data

TECH share of wafer production (other)

No 10-Q data

TECH supply share (other)

No 10-K data

TECH supply share of production (other)

No 10-K data

Top five customer share (other)

No 10-K data

Top ten customer concentration (other)

No 10-K data

Total debt (other)

No 10-K data

Total debt carrying value (other)

No 10-K data

Total debt outstanding (other)

No 10-K data

Trade NAND ASP change (other)

No 10-K data

Trade NAND ASP per gigabit change (other)

No 10-K data

Trade NAND Flash ASP change (other)

No 10-K data

Trade NAND Flash cost per gigabit change (other)

No 10-K data

Trade NAND Flash gigabits sold change (other)

No 10-K data

Trade NAND average selling price (other)

No 10-K data

Trade NAND average selling price change (other)

Trade NAND average selling prices (other)

No 10-K data

Trade NAND bit volume change (other)

No 10-K data

Trade NAND cost per gigabit (other)

No 10-K data

Trade NAND cost per gigabit change (other)

No 10-K data

Trade NAND gigabits sold (other)

No 10-K data

Trade NAND gigabits sold change (other)

No 10-K data

Trade NAND gigabytes sold change (other)

No 10-K data

Trade NVM ASP change (other)

No 10-K data

Trade NVM cost per gigabit change (other)

No 10-K data

Trade NVM gigabits sold change (other)

No 10-K data

Trade non-volatile average selling price change (other)

No 10-K data

Trade non-volatile cost per gigabit change (other)

No 10-K data

Trade non-volatile gigabits sold change (other)

No 10-K data

Trade non-volatile memory average selling price change (other)

No 10-K data

Trade non-volatile memory cost per gigabit change (other)

No 10-K data

Trade non-volatile memory gigabits sold change (other)

No 10-K data

U.S. Patents (other)

No 10-Q data

U.S. patents owned (other)

No 10-Q data

US Patents (other)

No 10-Q data

US Patents Owned (other)

No 10-Q data

US patents (other)

No 10-Q data

Unamortized costs (other)

No 10-K data

United States patents owned (other)

No 10-Q data

Unrecognized stock compensation (other)

No 10-K data

Unrecognized stock compensation cost (other)

No 10-K data

Unrecognized stock-based compensation (other)

No 10-K data

Utah facility net book value (other)

No 10-K data

Wafer starts allocation (other)

No 10-K data

Weighted average shares (other)

No 10-K data

Women in senior leadership (other)

No 10-Q data

Women in technical roles (other)

No 10-Q data

Women in workforce (other)

No 10-Q data

Work in progress and finished goods inventory growth (other)

No 10-K data

Year 2000 Compliance Testing (other)

No 10-K data

Year 2000 Quality Assurance (other)

No 10-K data

Year 2000 Remediation (other)

No 10-K data

Year 2000 compliance testing (other)

No 10-K data

Year 2000 remediation (other)

No 10-K data

Memory megabits produced by TECH (production_volume)

Manufacturing sites (properties)

Revenue, Remaining Performance Obligation, Amount (rpo)

Building square footage (square_footage)

Wafer outs (throughput)

No 10-Q data

Megabits shipped (units_shipped)

SDRAM share of DRAM wafer starts (utilization_rate)

Human capital disclosures. Workforce totals and demographics are point-in-time. Flow metrics use the year-to-date period for 10-Q and full year for 10-K. Workforce actions (RIFs, restructurings, acquisition-related changes) are listed in the table at the bottom.

Workforce Totals

No 10-Q data
No 10-Q data
No 10-Q data

Demographics

No 10-Q data
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Workforce Breakdowns

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HCM Metrics — Point-in-Time

No 10-Q data

HCM Metrics — Flow (Annual / YTD)

No flow HCM metrics found.

