Microchip Technology (MCHP)

Company ID: 296 | CIK: 0000827054
10-Q view:
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Segments are charted by their disclosed metrics (revenue, segment profit, etc.). Each line is a single segment. Reconciliation/corporate items are excluded. Major customers are shown as a percentage of revenue. Operational KPIs are grouped by metric concept; sub-metrics appear as separate lines.

Geographic Segments

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Business Unit / Product Segments

Major Customers (% of Revenue)

Operational KPIs

Backlog (backlog)

Technical Support Centers (branches)

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Chachoengsao test facility expansion capacity (capacity)

Common Stockholders of record (customers)

Employees (headcount)

Company Inventory Days (inventory_units)

Purchase commitments (order_book)

Turns orders required (orders_received)

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8-inch wafer production mix (other)

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8-inch wafer production share (other)

8-inch wafer production target (other)

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8-inch wafer share of production (other)

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Accounts payable (other)

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Accounts receivable (other)

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Accrued liabilities (other)

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Accumulated depreciation and amortization (other)

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Additional paid-in capital (other)

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Allowance for doubtful accounts (other)

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Allowance for inventory valuation (other)

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Amortization of purchased technology (other)

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Analog and interface product families (other)

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Anticipated capital expenditures (other)

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Anticipated capital expenditures (first half FY1999) (other)

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Anticipated capital expenditures (remainder of FY1998) (other)

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Asia and Japan sales mix (other)

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Asia and Japan sales percentage (other)

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Asia/Japan sales mix (other)

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Assembly in Thailand (other)

Assembly in Thailand facility (other)

Assembly in-house share (other)

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Assembly internal percentage (other)

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Assembly performed in Thailand (other)

Assembly performed in Thailand facility (other)

Assembly performed internally (other)

Assembly requirements (other)

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Auction rate securities (other)

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Auction rate securities fair value (other)

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Authorized common shares (other)

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Available credit facilities (other)

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Average selling price change (other)

Average selling price growth (other)

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Average wafer fab line yields (other)

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Balance sheet days of inventory (other)

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Balance sheet inventory days (other)

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Borrowings against credit facility (other)

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Borrowings against foreign credit facility (other)

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Business conducted in US Dollars in Europe (other)

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Capital expenditure guidance (other)

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Capital expenditure plan (other)

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Capital expenditures (other)

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Capital lease obligations (other)

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Cash and cash equivalents (other)

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Cash and cash equivalents at beginning of period (other)

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Cash and investments (other)

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Cash and short-term investments (other)

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Cash, equivalents and investments (other)

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Chandler wafer fab expansion (other)

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Change in other assets and liabilities (other)

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China sales mix (other)

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China sales percentage (other)

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China sales share (other)

China share of net sales (other)

Commercial paper outstanding (other)

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Common Stock Outstanding (other)

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Common Stockholders of Record (other)

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Common shares issued and outstanding (other)

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Common shares outstanding (other)

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Company Inventory Days (other)

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Company days of inventory (other)

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Company inventory days (other)

Cost of sales (other)

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