Workforce Actions

Period EndTypeStatusAffected% WorkforceAnnouncedExpected CompletionGeographySegment / FunctionChargeSourceNote
2025-08-28restructuringin_progressUSD 30 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY2025 employee severance charge of $30M (total restructure and asset impairments $39M); no employees-affected count or announcement date disclosed. The separate 2023 restructure plan (approx. 15% headcount reduction) was substantially completed in 2023 and is not counted here.
2025-08-28restructuringcompleted20232023-12-31GlobalAll functionsUSD 39 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0		Fiscal 2025 charges of $39 million (primarily employee severance) relate to a restructure plan initiated in 2023. The 2023 plan reduced headcount by approximately 15% and was substantially completed in 2023. No specific employee count is disclosed for the 2025 charges.
2024-08-29restructuringcompletedGlobalCompany-wideUSD 1 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY2024 employee severance charge of $1M; residual activity under the 2023 Restructure Plan, which reduced headcount approximately 15% by end of calendar 2023 and was substantially completed in 2023 (prior-year activity not extracted).
2024-08-29restructuringcompleted15%20232023-12-31GlobalAll functionsUSD 171 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		2023 Restructure Plan reduced headcount by approx 15% by end of calendar 2023 via voluntary attrition and personnel reductions. Substantially completed in 2023. Charge of $171M incurred in 2023.
2024-05-30restructuringcompleted15%2023-12-31USD 167 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		2023 Restructure Plan reduced headcount ~15% via voluntary attrition and personnel reductions; substantially completed in 2023. Charges of $167 million (including $163 million employee severance) were recorded in the first nine months of fiscal 2023; no charges in fiscal 2024 periods.
2024-05-30restructuringcompleted15%2023-01-012023-12-31GlobalAll segmentsUSD 0 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2023 Restructure Plan reduced headcount by approx 15% via voluntary attrition and personnel reductions. Plan substantially completed in 2023. No charges recorded in Q3 2024.
2024-02-29restructuringcompleted15%2023-01-012023-12-31restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		2023 Restructure Plan reduced headcount by approximately 15% via voluntary attrition and personnel reductions; substantially completed in 2023. No restructure charges recorded in fiscal 2024 periods; prior-year comparative charges of $86 million (Q2 2023) and $99 million (six months 2023) not extracted per current-period-only rule.
2024-02-29restructuringcompleted15%20232023-12-31GlobalAll segmentsrestructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		2023 Restructure Plan cut headcount about 15% via attrition and personnel reductions; substantially completed in calendar 2023. No restructure charges recorded in the current quarter or YTD 2024; absolute affected-employee count not disclosed. Included because the filing restates the program in this quarter's restructuring footnote.
2024-02-29restructuringcompleted15%2023-01-012023-12-31GlobalAll segmentsrestructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2023 Restructure Plan reduced headcount by approx 15% via voluntary attrition and personnel reductions. Plan substantially completed in 2023. No charges recorded in Q2 2024.
2023-11-30restructuringcompleted15%2023-01-012023-08-31other
f5-10q / GLM-5.3-flash-fp4-HTML		Plan initiated in fiscal 2023 in response to challenging industry conditions; headcount reduced approximately 15% via voluntary attrition and personnel reductions; substantially completed in fiscal 2023. No restructuring charges recorded in the current quarter.
2023-11-30restructuringcompleted15%20232023GlobalCompany-wideother
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Approximately 15% headcount reduction via voluntary attrition and personnel reductions; plan substantially completed in 2023. Disclosed only in risk factors; no restructuring footnote, employee count, or charge presented for the current quarter. No restructuring or restructure/asset impairment charge recorded in Q1 FY2024 (line item was zero).
2023-11-30restructuringcompleted15%2023-12-31GlobalAll functionsRisk Factors
f5-10q / Qwen3.6-27B-Q8_0		2023 Restructure Plan substantially completed in 2023; reduced headcount by approx 15% via voluntary attrition and personnel reductions.
2023-08-31restructuringin_progress15%2023-12-31GlobalCompany-wideUSD 171 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Headcount reduction expected to approach 15% of workforce by end of calendar 2023 via voluntary attrition and personnel reductions; plan substantially completed in Q3 FY2023. Charge primarily employee severance; $167 million paid during 2023 with $4 million remaining liability. No absolute employee count or announcement date disclosed. Expected cost savings of approximately $130 million per quarter post-2023.
2023-08-31restructuringcompleted15%2023-01-012023-12-31GlobalAll functionsUSD 171 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		2023 Restructure Plan initiated in response to challenging industry conditions. Headcount reduction expected to approach 15% by end of calendar 2023 through voluntary attrition and personnel reductions. Plan substantially completed in 2023.
2023-06-01restructuringin_progress15%2023-12-31USD 68 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Headcount reduction to approach 15% by end of calendar 2023 via voluntary attrition and personnel reductions; Q3 charge of $68 million primarily employee severance; nine-month charges $167 million; plan substantially completed in Q3 with $46 million severance liability remaining.
2023-06-01restructuringin_progress15%2023-12-31USD 167 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Nine-month (year-to-date) restructure charges under the 2023 Restructure Plan, primarily employee severance; total expected costs approximately $170 million.
2023-06-01restructuringin_progress15%2023-12-31GlobalCompany-wideUSD 167 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		2023 Restructure Plan: headcount reduction expected to approach 15% by end of calendar 2023 via attrition and personnel reductions. Charges of $68M in Q3 and $167M in first nine months of FY2023, primarily severance. Plan substantially completed in Q3 2023; $46M accrued severance expected to be paid in Q4 2023. Expected savings ~$130M per quarter starting Q4 2023. No absolute employee count or announcement date disclosed.
2023-06-01restructuringin_progress15%2023-01-012023-12-31GlobalAll functionsUSD 167 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2023 Restructure Plan initiated in response to challenging industry conditions. Headcount reduction to approach 15% by end of calendar 2023 via voluntary attrition and personnel reductions. YTD charges of $167 million primarily for employee severance. Plan substantially completed in Q3 with $46 million accrued severance remaining.
2023-03-02restructuringin_progress15%2023-09-30USD 86 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Headcount reduction to approach 15% by end of calendar 2023 via voluntary attrition and personnel reductions; Q2 charge $86M, six-month charge $99M, total expected ~$160M with ~$60M more in H2 2023; ~$120M future cash payments substantially all in 2023; expected savings ~$130M per quarter starting Q4 2023; severance liability of $56M at quarter end
2023-03-02otherin_progress2023-02-052023-08-31Executive officers / company-wideother
f5-10q / GLM-5.3-flash-fp4-HTML		Executive base salaries reduced effective February 5, 2023 for remainder of fiscal 2023 as part of cost reductions; company-wide bonus suspended for 2023 per MD&A
2023-03-02restructuringin_progress15%2023-08-31GlobalCompany-wideUSD 99 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		2023 Restructure Plan initiated in response to challenging industry conditions; headcount reduction expected to approach 15% by end of calendar 2023 via voluntary attrition and personnel reductions. Charge shown is six-months-ended severance-related expense ($86M in Q2 alone); total expected plan costs ~$160M with ~$60M more expected in 2H 2023 and ~$120M of future cash payments. Filer does not disclose absolute employee counts or an announcement date.
2023-03-02restructuringin_progress15%2023-01-012023-12-31GlobalAll functionsUSD 99 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Initiated 2023 Restructure Plan in response to challenging industry conditions. Headcount reduction to approach 15% by end of calendar 2023 via voluntary attrition and personnel reductions. Incurred $99M in charges for the six months ended March 2, 2023, primarily related to employee severance. Total expected costs approximately $160M. Plan expected to be substantially completed by end of Q3 2023.
2022-12-01restructuringannounced10%2022-12-212023-12-31Company-wideUSD 30 (millions)subsequent_events
f5-10q / GLM-5.3-flash-fp4-HTML		Plan announced December 21, 2022 in response to challenging industry conditions; headcount reduction of approximately 10% over calendar 2023 via voluntary attrition and personnel reductions; charges of at least $30 million expected in Q2 fiscal 2023. Also disclosed in MD&A and Risk Factors.
2022-12-01restructuringannounced10%2022-12-212023-12-31GlobalCompany-wideUSD 30 (millions)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Approximately 10% headcount reduction over calendar year 2023 via voluntary attrition and personnel reductions; charge is a floor ('at least $30 million') expected in fiscal Q2 2023. Same event also described in MD&A; extracted once from the subsequent events footnote. Implied absolute count not calculated per extraction rules.
2022-12-01restructuringannounced10%2022-12-212023-12-31GlobalAll segmentsUSD 30 (millions)subsequent_events
f5-10q / Qwen3.6-27B-Q8_0		Announced Dec 21, 2022. Plan to reduce headcount by approx 10% over calendar 2023 via voluntary attrition and personnel reductions. Charges of at least $30M expected in Q2 FY2023.
2022-09-01plant_closurecompleted2021-06-302021-10-22United States — Lehi, Utah3D XPoint production (MTU facility)USD 23 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sale of Lehi (MTU) facility to Texas Instruments closed 2021-10-22 in fiscal 2022 Q1; $23M loss on disposition recorded in FY2022 restructure and asset impairments. Employee headcount at the facility not disclosed. Prior-year $435M held-for-sale write-down (FY2021) excluded
2022-06-02divestiture_reductioncompleted2021-06-302021-10-22United States (Lehi, Utah)3D XPoint memory manufacturingUSD 23 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Sale of Lehi fab to Texas Instruments; no employee count disclosed. Loss of $23M recognized in Q1 FY2022 restructure and asset impairments; $893M proceeds received in Q1 FY2022. Prior $435M held-for-sale write-down charge was recorded in Q3 FY2021.
2022-03-03divestiture_reductioncompleted2021-06-302021-10-22United States (Lehi, Utah)3D XPoint manufacturingUSD 23 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Sale of Lehi fab to Texas Instruments; $23M loss recognized in restructure and asset impairments in Q1 2022 upon receipt of $893M proceeds. Filing does not disclose associated headcount.
2022-03-03restructuringcompleted2021-06-302022-03-03Lehi, Utah3D XPoint / ManufacturingUSD 23 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Sale of Lehi facility to Texas Instruments closed in Q1 2022. Recognized $23 million loss in restructure and asset impairments. Employee count affected not disclosed.
2021-12-02divestiture_reductioncompleted2021-06-302021-10-22Lehi, Utah, United States3D XPoint production facilityUSD 23 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Sale of Lehi fab to Texas Instruments closed October 22, 2021; $893 million received in Q1 FY2022; $23 million loss recognized in restructure and asset impairments. No employee headcount affected was disclosed.
2021-12-02plant_closurecompleted2021-06-302021-10-22Lehi, Utah, United States3D XPoint memory manufacturingUSD 23 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Sale of the Lehi fab to Texas Instruments closed October 22, 2021; $893 million received and $918 million of net assets disposed. A $23 million loss was recognized in restructure and asset impairments in Q1 2022 (total restructure and asset impairments for the quarter were $38 million). No employee count, severance amount, or headcount impact is disclosed for this action.
2021-12-02plant_closurecompleted2021-06-302021-10-22Lehi, Utah3D XPointUSD 23 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Sale of Lehi facility to Texas Instruments closed Oct 22, 2021. Recognized $23M loss in restructure and asset impairments. Employee count not disclosed.
2021-09-02divestiture_reductionin_progress2021-06-302022-03-31United States — Lehi, UtahCompute and Networking Business Unit (CNBU) — 3D XPoint operationsUSD 435 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Micron ceased 3D XPoint development and agreed to sell the Lehi facility to Texas Instruments for $900 million cash; a $435 million impairment was recorded to write assets down to expected consideration. No employee headcount impact is disclosed. A separate $49 million 3D XPoint inventory write-down was charged to cost of goods sold in Q2 FY2021.
2021-06-03divestiture_reductionannounced2021-06-302021-12-31Lehi, Utah, United StatesCNBU (3D XPoint production)USD 435 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Definitive agreement to sell Lehi facility dedicated to 3D XPoint production to Texas Instruments for $900 million cash; no employee headcount affected was disclosed. Impairment charge of $435 million recorded in Q3 2021 with a related $104 million tax benefit; sale anticipated to close later in the calendar year.
2021-06-03plant_closureannounced2021-06-30Lehi, Utah, United StatesCompute and Networking Business Unit (CNBU) — 3D XPoint operationsUSD 435 (millions)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Micron ceased 3D XPoint development in Q2 2021, classified the Lehi facility as held for sale, and announced a definitive agreement to sell the facility to Texas Instruments for $900 million cash; sale expected to close later in calendar 2021. A $435 million impairment was recognized in Q3 2021 (with a $104 million tax benefit). No employee headcount affected was disclosed; a separate $49 million 3D XPoint inventory write-down was recorded in Q2 2021.
2021-06-03restructuringin_progress2021-06-30United StatesCompute and Networking Business UnitUSD 435 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Ceased development of 3D XPoint technology; classified Lehi facility assets as held for sale. Recognized $435 million impairment charge to write down assets to expected consideration net of selling costs. Sale to Texas Instruments announced June 30, 2021.
2021-03-04plant_closurein_progress2021-03-042021-12-31Lehi, Utah, United StatesCNBU (3D XPoint technology development and production)USD 49 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Company ceased 3D XPoint development at quarter-end, classified $1.44 billion of Lehi facility PP&E as held for sale, ceased depreciating the assets, and recognized a $49 million charge to cost of goods sold to write down 3D XPoint inventory; sale agreement expected within calendar 2021. No employee headcount affected was disclosed.
2021-03-04plant_closurein_progress2021-03-042021-12-31Lehi, Utah, United StatesCompute and Networking Business Unit (CNBU) — 3D XPoint development and productionUSD 49 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Micron ceased 3D XPoint development effective end of Q2 FY2021 and classified the Lehi facility as held-for-sale; $49M charge was an inventory write-down, not severance. No employee count or severance accrual disclosed; sale expected within calendar 2021.
2021-03-04restructuringin_progressUnallocatedUSD 13 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Charge of $13M for the six months ended March 4, 2021, of which $5M was recognized in the second quarter; no employee counts, severance detail, or completion timing disclosed.
2021-03-04plant_closurein_progress2021-03-042021-12-31Lehi, UtahCompute and Networking Business Unit (CNBU)USD 49 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Ceased development of 3D XPoint technology; engaged in discussions for sale of Lehi facility. Recognized $49 million charge to write down 3D XPoint inventory. Employee count not disclosed.
2020-09-03restructuringin_progressUnited StatesUSD 60 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY2020 restructure and asset impairments line of $60 million related primarily to right-sizing the Lehi, Utah facility (asset impairments plus employee relocation and severance costs); no employee count, announcement date, or completion timeline disclosed. Charge figure is the full line-item total, not a Lehi-only amount.
2020-09-03restructuringcompletedLehi, UtahUSD 60 (millions)Other Operating (Income) Expense, Net
f5-10k / Qwen3.6-27B-Q8_0		Restructure and asset impairments primarily related to asset impairments and employee relocation and severance costs related to right-sizing Lehi, Utah facility.
2020-02-27restructuringin_progressUSD 10 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Q2 2020 restructure and asset impairments expense of $10 million. No employee count disclosed.
2020-02-27restructuringin_progressUSD 6 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		YTD 2020 restructure and asset impairments expense of $6 million. No employee count disclosed.
2020-02-27otherin_progressMD&A
f5-10q / Qwen3.6-27B-Q8_0		YTD 2020 employee severance expense of $1 million. No employee count disclosed.
2019-11-28restructuringin_progressUnallocatedUSD 1 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Unallocated employee severance expense of $1 million in the three months ended November 28, 2019 (vs. $20 million in the prior-year quarter) indicates ongoing separations, but the filing discloses no affected-employee count, announcement date, or completion timeline. No dedicated restructuring footnote appears in this 10-Q.
2019-08-29restructuringin_progressUSD 116 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Full-year FY2019 employee severance expense shown as an unallocated item; no headcount, geography, or program timeline disclosed.
2019-08-29plant_closurecompletedSingaporeUSD 128 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sale of the 200mm fabrication facility in Singapore finalized during FY2019; recognized a restructure gain of $128 million. No workforce impact disclosed.
2019-08-29acquisition_additionannounced2019-012019-10-31Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Option exercised January 2019 to acquire Intel's interest in IMFT; approximately $1.4 billion payment expected in Q1 2020. Closing set for after fiscal year-end; no headcount disclosed.
2019-05-30restructuringin_progressCentralized key functionsUSD 9 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Restructure and asset impairments of $9 million in Q3 FY2019 (part of $93 million for first nine months) tied to centralizing certain key functions; no employee counts disclosed. Restructure accrual of $23 million in other current liabilities as of May 30, 2019.
2019-05-30divestiture_reductionannouncedSingapore200mm fabrication facilityUSD 120 (millions)subsequent_events
f5-10q / GLM-5.3-flash-fp4-HTML		Sale of the 200mm fabrication facility in Singapore finalized after quarter-end, with an expected gain of approximately $120 million in Q4 FY2019; no headcount impact disclosed.
2019-05-30restructuringin_progressNot specifiedUnallocated corporate functionsUSD 37 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Employee severance of $37 million charged in the first nine months of fiscal 2019 as part of a reorganization emphasizing centralization of key functions; no employee count or timing disclosed. Related restructure and asset impairment charges of $93 million for the nine-month period.
2019-05-30plant_closurecompletedSingaporeManufacturing (200mm fabrication facility)USD 120 (millions)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Sale of the 200mm fabrication facility finalized after quarter end; expected gain of approximately $120 million in Q4 2019. No associated headcount reduction disclosed.
2019-05-30restructuringin_progressUSD 9 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Charge for 'Restructure and asset impairments' primarily related to centralizing key functions. Employee count not disclosed.
2019-05-30restructuringin_progressUSD 93 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		YTD charge for 'Restructure and asset impairments'. Employee count not disclosed.
2019-02-28restructuringin_progressCentralized key functionsUSD 51 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Restructure and asset impairments of $51 million in the quarter primarily relate to centralizing certain key functions; no employee counts disclosed. Restructure accrual of $54 million in other current liabilities as of 2019-02-28.
2019-02-28restructuringin_progressUnallocated / corporate functionsUSD 37 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Employee severance of $37M for six months ended 2019-02-28 ($17M in Q2) and restructure/asset impairment charges of $81M YTD ($51M in Q2) tied to centralizing key functions; no employee counts, announcement date, or completion timing disclosed. Other operating expense note shows $84M YTD restructure and asset impairments including $46M unrealized losses on assets held for sale.
2019-02-28restructuringin_progressUSD 51 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Charge relates to continued emphasis to centralize certain key functions. Employee count not disclosed.
2019-02-28restructuringin_progressUSD 84 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		YTD charge relates to continued emphasis to centralize certain key functions. Employee count not disclosed.
2018-11-29restructuringin_progressCentralization of certain key functionsUSD 33 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Q1 FY2019 restructure and asset impairments of $33 million included $16 million from continued centralization of key functions and $16 million of impairments writing off certain property, plant, and equipment. No employee counts disclosed.
2018-11-29restructuringin_progressCorporate functionsUSD 16 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Q1 FY2019 restructure costs of $16M tied to continued centralization of key functions; no employee count, announcement date, or completion date disclosed. Separate $16M of the $33M total was asset impairment, not workforce-related.
2018-11-29restructuringin_progressUSD 33 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Includes $16M for centralizing key functions and $16M for PP&E write-offs. Employee count not disclosed.
2018-11-29restructuringin_progressUSD 16,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-08-30restructuringin_progressNot specifiedCorporate functionsUSD 28 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY2018 restructure and asset impairments charge of $28M, described as driven by continued effort to centralize certain key functions; no employee counts, dates, or program status disclosed.
2018-08-30restructuringcompletedUSD 28 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Restructure and asset impairments of $28 million in 2018 primarily consisted of costs incurred as a result of continued emphasis to centralize certain key functions. Employee count not disclosed.
2018-05-31restructuringin_progress2016-09-01USD 8 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Restructure plan initiated in 2016 included project eliminations, closure of open headcount requisitions, and workforce reductions; Q3 FY2018 unallocated restructure and asset impairment charge of $8 million ($21 million for first nine months). No employee counts disclosed in this 10-Q.
2018-03-01restructuringcompletedUSD 7 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Restructure and asset impairments charge of $7 million recorded in the quarter ended March 1, 2018. Employee count not disclosed.
2018-03-01restructuringcompletedUSD 13 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Restructure and asset impairments charge of $13 million recorded in the six months ended March 1, 2018. Employee count not disclosed.
2017-11-30restructuringcompletedGlobalVariousUSD 6 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Filing discloses $6 million in 'Restructure and asset impairments' charges for Q1 2018. Risk factors mention prior actions including sale of Akita facility, Tera Probe interest, Singapore fab assets, and Lexar brand, but do not quantify current quarter headcount impact.
2017-08-31restructuringin_progress2016-06-30GlobalMultiple areas of businessUSD 18 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Restructure plan initiated in fiscal 2016; $18M of charges recorded in fiscal 2017 (fiscal 2016: $67M). Included project eliminations, closure of open requisitions and workforce reductions; number of employees affected not disclosed. Company does not expect additional material charges.
2017-08-31divestiture_reductioncompleted2017-06-30JapanAssembly and testrestructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sale of Akita, Japan assembly and test facility in fiscal 2017, together with the 40% Tera Probe interest; headcount not disclosed. Exact transaction dates not specified in filing.
2017-08-31divestiture_reductioncompleted2017-06-30SingaporeWafer fabrication (200mm)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sale of assets associated with 200mm fabrication facility in Singapore; additional gain of approximately $100M expected in 2019 upon completion of the sale. Headcount not disclosed.
2017-08-31divestiture_reductioncompleted2017-06-30GlobalLexar brandrestructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sale of assets related to the Lexar brand in fiscal 2017; headcount not disclosed.
2017-08-31acquisition_additioncompleted2016-12-062016-12-06TaiwanDRAM manufacturing (CNBU)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Acquisition of remaining 67% interest in Inotera (now MTTW) closed December 6, 2016, within fiscal 2017; results consolidated from that date. Headcount added not disclosed; transaction costs of $13M included in SG&A for fiscal 2017.
2017-08-31restructuringcompleted2016GlobalVariousUSD 18 (millions)Item 1A. Risk Factors
f5-10k / Qwen3.6-27B-Q8_0		Plan initiated in 2016 included workforce reductions and project eliminations. $18 million charge incurred in 2017.
2017-08-31plant_closurecompleted2017Akita, JapanAssembly and TestItem 1A. Risk Factors
f5-10k / Qwen3.6-27B-Q8_0		Sold assembly and test facility located in Akita, Japan in 2017.
2017-08-31divestiture_reductioncompleted2017SingaporeManufacturingItem 1A. Risk Factors
f5-10k / Qwen3.6-27B-Q8_0		Sold assets associated with 200mm fabrication facility in Singapore in 2017.
2017-08-31divestiture_reductioncompleted2017GlobalStorageItem 1A. Risk Factors
f5-10k / Qwen3.6-27B-Q8_0		Sold assets related to Lexar brand in 2017.
2017-08-31restructuringin_progressFourth Quarter of 2016 Restructuring Plan [Member]USD 33,000,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2017-06-01restructuringin_progress2016-09-02USD 33 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Plan initiated in Q4 FY2016; included project eliminations, closure of open headcount requisitions, and workforce reductions. Charges of $33 million in first nine months of FY2017 and $58 million in Q4 FY2016; no additional material charges expected. Accrued liabilities of $24 million as of September 1, 2016 substantially all paid in first nine months of FY2017. Employee count not disclosed.
2017-06-01divestiture_reductionin_progress2017-04-142017-09-28JapanAssembly and test facility (Akita) and 40% interest in Tera ProbeUSD 11 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Agreement to sell Akita assembly and test facility and 40% Tera Probe ownership for aggregate consideration of $60 million, substantially all cash. Tera Probe sale completed in Q3 FY2017; Akita facility sale expected to close in Q4 FY2017. Loss of $11 million recognized in Q3 FY2017. Headcount affected not disclosed.
2017-06-01restructuringin_progressGlobalMultipleUSD 33 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		2016 Restructuring Plan initiated in fiscal Q4 2016; $33M charged in first nine months of 2017 and $58M in fiscal Q4 2016. Includes project eliminations, headcount requisition closures, and workforce reductions; no employee counts disclosed. Company does not expect additional material charges.
2017-06-01divestiture_reductionin_progress2017-04-142017-08-31JapanAssembly and test operations (Akita facility); Tera Probe 40% equity interestUSD 11 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Agreement to sell Akita assembly/test facility and 40% Tera Probe stake for $60M aggregate consideration; Tera Probe sale completed in fiscal Q3 2017, Akita facility sale expected to close in fiscal Q4 2017. $11M loss recognized in fiscal Q3 2017; no employee counts disclosed.
2017-06-01acquisition_additioncompleted2016-12-062016-12-06TaiwanDRAM manufacturing (CNBU)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Acquisition of remaining 67% of Inotera (now MTTW) closed December 6, 2016; results consolidated from that date. No headcount added through the acquisition is disclosed.
2017-06-01restructuringin_progress2016-10-01USD 33 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2016 Restructuring Plan initiated in Q4 2016; $33M incurred in first nine months of 2017. Employee count not disclosed.
2017-06-01restructuringcompleted2017-04-142017-09-30JapanAssembly and TestUSD 11 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Sale of Akita facility and Tera Probe interest. Tera Probe sale completed in Q3 2017; Akita facility sale expected in Q4 2017. Employee count not disclosed.
2017-06-01restructuringin_progressFourth Quarter of 2016 Restructuring Plan [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-03-02restructuringin_progress2016-10-01USD 33 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		2016 Restructuring Plan initiated in Q4 FY2016; includes project eliminations, closure of open headcount requisitions, and workforce reductions in certain areas. Charges of $33 million in first six months of FY2017 ($4 million in Q2) and $58 million in Q4 FY2016; no additional material charges expected. Accrued liabilities of $9 million as of March 2, 2017. No employee counts disclosed.
2017-03-02restructuringin_progress2016USD 33 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Plan initiated in fiscal Q4 2016; $33M charged in the six months ended 2017-03-02 (plus $58M in fiscal Q4 2016). Includes headcount reductions, closed requisitions, and project eliminations, but no employee counts are disclosed. Accrued liability was $9M at 2017-03-02; company does not expect additional material charges.
2017-03-02acquisition_additioncompleted2016-12-06TaiwanDRAM manufacturing (Inotera)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Acquisition of the remaining 67% of Inotera closed 2016-12-06 and its results were consolidated thereafter; no headcount added through the acquisition is disclosed in this filing.
2017-03-02restructuringin_progress2016-10-01USD 4 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2016 Restructuring Plan initiated in Q4 2016. $4M charge in Q2 2017. Employee count not disclosed.
2017-03-02restructuringin_progress2016-10-01USD 33 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2016 Restructuring Plan initiated in Q4 2016. $33M charge YTD 2017. Employee count not disclosed.
2017-03-02restructuringin_progressFourth Quarter of 2016 Restructuring Plan [Member]USD 4,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2016-12-01restructuringin_progress2016-09-01CNBU and MBU operating segments primarilyUSD 29 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Plan initiated in Q4 FY2016; includes elimination of certain projects and programs, permanent closure of open headcount requisitions, workforce reductions, and other non-headcount spending reductions. Charges of $29 million in Q1 FY2017 and $58 million in Q4 FY2016; no additional material charges expected. Accrued liabilities of $17 million as of December 1, 2016. Employee count not disclosed.
2016-12-01acquisition_additionannounced2016-12-062016-12-06TaiwanDRAM manufacturing (Inotera Memories, Inc.)USD 4,100 (millions)subsequent_events
f5-10q / GLM-5.3-flash-fp4-HTML		Acquired remaining 67% interest in Inotera for $4.1 billion cash, funded by 2021 Term Loan (NT$80 billion / $2.5 billion), sale of 58 million shares to Nanya for $981 million, and cash on hand. Headcount added not disclosed; purchase price allocation pending.
2016-12-01restructuringin_progress2016-08-01GlobalCNBU; MBUUSD 29 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		2016 Restructuring Plan initiated in Q4 2016; includes workforce reductions, project eliminations, and headcount requisition closures. $29M charged in Q1 2017; $58M in Q4 2016. No employee count disclosed. Accrued liability $17M at quarter-end.
2016-12-01acquisition_additionannounced2016-12-062016-12-06TaiwanDRAM manufacturingUSD 4,100 (millions)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Acquired remaining 67% of Inotera for $4.1B cash; Inotera consolidates from Dec 6, 2016. No headcount addition disclosed.
2016-12-01restructuringin_progress2016-10-01CNBU, MBUUSD 29 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2016 Restructuring Plan initiated in Q4 2016 includes workforce reductions. Q1 2017 charges of $29M incurred; no additional material charges expected. Employee count not disclosed.
2016-12-01restructuringin_progressFourth Quarter of 2016 Restructuring Plan [Member]USD 29,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2016-09-01restructuringin_progressGlobalUSD 80 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		2016 Restructuring Plan initiated in the fourth quarter of fiscal 2016; $58 million of the $80 million expected charge incurred in fiscal 2016 with the remainder expected in early fiscal 2017. Plan comprises project/program eliminations, closure of open headcount requisitions, workforce reductions in certain areas, and non-headcount spending cuts; expected savings of approximately $80 million per quarter in 2017. No employee count disclosed. $24 million accrued as of September 1, 2016.
2016-09-01restructuringin_progress2016-09-012017-03-31GlobalVariousUSD 80 (millions)Item 1A. Risk Factors
f5-10k / Qwen3.6-27B-Q8_0		Initiated in Q4 2016; expects $80M in charges, substantially all in cash. $58M incurred in 2016, remainder in early 2017. Includes workforce reductions and project closures.
2016-09-01restructuringin_progressFourth Quarter of 2016 Restructuring Plan [Member]USD 58,000,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2016-06-02restructuringannounced2016-06-022017-03-31USD 70 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Cost savings program targeting approximately $80 million per quarter of savings in 2017 via focused projects, closure of open headcount requisitions, workforce reductions, and non-headcount spending cuts. Charges expected substantially all in cash, majority in Q4 2016 with remainder in early 2017. No employee count disclosed.
2016-06-02restructuringcompleted2015-12-032016-06-02Agrate, ItalyManufacturingUSD 9 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Q1 2016 charges for restructure of manufacturing activities in Agrate, Italy; no significant additional costs anticipated as of June 2, 2016. No employee count disclosed.
2016-06-02plant_closurecompleted2015-12-032016-06-02Aguadilla, Puerto RicoModule assembly and testUSD 5 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Q1 2016 severance benefits and equipment-related retirement and impairment costs to close the module assembly and test facility; no significant additional costs anticipated as of June 2, 2016. No employee count disclosed.
2016-06-02restructuringannouncedCompany-wideUSD 70 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Filer states the plan was initiated in the fourth quarter of 2016 (i.e., after the June 2, 2016 quarter end); no specific announcement date disclosed. Plan includes closing open headcount requisitions, workforce reduction in certain areas, and other spending cuts, targeting roughly $80 million per quarter of savings in 2017. Expected $70 million charge, substantially all cash, majority in fiscal Q4 2016 with the remainder in early 2017. Number of employees affected not disclosed.
2016-06-02plant_closurecompletedPuerto RicoModule assembly and test (Aguadilla facility)USD 5 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Closure of the module assembly and test facility in Aguadilla, Puerto Rico; $5 million recorded in the fiscal first quarter of 2016 covering severance benefits plus equipment retirement and impairment costs. Filer states no significant additional costs expected as of June 2, 2016. Employee count not disclosed.
2016-06-02restructuringcompletedItalyManufacturing (Agrate site)USD 9 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Restructure of manufacturing activities in Agrate, Italy; $9 million charge recorded in the fiscal first quarter of 2016. Filer states no significant additional costs expected as of June 2, 2016. Employee count not disclosed.
2016-06-02restructuringannounced2016-06-022017-03-31GlobalVariousUSD 70 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Initiated in Q4 2016 (subsequent event). Plan includes workforce reduction and permanent closure of open headcount requisitions. Expected savings of $80M per quarter in 2017. Majority of charges expected in Q4 2016, remainder in early 2017.
2016-06-02restructuringcompleted2016-01-012016-06-02Italy, Puerto RicoManufacturingUSD 14 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Q1 2016 charges: $9M for Agrate, Italy manufacturing restructure; $5M for Aguadilla, Puerto Rico module assembly/test facility closure (severance and equipment retirement). No significant additional costs anticipated as of June 2, 2016.
2016-03-03restructuringcompletedAgrate, ItalyManufacturingUSD 9 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		First quarter 2016 charges for restructure of manufacturing activities in Agrate, Italy; no employee count disclosed. Company stated no significant additional costs anticipated as of March 3, 2016.
2016-03-03plant_closurecompletedAguadilla, Puerto RicoModule assembly and testUSD 5 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		First quarter 2016 severance benefits and equipment-related retirement and impairment costs to close module assembly and test facility; no employee count disclosed.
2016-03-03restructuringcompleted2015-12-04Agrate, ItalyManufacturingUSD 9 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML		First quarter of fiscal 2016 charge for restructure of manufacturing activities; no employee count disclosed.
2016-03-03plant_closurecompleted2015-12-04Aguadilla, Puerto RicoModule assembly and testUSD 5 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML		First quarter of fiscal 2016 charge to close module assembly and test facility; includes severance benefits and equipment-related retirement/impairment costs. No employee count disclosed.
2016-03-03restructuringcompleted2016-01-012016-03-03ItalyManufacturingUSD 9 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Restructure of manufacturing activities in Agrate, Italy. Employee count not disclosed.
2016-03-03plant_closurecompleted2016-01-012016-03-03Puerto RicoManufacturingUSD 5 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Closure of module assembly and test facility in Aguadilla, Puerto Rico. Includes severance benefits and equipment-related retirement/impairment. Employee count not disclosed.
2015-12-03restructuringcompleted2015-12-03Agrate, ItalyManufacturingUSD 9 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Charges for restructure of manufacturing activities; no significant additional costs anticipated as of quarter end. Employee count not disclosed.
2015-12-03plant_closurecompleted2015-12-03Aguadilla, Puerto RicoModule assembly and testUSD 5 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Severance benefits and equipment-related retirement and impairment costs to close module assembly and test facility; employee count not disclosed.
2015-12-03restructuringcompletedAgrate, ItalyManufacturingUSD 9 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Charges for restructure of manufacturing activities recorded in Q1 FY2016; no employee count disclosed. Filer states no significant additional costs anticipated as of 2015-12-03.
2015-12-03plant_closurecompletedAguadilla, Puerto RicoModule assembly and testUSD 5 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Closure of module assembly and test facility; charge bundles severance benefits with equipment retirement and impairment costs, so not purely severance. No employee count disclosed.
2015-12-03restructuringcompletedItalyManufacturingUSD 9 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Charges for restructure of manufacturing activities in Agrate, Italy.
2015-12-03plant_closurecompletedPuerto RicoModule assembly and testUSD 5 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Severance benefits and equipment-related retirement and impairment costs to close facility in Aguadilla, Puerto Rico.
2015-09-03restructuringcompletedUSD 3 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY2015 charges of $3 million comprised a $1 million LED asset impairment and $2 million of other items; no employee count disclosed. The 200mm wind-down (Agrate, Italy; Kiryat Gat, Israel) and workforce optimization charges were recorded in prior fiscal years and are excluded. Filing states no significant additional costs anticipated as of September 3, 2015.
2015-09-03otherannounced2015-03-242016-05United StatesPhotomask manufacturing (MP Mask joint venture with Photronics)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Micron notified Photronics of its election to terminate the MP Mask joint venture effective May 2016, with a right to acquire Photronics' interest. No workforce impact quantified in the filing.
2015-09-03restructuringcompletedGlobalMBU, EBU, and other segmentsUSD 3 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0		Charges associated with workforce optimization activities and winding down 200mm operations in Agrate, Italy and Kiryat Gat, Israel. No specific employee count disclosed for 2015 actions.
2014-12-04restructuringcompletedAgrate, Italy and Kiryat Gat, Israel200mm operationsUSD 22 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Restructuring charges primarily associated with workforce optimization activities and winding down 200mm operations. No specific employee count disclosed.
2014-08-28restructuringin_progressItaly; Israel; globalMBU; EBU; 200mm operations (Agrate, Italy and Kiryat Gat, Israel)USD 40 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY2014 charges of $40M (vs. $126M in FY2013) covering workforce optimization in MBU/EBU and wind-down of 200mm operations; no employees-affected count disclosed. $14M accrued for unpaid workforce optimization activities at year-end; company does not anticipate significant additional costs for these prior activities.
2014-08-28plant_closurein_progressIsrael200mm wafer fabrication operationsItem_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML		In December 2013 the 200mm wafer fabrication equipment in Kiryat Gat was sold to Intel and the facility lease terminated; Intel manufactured wafers for Micron at the site through 2014. Charges are included within the consolidated FY2014 restructure total above; no headcount disclosed.
2014-08-28restructuringcompletedGlobalMBU, EBU, and 200mm operations (Agrate, Italy; Kiryat Gat, Israel)USD 40 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Charges associated with workforce optimization activities and winding down 200mm operations. No specific employee count disclosed.
2014-05-29restructuringin_progressAgrate, Italy and Kiryat Gat, Israel200mm operationsUSD 30 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Wind-down of 200mm operations; approximately $30 million of charges in first nine months of fiscal 2014. Additional employee termination benefit charges of $15-25 million anticipated in Q4 2014 for Italy. No employee count disclosed.
2014-05-29plant_closurein_progressAgrate, Italy; Kiryat Gat, Israel200mm wafer fabrication operationsUSD 30 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Approximately $30 million of other restructure charges in the first nine months of 2014 tied to winding down 200mm operations at the two sites; no employee count disclosed.
2014-05-29restructuringannounced2014-08-28Agrate, Italy200mm wafer fabrication operationsUSD 20 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Filer anticipates $15 million to $25 million of Q4 fiscal 2014 charges for employee termination benefits in Italy; value shown is midpoint of disclosed range. No employee count disclosed.
2014-05-29restructuringin_progress2014-12-31ItalyManufacturingUSD 20 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Filer anticipates incurring restructure charges of $15 million to $25 million in Q4 2014 for employee termination benefits in Italy. Midpoint of range used for value.
2014-05-29restructuringcompletedItaly and IsraelManufacturingUSD 30 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Aggregate of approximately $30 million associated with efforts to wind down 200mm operations in Agrate, Italy and Kiryat Gat, Israel recognized in the first nine months of 2014.
2013-11-28restructuringin_progressUSD 1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Accrued $1 million as of November 28, 2013 for unpaid workforce optimization activities; no significant additional costs anticipated. No employee count disclosed. A global workforce reduction of $17 million in costs was incurred in the prior quarter (Q4 2013).
2013-11-28restructuringin_progressUSD -3 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Filing reports a net gain of $3 million in 'Restructure and asset impairments' for the quarter. Accrued liability for unpaid workforce optimization activities decreased from $12 million to $1 million. No specific employee count affected is disclosed for the current quarter.
2013-08-29acquisition_additioncompleted5,7002012-07-022013-07-31Japan and TaiwanDRAM (DSG and WSG segments)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Approximately 5,700 employees added from the Elpida and Rexchip acquisitions, primarily in Japan and Taiwan; acquisition closed July 31, 2013 (Sponsor Agreement signed July 2, 2012).
2013-08-29divestiture_reductioncompleted5002013ItalyAgrate fabrication facility (ST consortium R&D and manufacturing)USD 26 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Approximately 500 employees transferred to ST when the consortium agreement was restructured; charge primarily from transfers of equipment. Exact announcement date not disclosed.
2013-08-29divestiture_reductioncompleted2013-05-032013-05-03ItalyMicron Technology Italia, S.r.l. — 200mm Avezzano wafer fabrication facilityUSD 62 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Subsidiary and facility sold to LFoundry on May 3, 2013; associated impairment loss of $62 million. Number of employees transferring not disclosed.
2013-08-29restructuringcompleted20132013-08-29GlobalWorkforce optimization across operationsUSD 17 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Severance and other employee-related costs for workforce optimization; part of $126 million total restructure and asset impairment charges for fiscal 2013. Employees affected not disclosed; $12 million remained accrued and unpaid at year-end with no significant additional costs anticipated.
2013-08-29plant_closureannounced2013-09IsraelKiryat Gat 200mm wafer fabrication facilityUSD 14 (millions)subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Agreement entered September 2013 (after fiscal year-end) to sell 200mm equipment in Kiryat Gat to Intel and terminate the facility lease; most Israel employees (approximately 1,000 at year-end) would terminate employment and transfer to Intel. Employees affected not quantified by the filer; $14 million impairment recognized in fiscal 2013.
2013-08-29acquisition_additioncompleted5,7002013-07-312013-07-31Japan and TaiwanDRAM Solutions Group; Wireless Solutions GroupItem_1_Business
f5-10k / Qwen3.6-27B-Q8_0		Acquisition of Elpida and Rexchip added 5,700 employees, primarily located in Japan and Taiwan.
2013-08-29restructuringcompleted2013-09-012014-12-31IsraelManufacturingUSD 14 (millions)Item_1_Business
f5-10k / Qwen3.6-27B-Q8_0		Agreement to sell 200mm wafer fabrication equipment in Kiryat Gat, Israel to Intel. Most employees will terminate employment with Micron and transfer to Intel. $14 million impairment charge recorded.
2013-08-29restructuringcompleted2013-01-012013-12-31GlobalGlobalUSD 126 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Total restructure and asset impairment charges of $126 million recorded in 2013. Includes $12 million accrued but unpaid for workforce optimization as of fiscal year-end.
2013-05-30restructuringcompleted5002013-05-30Agrate, ItalyR&D consortium with STMicroelectronicsUSD 26 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Certain assets and approximately 500 employees from the Agrate, Italy fabrication facility were transferred to ST under a restructured consortium agreement; charge primarily from equipment transfers.
2013-05-30divestiture_reductioncompleted2013-05-032013-05-03Avezzano, ItalyMicron Technology Italia (200mm wafer fabrication)USD 62 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Sold wholly-owned subsidiary MIT including its 200mm wafer fab to LFoundry for consideration valued at $35 million; assets and liabilities written down to fair value in Q2 2013 with a $62 million impairment loss. Headcount transferred not disclosed.
2013-05-30plant_closurecompleted2013-05-30LED operationsUSD 25 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Discontinued LED development activities in Q3 2013; $25 million charge primarily to write down production assets to expected sale proceeds. Employee count not disclosed.
2013-05-30restructuringcompleted5002013-05-302013-05-30ItalyAgrate, Italy fabrication facilityUSD 26 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Approximately 500 employees transferred to ST as part of restructuring the ST consortium agreement at the Agrate facility; charge primarily from equipment transfers.
2013-05-30divestiture_reductioncompleted2013-05-032013-05-03ItalyMicron Technology Italia, S.r.l. (MIT) — 200mm Avezzano wafer fabrication facilityUSD 62 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Sale of MIT subsidiary and its 200mm Avezzano facility to LFoundry; employee count not disclosed. Charge recorded in Q2 2013.
2013-05-30restructuringcompleted2013-05-302013-05-30United StatesLED operationsUSD 25 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Discontinuation of LED development activities in Q3 2013; charge to write down production assets. Employee count not disclosed.
2013-05-30restructuringcompleted5002013-05-302013-05-30ItalyNAND Solutions GroupUSD 26 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Restructure of ST consortium agreement; assets and approximately 500 employees from Agrate, Italy facility transferred to ST.
2013-05-30plant_closurecompleted2013-05-032013-05-03ItalyAll OtherUSD 62 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Sale of Micron Technology Italia, S.r.l. (MIT) and its 200mm wafer fabrication facility in Avezzano to LFoundry. Employee count not explicitly disclosed for this specific divestiture.
2013-05-30restructuringcompleted2013-05-302013-05-30GlobalAll OtherUSD 25 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Discontinuation of LED development activities; write down of production assets. Employee count not explicitly disclosed.
2013-02-28divestiture_reductionannounced2013-02-252013-08-31Avezzano, ItalyAll Other (CMOS image sensors)USD 62 (millions)other
f5-10q / GLM-5.3-flash-fp4-HTML		Agreement to sell MIT including 200mm wafer fab to LFoundry; assets written down to fair value with $62 million estimated impairment loss recorded in other operating expense in Q2 2013; expected to close in Q3 2013. No employee count disclosed.
2013-02-28othercompleted2012-05-01Boise, IdahoTransform Solar (photovoltaic)other
f5-10q / GLM-5.3-flash-fp4-HTML		Transform's board approved a liquidation plan in May 2012; operations substantially discontinued as of August 30, 2012. Micron recognized a $25 million gain in Q1 2013 from termination of Transform's lease of Boise manufacturing facilities. No employee count disclosed.
2013-02-28acquisition_additionannounced2012-07-022014-01-02Japan; TaiwanDRAM (Elpida and Rexchip)other
f5-10q / GLM-5.3-flash-fp4-HTML		Pending acquisition of Elpida (100%) and Rexchip (89%); Japan Court approved reorganization plans February 28, 2013, but certain creditors filed appeals March 29, 2013. No headcount figures disclosed; would add Hiroshima and Taiwan 300mm DRAM fabs.
2012-08-30othercompleted2012-05-252012-08-30Global (solar joint venture operations)Transform Solar Pty Limited (50% joint venture with Origin Energy)USD 69 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Board approved a liquidation plan for the solar joint venture; operations were substantially discontinued by fiscal year-end. No employee count disclosed.
2012-08-30acquisition_additionannounced2012-07-022013-06-30Japan and TaiwanDRAM (Elpida Memory, Inc. and Rexchip Electronics Corporation)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sponsor agreement for 100% of Elpida plus share purchase for ~24% of Rexchip (~89% aggregate); expected to close in first half of calendar 2013. No headcount disclosed; contingent on court, creditor and regulatory approvals including the People's Republic of China.
2012-08-30restructuringcompletedNot specifiedNot specifiedUSD 7 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Fiscal 2012 restructure charge of $7 million; the filing does not describe the underlying program or disclose employees affected.
2012-08-30restructuringin_progressUSD 7,000,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2011-09-01divestiture_reductioncompleted2011-06-022011-06-02JapanWafer fabricationMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Wafer fabrication facility sold to Tower Semiconductor with a supply agreement through approximately May 2014; no employees-affected count or workforce impact disclosed in the filing.
2011-09-01restructuringcompleted2009-01-012010-09-02GlobalManufacturing / ImagingUSD -32 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Restructure plan initiated in 2009 reduced employment by approx 4,600 employees. All amounts related to this plan had been paid as of Sept 2, 2010. 2011 included a credit of $32 million.
2011-09-01restructuringin_progressUSD -21,000,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2011-06-02restructuringcompletedUSD 12 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Restructuring charge of $12 million recorded in Q3 2011. Employee count not disclosed.
2011-06-02restructuringcompletedUSD 25 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Cumulative restructuring charge of $25 million recorded in the first nine months of 2011. Employee count not disclosed.
2011-06-02restructuringin_progressUSD -12,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2011-03-03restructuringcompletedUSD 17 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Restructuring charge of $17 million recorded in Q2 2011. Employee count not disclosed.
2011-03-03restructuringcompletedUSD 13 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Restructuring charge of $13 million recorded in YTD 2011. Employee count not disclosed.
2011-03-03restructuringin_progressUSD -17,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2010-09-02restructuringcompleted20092010-09-02MemoryUSD -10 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY2010 activity only: net credit of $10M (equipment disposition gain $13M credit, severance $1M, other $2M). The associated reduction of approximately 4,600 employees (~20% of workforce) occurred in fiscal 2009 and is not extracted as current-year activity. All plan amounts paid as of September 2, 2010; filer expects no additional material charges.
2010-09-02acquisition_additioncompleted2010-05-072010-05-07Numonyx segmentbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Headcount added through the acquisition is not disclosed. Consideration was 137.7M shares plus 4.8M restricted stock units; Numonyx represented 14% of consolidated assets and 7% of revenues at fiscal year-end. Numonyx excluded from management's internal control assessment.
2010-09-02otherannounced2009-092011-04-30SingaporeMemory — DRAM manufacturing (TECH joint venture)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML		HP notified TECH in September 2009 that it does not intend to extend the joint venture beyond April 2011. Failure to reach resolution could result in sale of TECH's assets (net assets $1.1B; 45% of FY2010 DRAM wafer production) and repayment of TECH's $348M credit facility. No employee count disclosed; no resolution reached as of the filing date.
2010-09-02restructuringcompleted2009-01-012010-09-02GlobalMemoryUSD -10 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Initiated in 2009 primarily within Memory segment. Included shutting down 200mm wafer fabrication facility in Boise and suspending production ramp in Singapore. Net credit of $10 million in 2010. No additional material charges expected.
2010-09-02acquisition_additioncompleted2010-05-072010-05-07GlobalNumonyxItem_1_Business
f5-10k / Qwen3.6-27B-Q8_0		Acquisition of Numonyx Holdings B.V. completed on May 7, 2010. Specific headcount added not disclosed in filing.
2010-06-03acquisition_additioncompleted2010-05-072010-05-07Numonyx segmentUSD 1,112 (millions)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Acquisition of Numonyx completed May 7, 2010; 137.7 million shares and 4.8 million restricted stock units issued, including 4.1 million service-based and 0.7 million performance-based restricted stock awards to Numonyx employees. No employee headcount figure disclosed.
2010-06-03restructuringcompleted2009-01-01Boise, IdahoMemory segmentUSD 1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		2009 restructure plan substantially complete; $1 million severance and related termination benefit payments made in Q3 FY2010, $7 million in first nine months. No employee counts disclosed; no additional material charges expected.
2010-06-03acquisition_additioncompleted2010-05-072010-05-07Global (Numonyx operations, Europe-weighted)Numonyx segment (NOR Flash, NAND Flash, DRAM, Phase Change memory)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Acquisition closed May 7, 2010; new reportable segment created. Headcount added not disclosed; only consideration ($1,112M stock) and net assets acquired ($1,549M) quantified. Transaction costs of $19M in SG&A for the nine-month period.
2010-06-03restructuringcompleted2010-06-03United States (Boise, Idaho); SingaporeMemory segmentUSD -7 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		2009 restructure plan (200mm DRAM phase-out in Boise, IM Flash Singapore ramp suspension) generated a net credit of $7M for the nine months ended June 3, 2010. Filing states all plan amounts were paid as of June 3, 2010 and no further material charges are expected. No employee counts disclosed.
2010-06-03restructuringcompleted2009-01-012010-06-03GlobalMemoryUSD -5 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		2009 restructure plan initiated in response to industry downturn. Q3 2010 shows net credit of $5M. All amounts paid as of June 3, 2010. Employee count not disclosed.
2010-06-03acquisition_additioncompleted2010-05-072010-05-07GlobalNumonyxbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0		Acquired Numonyx on May 7, 2010. Issued 4.8 million restricted stock units to employees. Total headcount added not explicitly disclosed.
2010-03-04restructuringin_progress2009-01-01Boise, Idaho, United StatesMemoryUSD -1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		2009 restructure plan included shutdown of 200mm manufacturing operations in Boise; no employee counts disclosed. Q2 FY2010 net restructure credit of $1 million; six-month net credit of $2 million. Company does not expect additional material restructure charges under this plan.
2010-03-04plant_closurecompletedBoise, Idaho, United StatesMemory (DRAM manufacturing)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Phased out all remaining 200mm DRAM wafer manufacturing operations in Boise, Idaho in the second half of 2009; no employee count disclosed in this filing.
2010-03-04restructuringcompletedBoise, Idaho, United StatesMemory (NAND Flash manufacturing)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		IM Flash terminated its NAND Flash supply agreement with Micron's Boise facility in Q1 2009; production shut down beginning Q2 2009. No employee count disclosed.
2010-03-04restructuringcompletedSingaporeMemory (NAND Flash manufacturing)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Tooling and NAND Flash production ramp at IM Flash Singapore wafer fab suspended in Q1 2009; start-up activities resumed in Q2 2010. No employee count disclosed.
2010-03-04acquisition_additionannounced2010-02-09GlobalMemory (NOR Flash, NAND Flash, RAM, Phase Change memory)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Definitive agreement to acquire Numonyx for 140-150 million Micron shares; expected to close in Q3 or Q4 2010. No headcount figure disclosed.
2010-03-04restructuringin_progress2009-01-01Boise, IdahoMemoryUSD -1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Initiated in 2009 to shut down 200mm manufacturing operations. Q2 2010 charge of $(1)M primarily reflects gain on equipment write-down. No employee count disclosed for current period activity.
2009-12-03restructuringin_progressUnited States (Boise, Idaho); SingaporeMemoryUSD 1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Restructure plan initiated in 2009 in response to industry downturn; included shutdown of 200mm DRAM production in Boise and suspension of NAND ramp at IM Flash Singapore. Q1 FY2010 net restructure credit of $1 million, including $1 million severance and termination benefits; $5 million cash paid for severance and facility decommissioning. Company does not expect additional material charges. No employee counts disclosed.
2009-12-03restructuringin_progressUnited States; SingaporeMemoryUSD -1 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Plan initiated in 2009 in response to industry downturn; Q1 2010 net credit of $1M (severance $1M, equipment write-down gain $4M, other $2M). No employee counts disclosed. Company states no additional material charges expected.
2009-12-03restructuringin_progressMemoryUSD -1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Net credit of $1 million recognized in Q1 2010. Includes $1 million in severance and other termination benefits. Company does not expect to incur additional material restructure charges related to the plan initiated in 2009.
2009-12-03restructuringin_progressUSD -1,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2009-09-03restructuringin_progress4,60020%Global (principally United States and Singapore)MemoryUSD 70 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Fiscal 2009 net restructure charges of $70 million comprise $152 million equipment write-down, $60 million severance and other employee costs, a $144 million gain from termination of the IM Flash NAND supply agreement, and $2 million other. Specific announcement date and completion date not disclosed; filer expects approximately $2 million of additional restructure costs in 2010. Implied pre-restructuring workforce of roughly 22,800 is consistent with the disclosed 18,200 year-end total.
2009-09-03plant_closurecompletedBoise, Idaho, United StatesMemoryrestructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		IM Flash terminated its NAND supply agreement with the Boise facility in Q1 FY2009 (reducing NAND output by about 35,000 200mm wafers per month; Intel paid the Company $208 million), and all remaining 200mm DRAM wafer manufacturing in Boise was phased out in the second half of FY2009. Associated $152 million equipment impairment is included within the $70 million net restructure charge of the consolidated restructuring record above; headcount impact likewise included in the 4,600 total, so not separately quantified.
2009-09-03divestiture_reductioncompleted2009-07-102009-07-10Imagingother
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sale of a 65% interest in Aptina Imaging Corporation to Riverwood Capital and TPG Capital, with the Company retaining a 35% interest; Company recorded a $41 million loss on the sale (not a workforce charge). Headcount transferred with the divested interest was not disclosed. Imaging segment continues to supply wafers to Aptina under a wafer supply agreement.
2009-09-03restructuringcompleted4,60020%2009-01-012009-09-03GlobalMemoryUSD 70 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Initiated in response to severe downturn. Includes shutdown of 200mm Boise facility, suspension of IM Flash Singapore ramp, and personnel reductions. Net charge of $70 million includes $152 million equipment write-down, $60 million severance, offset by $144 million gain from IM Flash supply agreement termination.
2009-06-04restructuringin_progress2009-01-012009-12-31Boise, Idaho, United StatesMemoryUSD 58 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		2009 restructure plans primarily attributable to Memory segment; nine-month charges of $58 million include $150 million equipment write-down and $50 million severance, offset by a $144 million gain from termination of the NAND Flash supply agreement. Company expects approximately $7 million of additional restructure costs through end of 2009, primarily severance and employee-related costs. No employee counts disclosed.
2009-06-04plant_closurein_progress2009-01-012009-12-31Boise, Idaho, United StatesMemory — NAND FlashUSD 150 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Company announced it would phase out all remaining 200mm wafer manufacturing operations at its Boise, Idaho facility by end of 2009; impairment charges of $7 million (Q3) and $150 million (nine months) recorded for the shutdown. Assets with carrying value of $27 million classified as held for sale. No employee counts disclosed.
2009-06-04restructuringcompleted2009-01-01Boise, Idaho, United StatesMemory — NAND FlashUSD 144 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		In Q1 2009, IM Flash joint venture with Intel terminated its agreement to obtain NAND Flash supply from the Boise facility, reducing NAND production by approximately 35,000 200mm wafers per month. Company recorded a $144 million gain and a $208 million receivable from Intel, settled in Q2 2009. No employee counts disclosed.
2009-06-04divestiture_reductionannounced2009-07-102009-07-10Imaging — Aptina Imaging CorporationUSD 53 (millions)subsequent_events
f5-10q / GLM-5.3-flash-fp4-HTML		On July 10, 2009 (subsequent event), the Company sold a 65% interest in Aptina to Riverwood Capital and TPG Capital for approximately $35 million cash, retaining a 35% stake to be accounted for under the equity method. Q3 charge of $53 million to write down Aptina intangible assets and property, plant and equipment to estimated fair values. No employee counts disclosed.
2009-06-04otherin_progress2009-01-01Company-wideMD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Cost reduction measures include reductions in executive and employee salary and bonuses, a continued hiring freeze, suspension of 401(k) matching contributions, and reductions of discretionary costs such as outside services, travel and overtime. No employee counts disclosed.
2009-06-04plant_closurein_progress2009-03-052009-12-31Boise, Idaho, United StatesMemory segment — 200mm wafer manufacturingUSD 150 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Nine-month equipment write-down of $150M plus $50M severance; employee count not disclosed. Company expects ~$7M additional costs through end of 2009.
2009-06-04restructuringin_progress2009-03-052009-12-31United StatesMemory segmentUSD 50 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Severance accrual for nine months ended 2009-06-04; $51M cash paid, $7M unpaid at period end. Employee counts not disclosed.
2009-06-04divestiture_reductionannounced2009-07-10GlobalImaging segment — Aptina Imaging CorporationUSD 53 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Sale of 65% interest in Aptina; $53M write-down recorded in Q3. Headcount impact not quantified.
2009-06-04restructuringin_progress2009-04-012009-12-31Boise, IdahoMemoryUSD 19 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Phase out of 200mm wafer manufacturing operations at Boise facility. Q3 charges of $19M include $7M equipment write-down and $11M severance. Total YTD charges $58M.
2009-06-04restructuringcompleted2009-01-012009-03-31GlobalMemoryrestructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Termination of NAND Flash supply agreement with IM Flash and suspension of tooling at IM Flash Singapore facility. Resulted in $144M gain in Q1 2009.
2009-03-05plant_closurein_progress2,0002009-02-232009-12-31Boise, Idaho, United StatesMemoryUSD 143 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Phase-out of all remaining 200mm wafer manufacturing at Boise facility, reducing employment by as many as 2,000 positions by end of 2009. Six-month charges include $143 million equipment write-downs and $39 million severance; additional ~$27 million of severance-related costs expected through 2009.
2009-03-05restructuringin_progress2009-02-232009-12-31Boise, Idaho, United StatesMemory — severance and termination benefitsUSD 17 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Second quarter 2009 severance and other termination benefit charges; $16 million of severance cash payments made during the quarter.
2009-03-05restructuringcompleted2008-12-05Boise, Idaho, United StatesMemory — NAND Flash supply agreement terminationUSD -144 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		IM Flash terminated agreement for NAND Flash supply from Boise facility, reducing NAND production by approximately 35,000 200mm wafers per month; first quarter net credit includes $144 million gain from termination, plus $56 million equipment write-down and $22 million severance charges.
2009-03-05restructuringin_progress2008-12-05SingaporeMemory — IM Flash Singapore facilityrestructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Company and Intel agreed to suspend tooling and ramp of NAND Flash production at IM Flash's Singapore wafer fabrication facility; facility idle since completion in Q1 2009 with net book value of $640 million as of March 5, 2009.
2009-03-05plant_closurein_progress2,0002009-02-232009-12-31Boise, Idaho, United StatesMemory segment — 200mm wafer manufacturing operationsUSD 105 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Phase-out of all remaining 200mm wafer manufacturing at Boise; up to 2,000 positions to be eliminated by end of 2009. Q2 charge of $105M includes $87M equipment write-down and $17M severance. Additional ~$27M of severance-type costs expected through 2009.
2009-03-05restructuringin_progress2008-12-052009-12-31Boise, Idaho, United StatesMemory segment — NAND Flash production for IM Flashrestructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		IM Flash terminated NAND supply agreement with Boise facility in Q1 2009, reducing NAND production by ~35,000 200mm wafers/month. Q1 restructure recorded a net $66M credit including a $144M gain from the termination. No employee count disclosed for this sub-component.
2009-03-05otherin_progress2008-12-05GlobalCompany-wideMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Cost reductions include executive/employee salary and bonus cuts, hiring freeze, suspension of 401(k) match, and reduced discretionary spending. No headcount figure attached.
2009-03-05restructuringin_progress2,0002009-02-232009-12-31Boise, IdahoMemoryUSD 105 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Phase out of 200mm wafer manufacturing operations; charge includes $87M equipment write-down and $17M severance.
2008-12-04plant_closurecompleted2008-10-09Boise, IdahoMemory (NAND Flash)USD 56 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Discontinued NAND Flash production for IM Flash at Boise fab, reducing NAND output by approximately 35,000 200mm wafers per month; no employee count disclosed. Equipment write-down of $56 million recorded.
2008-12-04restructuringin_progress2008-10-092010-12-31SingaporeMemory (NAND Flash) - IM Flash Singaporerestructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Micron and Intel agreed to suspend tooling and ramp of production at IM Flash's Singapore wafer fabrication facility; no employee count disclosed.
2008-12-04restructuringin_progress2008-10-092010-12-31MemoryUSD 22 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Restructuring of memory operations included severance and other termination benefits of $22 million; number of employees affected not disclosed. Additional restructure costs of approximately $40 million expected through 2010.
2008-12-04otherin_progress2008-10-09Company-wideMD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Cost-savings measures: reductions in executive and employee salary and bonuses, continued hiring freeze, and reduced discretionary spending on outside services, travel and overtime.
2008-12-04restructuringin_progress2008-10-092010-12-31GlobalMemoryUSD 66 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Net credit includes $144M gain from NAND supply agreement termination, $56M equipment write-down, $22M severance. No employee headcount disclosed. Includes salary/bonus reductions, hiring freeze, discretionary cost cuts. Additional ~$40M costs expected through 2010.
2008-12-04plant_closurecompleted2008-10-092008-12-04United States (Boise, Idaho)Memory — NAND Flashrestructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Discontinued NAND Flash production for IM Flash at Boise facility, reducing production by ~35,000 200mm wafers per month. No employee count disclosed.
2008-12-04plant_closurein_progress2008-10-09SingaporeMemory — NAND Flash (IM Flash JV)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Micron and Intel agreed to suspend tooling and production ramp at IM Flash Singapore wafer fabrication facility. No employee count disclosed.
2008-12-04restructuringin_progress2008-10-092010-12-31GlobalMemoryUSD 22 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Company announced restructuring of memory operations on Oct 9, 2008. Q1 2009 included $22M severance and termination benefits. Total restructure credit was $66M (including $144M gain on NAND supply agreement termination and $56M equipment write-down). Expected to incur additional restructure costs of approx $40M through 2010.
2008-08-28restructuringin_progressGlobalPrimarily Memory segmentUSD 33 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Cost-reduction initiatives begun in Q4 2007 covering severance, relocation, retention bonuses and facility write-downs; $33M charged in FY2008, $52M cumulative since initiation. No employee count disclosed.
2008-08-28restructuringannounced15%2008-10-092010-12-31GlobalMemory operations (IM Flash NAND Flash)USD 60 (millions)subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Post-fiscal-year-end announcement: plan to cut global workforce about 15% during 2009-2010, including IM Flash shutdown of 200mm NAND production at Boise (about 35,000 wafers/month) and suspension of tooling/ramp at IM Flash Singapore. Cash restructuring costs about $60M; expected 2009 cash operating benefit to exceed $175M.
2008-08-28restructuringin_progress2007-10-01GlobalMemoryUSD 33 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Initiated in Q4 2007. 2008 charges of $33 million for severance, relocation, retention bonuses, and facility write-downs. Cumulative costs since initiation are $52 million.
2008-08-28restructuringannounced15%2008-10-092010-12-31GlobalMemoryUSD 60 (millions)subsequent_events
f5-10k / Qwen3.6-27B-Q8_0		Announced after fiscal year-end. Plans to reduce global workforce by approx 15% during 2009 and 2010. Includes shutdown of 200mm NAND flash production at Boise and suspension of tooling at IM Flash Singapore.
2008-05-29restructuringin_progress2007-11-30Primarily Memory segmentUSD 8 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Cost-reduction initiatives begun in Q4 FY2007 include workforce reductions, facility write-downs, and relocation/retention bonuses; $8M charge in Q3 FY2008, $29M in first nine months, $48M cumulative since Q4 FY2007. Employee counts not disclosed.
2008-05-29restructuringin_progress2007-10-01GlobalPrimarily Memory segmentUSD 8 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Restructuring initiatives began in Q4 FY2007 covering workforce reductions, facility write-downs, relocation and retention bonuses. No employee count disclosed. Cumulative charges of $48 million since Q4 FY2007; $8 million remained unpaid at quarter-end.
2008-05-29restructuringin_progress2007-10-01Memory segmentUSD 8 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Charges recorded in Q3 2008 for employee severance, facility write-downs, and relocation/retention bonuses. Program initiated in Q4 2007.
2008-05-29restructuringin_progress2007-10-01Memory segmentUSD 29 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Cumulative charges for the nine months ended May 29, 2008, for employee severance, facility write-downs, and relocation/retention bonuses.
2008-02-28restructuringin_progress2007-10-01Primarily Memory segmentUSD 8 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Cost-reduction initiatives begun in Q4 FY2007 include workforce reductions, relocation of operations, and overhead reductions; Q2 FY2008 charge of $8 million for employee severance and facility write-downs; $21 million charged in first six months; $40 million cumulative since Q4 FY2007; no employee counts disclosed.
2008-02-28restructuringin_progress2007-08-31GlobalPrimarily Memory segmentUSD 8 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Cost-reduction program begun in Q4 2007 covering workforce reductions, relocation and overhead cuts; $8M charged in Q2 2008, $21M in six months, $40M cumulative since Q4 2007. Number of employees affected not disclosed; initiatives expected to be implemented over several quarters.
2008-02-28restructuringin_progress2007-10-01MemoryUSD 8 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Charges primarily for employee severance and related costs and facility write-downs. Program initiated in Q4 2007.
2008-02-28restructuringin_progress2007-10-01MemoryUSD 21 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		YTD charges for the first six months of 2008. Program initiated in Q4 2007.
2007-11-29restructuringin_progress2007-11-292008-08-28Primarily Memory segmentUSD 13 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Cost-reduction initiatives begun in Q4 2007 include workforce reductions, relocating operations closer to customers, outsourcing evaluations, and overhead reductions; charge covers employee severance and related costs plus a write-down of facilities expected to be sold. $4 million of restructure costs remained unpaid at quarter-end. Company expects additional restructure charges through end of fiscal 2008 but cannot estimate the aggregate amount.
2007-11-29restructuringin_progressGlobalPrimarily Memory segmentUSD 13 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Cost-reduction program begun in Q4 2007 covering workforce reductions, relocation, outsourcing and overhead cuts; Q1 2008 charge covers severance and facility write-downs. No employee count disclosed; $4 million of costs remained unpaid at quarter-end; further charges expected through end of 2008 but amount not estimable.
2007-11-29restructuringin_progress2007-10-012008-08-31GlobalMemoryUSD 13 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Initiatives began in Q4 2007 to reduce costs via workforce reductions, outsourcing, and relocation. Q1 2008 charge includes severance and facility write-downs. Completion expected through end of 2008.
2007-08-30restructuringin_progress1,0002008-12-31MemoryUSD 19 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Charge recorded in fourth quarter of fiscal 2007, primarily employee severance for a workforce reduction of approximately 1,000 employees, mostly from the Memory segment; program continues through 2008 with further charges expected but not yet estimable. Announcement date not specified beyond 'fourth quarter of 2007'.
2007-08-30acquisition_additioncompleted2006-12-112006-12-11Imagingbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Acquisition of Avago's CMOS image sensor business completed 2006-12-11 for initial cash payment of $53 million plus contingent consideration; associated headcount added not disclosed.
2007-08-30restructuringcompleted1,0002007-06-01GlobalMemoryUSD 19 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0		Fourth quarter 2007 charge of $19 million consisting primarily of employee severance and related costs resulting from a reduction in workforce of approximately 1,000 employees, primarily from the Memory segment.
2007-05-31restructuringannounced2007-06-28Company-widesubsequent_events
f5-10q / GLM-5.3-flash-fp4-HTML		Company announced cost-efficiency and revenue-growth initiatives including workforce reductions in certain areas as the business is realigned; no employee counts, charges, or completion dates disclosed. Implementation anticipated over several quarters.
2007-05-31restructuringannounced2007-06-28GlobalCertain areas of the Company as business is realignedsubsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Post-quarter announcement of cost-efficiency initiatives including workforce reductions, relocating operations closer to customers, evaluating outsourcing partnerships, and reducing overhead; to be implemented over several quarters. No employee count or charge disclosed.
2007-05-31restructuringannounced2007-06-28GlobalVarioussubsequent_events
f5-10q / Qwen3.6-27B-Q8_0		Company announced initiatives to drive cost efficiencies including workforce reductions in certain areas as business is realigned. Specific headcount numbers not disclosed.
2006-08-31acquisition_additioncompleted300United StatesMemoryUSD 886 (millions)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Stock-for-stock merger completed 2006-06-21; approximately 300 employees added in Q4 2006. Charge shown is the aggregate purchase price, not a severance charge. Definitive merger agreement announced in March 2006; exact announcement date not disclosed.
2006-08-31othercompleted2,4002006-03-03SingaporeMemoryMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Consolidation of the TECH joint venture under FIN 46(R) effective 2006-03-03 added approximately 2,400 Singapore-based employees to consolidated headcount; not an acquisition or headcount action per se.
2006-08-31acquisition_additioncompleted3002006-06-212006-06-21GlobalMemoryItem_1_Business
f5-10k / Qwen3.6-27B-Q8_0		Added approximately 300 employees from acquisition of Lexar Media, Inc. in the fourth quarter of 2006.
2006-06-01acquisition_additioncompleted2006-06-21United StatesMemory (Flash memory products)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Stock-for-stock merger completed 2006-06-21, after quarter end; approximately 50 million Micron shares issued and Lexar options converted into options for approximately 7 million shares (combined value ~$900 million). Filing does not disclose Lexar employee headcount added. Definitive agreement announced in March 2006 (exact date not stated).
2006-03-02acquisition_additionannounced2006-03-08United StatesMemory (Flash memory products)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Post-quarter-end merger agreement (0.5625 Micron shares per Lexar share); no employee count disclosed. Lexar had ~81 million shares outstanding as of 2005-12-31; Lexar termination fee $22.0 million.
2005-09-01restructuringcompleted2003-06-302004-12-31WorldwideManufacturing and CorporateUSD 109 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		2003 restructure plan included shutdown of 200mm production line in Virginia, discontinuance of SRAM/TCAM products, and approximate 10% reduction in worldwide workforce. Plan substantially completed and costs paid in 2004 and 2003. Net credit of $1.4 million recorded in 2005 from equipment sales.
2005-06-02restructuringcompleted2003-04-01WorldwideManufacturing, R&D, G&Arestructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Plan announced in Q2 2003 included shutdown of 200mm Virginia line, discontinuance of SRAM/TCAM, and ~10% workforce reduction. Substantially completed; severance paid through Sept 2004. Q3 2005 restructure charge was $0.
2005-03-03restructuringcompleted2003-04-012004-09-02WorldwideManufacturing, R&D, G&AUSD -1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Plan announced in Q2 2003 included shutdown of 200mm Virginia line, discontinuance of SRAM/TCAM, and ~10% workforce reduction. Substantially completed by Sept 2, 2004. YTD 2005 charge of $(1.4)M reflects sales of equipment associated with the Virginia line.
2004-12-02restructuringcompleted10%2003-01-01WorldwideSemiconductor Operationsrestructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		2003 cost-reduction plan: shutdown of 200mm Virginia production line, discontinuance of SRAM and TCAM products, and roughly 10% worldwide workforce reduction. Company states plan substantially completed and severance and termination costs essentially paid through September 2, 2004. Q1 FY2005 restructure line was a $1.5 million credit from equipment sales tied to the Virginia 200mm line.
2004-12-02restructuringcompleted2003-06-012004-09-02WorldwideManufacturingUSD -2 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Plan announced Q2 2003 included shutdown of 200mm Virginia line, discontinuance of SRAM/TCAM, and ~10% workforce reduction. Substantially completed by Sept 2, 2004. Q1 2005 credit of $1.5M reflects equipment sales.
2004-09-02restructuringcompleted2004-09-02WorldwideSemiconductor OperationsUSD -23 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Plan announced in Q2 fiscal 2003 (shutdown of Virginia 200mm line, discontinuance of SRAM/TCAM products, ~10% worldwide workforce reduction); fiscal 2004 activity reflects completion, with a $22.5M credit primarily from gains on equipment sales and essentially all severance paid through fiscal year-end. Employees-affected count relates to the prior-year announcement and is not restated here.
2004-09-02restructuringcompleted10%2003-04-012004-09-02WorldwideUSD 116 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Announced in Q2 2003. Included shutdown of 200mm production line in Virginia, discontinuance of SRAM/TCAM products, and approx 10% workforce reduction. Company substantially completed plan through Sept 2, 2004. Total charges $116.3M in 2003; credit of $22.5M in 2004 primarily from equipment sales gains.
2004-06-03restructuringcompleted2003-04-01WorldwideOperationsUSD -22 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Credit reflects gains on sales of equipment associated with operations shut down in the restructure plan announced in Q2 2003. The plan included shutdown of Virginia 200mm line, discontinuance of SRAM/TCAM products, and approx 10% workforce reduction. Company states it has substantially completed the plan.
2004-03-04restructuringcompleted10%2003-02-27WorldwideSemiconductor OperationsUSD 108 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Plan announced in Q2 FY2003 included shutdown of the 200 mm production line in Virginia, discontinuance of certain memory products (SRAM, TCAM), and an approximate 10% worldwide workforce reduction. Severance and other termination benefits component was $25.5 million; total restructure charge $107.9 million plus $7.8 million inventory write-down charges in COGS. Through March 4, 2004, essentially all accrued costs had been paid; residual equipment sales may produce future gains/losses.
2004-03-04restructuringin_progressWorldwide (includes Virginia 200 mm production line shutdown)Semiconductor Operations (memory product lines, incl. SRAM and TCAM discontinuance)USD 108 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Plan announced in fiscal Q2 2003 (exact date not stated); included shutdown of Virginia 200 mm line, discontinuance of SRAM/TCAM products, and an approximate 10% worldwide workforce reduction. No employee count disclosed. $107.9M charge plus $7.8M related charges recorded in fiscal Q2 2003; current-period (first six months of fiscal 2004) activity was a $21.2M credit from equipment sale gains. Filer states essentially all accrued costs paid and plan substantially completed.
2004-03-04restructuringcompleted2003-02-27WorldwideOperationsUSD 108 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Plan announced in Q2 2003 included shutdown of Virginia 200 mm line, discontinuance of SRAM/TCAM products, and approx 10% workforce reduction. Company states it has paid essentially all costs accrued as of March 4, 2004.
2003-12-04restructuringcompleted10%Worldwide; Virginia facility shutdownSemiconductor Operations; SRAM and TCAM product lines discontinuedUSD -21 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Plan announced in Q2 fiscal 2003; included shutdown of 200 mm production line in Virginia, discontinuance of certain memory products, and approximately 10% worldwide workforce reduction. Substantially completed; Q1 FY2004 reflects a $21.1 million credit primarily from equipment sales. Exact announcement date not stated in this filing.
2003-12-04restructuringin_progress10%Worldwide (includes shutdown of 200 mm production line in Virginia)Semiconductor Operations — includes discontinuance of SRAM and TCAM productsrestructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Program announced in fiscal Q2 2003 (exact announcement date not stated in this filing); called for shutdown of Virginia 200 mm line, discontinuance of SRAM/TCAM products, and an approximate 10% reduction of worldwide workforce; no absolute employee count disclosed. Substantially complete, but residual equipment sales continue to generate gains/losses; Q1 FY2004 recorded a $21.1 million credit to restructure, primarily from equipment sales, not severance.
2003-12-04restructuringin_progress10%2003-06-30WorldwideOperationsUSD -21 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Plan announced in Q2 2003 included shutdown of Virginia 200 mm line, discontinuance of SRAM/TCAM products, and approx 10% workforce reduction. Q1 2004 recorded $21.1M credit primarily from equipment sales. Company substantially completed plan but expects future gains/losses on residual equipment sales.
2003-08-28restructuringcompleted10%2003-02-182003-08-28WorldwideSemiconductor Operations (DRAM, SRAM, TCAM)USD 116 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Program comprised shutdown of the 200 mm wafer fabrication line in Virginia, discontinuance of SRAM and TCAM product lines, and an approximate 10% reduction of worldwide workforce. Charge of $109.2M restructure charge plus $7.1M inventory write-downs; severance and termination benefits of $26.3M. Substantially completed by fiscal year-end; $3.1M of accrued costs remained. Company expects annualized cost savings in excess of $250 million.
2003-08-28plant_closurecompleted2003-02-182003-08-28United States (Virginia)200 mm wafer fabricationUSD 43 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Impairment charge to write down carrying value of certain assets used in the 200 mm production line in Virginia, shut down as part of the same restructuring program; component of the $116.3M total program charge, not additive.
2003-08-28restructuringcompleted10%2003-02-18WorldwideUSD 116 (millions)Item_1_Business
f5-10k / Qwen3.6-27B-Q8_0		Announced Feb 18, 2003. Included shutdown of 200mm wafer fab in Virginia, discontinuance of SRAM/TCAM products, and approx 10% reduction in worldwide workforce. Total restructure and other charges of $116.3 million recorded. Company has substantially completed the restructure plan.
2003-05-29restructuringin_progress10%2003-02-182003-12-31WorldwideCompany-wideUSD 103 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Plan includes shutdown of Virginia 200 mm production line, discontinuance of SRAM and TCAM products, and 10% worldwide workforce reduction; cumulative charge of $102.5 million in first nine months of 2003 plus $7.1 million inventory write-downs in cost of goods sold; company expects to substantially complete by end of 2003 with approximately $15 million additional charges, primarily for equipment redeployment from Virginia; expected annualized cost savings in excess of $250 million; severance and termination benefits component of $26.2 million, of which $25.4 million paid through May 29, 2003.
2003-05-29plant_closurein_progress2003-02-182003-12-31Virginia, United StatesSemiconductor Operations - 200 mm production lineUSD 45 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Shutdown of 200 mm production line in Virginia as part of restructure plan; $44.6 million impairment charge to write down carrying value of assets, primarily equipment write-down component of the restructure charge; assets held for sale included in other assets.
2003-05-29restructuringin_progress10%2003-02-182003-12-31WorldwideSemiconductor OperationsUSD 103 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Plan announced Feb 18, 2003: 10% workforce reduction, shutdown of 200 mm Virginia line, discontinuance of SRAM/TCAM products. Cumulative restructure charge $102.5M (incl. $26.2M severance) plus $7.1M inventory write-down in COGS; additional ~$15M expected. No absolute employee count disclosed; annualized cost savings expected to exceed $250M.
2003-05-29restructuringin_progress10%2003-02-182003-12-31WorldwideSemiconductor OperationsUSD 103 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Plan includes shutdown of 200 mm production line in Virginia, discontinuance of SRAM/TCAM products, and 10% workforce reduction. Total restructure charge $102.5M for nine months ended May 29, 2003. Additional charges of approx $15M expected.
2003-02-27restructuringin_progress10%2003-02-182003-12-31WorldwideCompany-wide; includes shutdown of 200 mm production line in Virginia and discontinuance of SRAM and TCAM productsUSD 108 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Plan includes Virginia 200 mm fab shutdown, product-line discontinuance, and a 10% worldwide workforce reduction. Severance and other termination benefits component of the charge was $25.5 million; essentially none of the severance had been paid as of February 27, 2003, with $30.0 million accrued in accounts payable and accrued expenses. Company expects approximately $15 million of additional restructure-related charges in the second half of 2003 and annualized cost savings in excess of $250 million.
2003-02-27restructuringin_progress10%2003-02-182003-12-31Worldwide (includes shutdown of 200 mm production line in Virginia, USA)Semiconductor Operations; includes discontinuance of SRAM and TCAM product linesUSD 108 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Plan announced Feb 18, 2003 after eight consecutive quarters of operating losses: Virginia 200 mm line shutdown, product discontinuances, 10% worldwide workforce reduction. Charge components: equipment write-down $53.9M, severance $25.5M, intangible write-down $18.6M, other $9.9M; plus $7.8M inventory write-down in COGS. No absolute headcount disclosed. Essentially none of severance paid through quarter-end; $30.0M accrued in accounts payable. Additional ~$15M charges expected in H2 2003; annualized cost savings expected to exceed $250M.
2003-02-27restructuringin_progress10%2003-02-182003-12-31WorldwideSemiconductor OperationsUSD 108 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Includes shutdown of 200 mm Virginia line, discontinuance of SRAM/TCAM products, and 10% workforce reduction. Severance accrual of $25.5M included in charge. Employee count not explicitly disclosed, only percentage.
2002-08-29acquisition_additioncompleted2002-04-22United States (Virginia)Semiconductor Operations (DRAM manufacturing)USD 328 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Acquisition of substantially all assets of Toshiba's DRAM operations at Dominion Semiconductor L.L.C.; purchase price $327.9M including cash and 1.5M shares. Headcount added not disclosed.
2002-08-29divestiture_reductioncompletedUnited StatesPC Operations (discontinued)discontinued_operations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		MEI completed disposition of its PC business on May 31, 2001 (fiscal 2001); referenced in FY2002 statements as discontinued operations. Headcount removed not disclosed; action occurred in prior fiscal year.
2002-05-30acquisition_additioncompleted1,0002002-04-22Virginia, United StatesSemiconductor Operations (DRAM)USD 328 (millions)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Acquisition of substantially all assets of Toshiba's DRAM business at Dominion Semiconductor; approximately 1,000 people employed at the acquired facility. Charge is the total purchase price, not a severance charge.
2002-05-30acquisition_additioncompleted1,0002002-04-22Virginia, United StatesSemiconductor OperationsMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Approximately 1,000 employees at the acquired Dominion Semiconductor (Toshiba DRAM) facility; headcount figure is approximate as stated by filer.
2002-05-30acquisition_additioncompleted1,0002002-04-22VirginiaSemiconductor Operationsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0		Acquired substantially all assets of Toshiba's DRAM business; approximately 1,000 people employed at the acquired facility.
2001-08-30divestiture_reductioncompleted2001-05-31United StatesPC Operations (Micron Electronics, Inc.)discontinued_operations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		MEI completed disposition of its PC business to Gores Technology Group on May 31, 2001; no employee count disclosed for the divested operations.
2001-08-30acquisition_additioncompleted2001-04-30JapanSemiconductor Operationsbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Acquisition of Kobe Steel's 75% interest in KMT Semiconductor Limited made KMT a wholly-owned subsidiary; no headcount added is disclosed.
2001-08-30othercompleted2001-08-06United StatesWeb-hosting Operations (Micron Electronics / Interland)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Interland Merger reduced the Company's ownership of MEI from 61% to 43%, deconsolidating the Web-hosting Operations; no workforce impact quantified.
2001-03-01divestiture_reductionannounced2001-03-232001-08-31United StatesPC operations (Micron Electronics, Inc.)USD 55 (millions)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Non-binding letter of intent to sell MEI's PC business; no employee count disclosed. Charge reflects estimated net loss on disposal including phase-out operating losses.
2001-03-01acquisition_additionannounced2001-03-012001-04-30JapanSemiconductor operations (KMT Semiconductor Limited)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Agreement to acquire Kobe Steel's 75% interest in KMT for $25 million; KMT becomes wholly-owned subsidiary. No headcount disclosed; MTI expected to repay/assume/refinance ~$300M of KMT debt.
2001-03-01otherannounced2001-03-232001-08-31United StatesWeb-hosting operations (Micron Electronics, Inc.)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Stock-for-stock merger with Interland; MTI's stake in MEI falls from ~60% to ~40%, so MEI will be deconsolidated and equity-accounted. Estimated ~$15 million loss on consummation; no headcount disclosed.
1999-09-02acquisition_additioncompleted1998-06-181998-09-30Italy, Singapore, United States (Texas)Semiconductor operationsbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Acquired Avezzano Italy fab, Singapore assembly/test facility, Richardson TX design center, and interests in TECH and KMT joint ventures; headcount added not disclosed; net purchase price approximately $832.8 million
1999-09-02acquisition_additioncompleted1998-06-221998-09-11United StatesSemiconductor operations (graphics/technology)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Pooling-of-interests merger; approximately 3.6 million shares issued; headcount added not disclosed
1999-09-02divestiture_reductioncompleted1999-05-191999-05-19United StatesFlat panel display operationsUSD 15 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Sale of certain flat panel display assets; $15.0 million loss recorded; headcount removed not disclosed
1999-09-02restructuringcompleted1999-09-021999-09-02United StatesRFID operations (Micron Communications, Inc.)USD 9 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Fourth quarter of fiscal 1999: RFID subsidiary ceased operations; $8.9 million charge; headcount affected not disclosed
1999-09-02othercompleted1999-09-021999-09-02United StatesSemiconductor operations (equipment)USD 12 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Loss on write-down and disposal of semiconductor equipment; workforce impact not disclosed
1999-09-02restructuringcompleted1999-09-02GlobalPC operationsUSD 11 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Charges associated with PC operations resulting from employee termination benefits and consolidation of domestic and international operations.
1999-09-02plant_closurecompleted1999-09-02GlobalAll other (RFID)USD 9 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Charge resulting from the discontinuation of the Company's RFID efforts; subsidiary Micron Communications, Inc. ceased operations.
1999-06-03plant_closureannounced1999-06-031999-12-31United StatesRadio Frequency Identification (RFID) development — Micron Communications, Inc.USD 11 (millions)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Company decided post-quarter to discontinue RFID development; majority-owned subsidiary Micron Communications, Inc. expected to cease operations in Q4 FY1999 with a pre-tax charge of $9–12 million. No employee count disclosed.
1999-06-03restructuringcompletedSemiconductor memory operationsUSD 13 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Net loss from write down and disposal of semiconductor memory operations equipment in Q3 1999.
1999-06-03restructuringcompletedFlat panel displayUSD 15 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Charge to write down certain flat panel display assets in Q2 1999.
1999-06-03othercompletedCorporateUSD -5 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Reduction in employee benefit accruals in Q3 1999.
1999-06-03othercompletedCorporateUSD -5 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Gain from cancellation of a compensation program in Q2 1999.
1999-06-03restructuringannounced1999-06-031999-12-31RFID developmentUSD 11 (millions)subsequent_events
f5-10q / Qwen3.6-27B-Q8_0		Discontinuation of RFID development efforts; pre-tax charge of $9 to $12 million expected in Q4 1999.
1999-03-04restructuringin_progressJapanPC operationsUSD 4 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Charge for consolidating the Company's PC operations in Japan in the second quarter of 1999; no employee count or completion date disclosed.
1999-03-04acquisition_additioncompleted1998-09-30Italy; Singapore; United States (Richardson, TX); Singapore and Japan joint venturesSemiconductor memory operationsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Acquisition of substantially all of Texas Instruments' memory operations completed 1998-09-30; no headcount added was disclosed.
1999-03-04restructuringcompletedJapanPC operationsUSD 4 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Charge for cost of consolidating PC operations in Japan.
1999-03-04restructuringcompletedDomestic and InternationalPC operationsUSD 13 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Charges associated with employee termination benefits and consolidation of domestic and international operations. Reported in Q2 1998 comparative period.
1998-12-03acquisition_additioncompleted1998-09-30Italy; Singapore; United States (Richardson, TX closed June 1998); joint ventures in Singapore and JapanSemiconductor memory operations (wafer fabrication, assembly/test)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Acquisition of substantially all of Texas Instruments' memory operations for approx. $832.8 million; no employee headcount transferred is disclosed. Includes 30% interest in TECH (Singapore) and 25% in KTI (Japan) joint ventures.
1998-12-03acquisition_additioncompleted1998-09-14United StatesGraphics accelerator products (Rendition, Inc.)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Pooling-of-interests merger with Rendition, Inc.; approx. 3.6 million shares issued. No employee headcount disclosed.
1998-09-03acquisition_additioncompleted3,9001998-06-181998-09-30Italy, Singapore, United StatesSemiconductor memory manufacturingsubsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML		TI memory operations acquisition closed 1998-09-30 (after fiscal year-end). Breakdown: 1,400 Avezzano Italy, 2,300 Singapore, 200 United States. Additionally, approximately 770 KTI and 1,000 TECH joint venture employees are dependent upon but not stated as directly added to headcount.
1998-09-03acquisition_additioncompleted1001998-06-221998-09-11United StatesGraphics accelerator operationsbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Stock-for-stock merger with Rendition completed 1998-09-11 (after fiscal year-end). Approximately 100 employees in California focused on graphics accelerator projects.
1998-09-03restructuringcompletedDomestic and internationalPC systems operationsUSD 11 (millions)MD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML		FY1998 charges of $11 million for employee termination benefits and consolidation of domestic and international PC operations. Employee count not disclosed.
1998-09-03restructuringcompleted1998-06-30Domestic and InternationalPC OperationsUSD 11 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Charges associated with PC operations resulting from employee termination benefits and consolidation of domestic and international operations. Occurred in Q2 1998.
1998-09-03acquisition_additioncompleted3,9001998-09-30Italy, Singapore, United StatesSemiconductor Memorysubsequent_events
f5-10k / Qwen3.6-27B-Q8_0		Acquisition of Texas Instruments memory operations completed Sept 30, 1998. Added approx 3,900 employees: 1,400 in Avezzano, Italy; 2,300 in Singapore; 200 in US.
1998-09-03acquisition_additioncompleted1001998-09-11CaliforniaGraphics AcceleratorsItem_1_Business
f5-10k / Qwen3.6-27B-Q8_0		Merger with Rendition, Inc. completed Sept 11, 1998. Gained approx 100 employees located in California.
1998-05-28restructuringin_progressDomestic and internationalPC operations (Micron Electronics, Inc.)USD 13 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		YTD charge for employee termination benefits and consolidation of domestic/international PC operations; no employee count disclosed.
1998-05-28acquisition_additionannounced1998-06-18Italy, Singapore, United States (Texas)Semiconductor memory operationssubsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Agreement to acquire substantially all of TI's memory operations; no headcount figure disclosed. Closing subject to due diligence and regulatory approvals.
1998-05-28acquisition_additionannounced1998-06-22United StatesGraphics accelerators (Rendition, Inc.)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Stock-for-stock merger agreement with Rendition, Inc.; shareholders to receive approximately 3.7 million MTI shares; no headcount disclosed.
1998-05-28restructuringcompletedDomestic and InternationalPC OperationsUSD 13 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0		Charges associated with employee termination benefits and consolidation of domestic and international operations.
1998-05-28acquisition_additionannounced1998-06-18GlobalSemiconductor Memorysubsequent_events
f5-10q / Qwen3.6-27B-Q8_0		Agreement to purchase substantially all of Texas Instruments' memory operations. Company expects to offer employment to most remaining TI memory employees.
1998-05-28acquisition_additionannounced1998-06-22GlobalGraphics Acceleratorssubsequent_events
f5-10q / Qwen3.6-27B-Q8_0		Agreement to acquire Rendition, Inc. pursuant to a stock-for-stock merger.
1998-02-26restructuringcompletedDomestic and internationalPC operations (Micron Electronics)USD 13 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML		Charges for employee termination benefits and consolidation of domestic and international PC operations; no headcount figure disclosed.
1998-02-26restructuringin_progressDomestic and internationalPC operationsUSD 13 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Q2 FY1998 charge covers employee termination benefits plus consolidation of domestic and international PC operations; no employee count or completion date disclosed.
1998-02-26restructuringcompleted1998-02-26PC operationsUSD 13 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Charges associated with employee termination benefits and consolidation of domestic and international operations.
1997-02-27restructuringcompleted1996-02-29Minneapolis, MinnesotaPC systems manufacturingUSD 30 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Charge recorded in Q2 1996 for discontinuation of ZEOS brand PC systems and closure of related manufacturing operations. Includes $14.5M for disposition of components/systems and $13.0M for goodwill write-off. Employee count not disclosed.
1996-08-29plant_closurecompletedMinneapolis, Minnesota, United StatesPC manufacturing operations (ZEOS brand)USD 30 (millions)MD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Restructuring charge for discontinuing ZEOS brand PC sales and closing Minneapolis PC manufacturing; no employee count disclosed
1996-08-29restructuringcompleted1996-08-29Minneapolis, MinnesotaPC operationsUSD 30 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0		Charge associated with discontinuation of ZEOS brand PC systems and closing of related manufacturing operations.
1996-08-29restructuringcompletedMinneapolis, Minnesota, United StatesPersonal computer systems (Micron Electronics, Inc. / ZEOS brand)USD 30 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		MEI adopted and completed a plan to discontinue ZEOS brand PC systems and close the related Minneapolis PC manufacturing operations; charge comprised principally $14.5 million for disposition of ZEOS components and systems and $13 million to write off unamortized goodwill. Reduced fully diluted EPS by $0.09. No employee headcount affected is disclosed.
1996-05-30restructuringcompletedMinneapolis, MinnesotaMicron Electronics, Inc. — PC manufacturing (ZEOS brand)USD 30 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Second quarter 1996 pre-tax restructuring charge from decisions to discontinue ZEOS brand PC sales and close related PC manufacturing operations in Minneapolis; no employee counts disclosed.
1996-05-30plant_closurein_progressMinneapolis, Minnesota, United StatesMicron Electronics, Inc. — ZEOS brand PC systems manufacturingUSD 30 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Pre-tax restructuring charge recognized in the second quarter of fiscal 1996 (quarter ended 1996-02-29) arising from Micron Electronics' decision to discontinue ZEOS brand PC system sales and close related PC manufacturing operations. Number of employees affected, announcement date, and completion timing are not disclosed.
1996-05-30restructuringcompleted1996-02-29Minneapolis, MinnesotaPC manufacturing operationsUSD 30 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Pre-tax restructuring charge resulting from decisions to discontinue sales of ZEOS brand PC systems and close related PC manufacturing operations. Employee count not disclosed.
1996-02-29restructuringcompletedMinneapolis, Minnesota, United StatesMicron Electronics, Inc. (approximately 80% owned subsidiary) - PC manufacturingUSD 30 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML		Pre-tax restructuring charge in Q2 FY1996 from decisions to discontinue sales of ZEOS brand PC systems and close related PC manufacturing operations in Minneapolis, Minnesota. Charge reduced second quarter fully diluted EPS by $0.09. No employee count disclosed.
1996-02-29plant_closurein_progressMinneapolis, Minnesota, United StatesMicron Electronics, Inc. — ZEOS brand PC systems manufacturingUSD 30 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML		Micron Electronics (~80% owned) decided to discontinue ZEOS brand PC systems and close related PC manufacturing operations in Minneapolis. Charge reduced Q2 FY1996 fully diluted EPS by $0.09. No employee count disclosed.
1996-02-29restructuringcompleted1996-02-29Minneapolis, MinnesotaPC manufacturing operationsUSD 30 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0		Discontinuation of ZEOS brand PC systems and closure of related manufacturing operations. Employee count not disclosed.
1995-08-31acquisition_additioncompleted1995-04-071995-04-07United StatesPersonal computer systems / contract manufacturingbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML		Micron Computer and Micron Custom Manufacturing Services merged into ZEOS International to form Micron Electronics (MEI), approximately 79% owned; headcount added not separately disclosed
1995-08-31otherin_progress1996-12-31United States — Lehi, UtahSemiconductor memory manufacturingUSD 2,500 (millions)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML		New Lehi, Utah facility under construction, estimated cost $2.5 billion, expected to employ approximately 3,500 full-time employees at full build-out; expansion, not a workforce reduction
1995-08-31acquisition_additioncompleted1995-04-071995-04-07United StatesPersonal computer systems / contract manufacturingMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML		ZEOS International merged with Micron Computer and Micron Custom Manufacturing Services to form Micron Electronics; headcount added not disclosed.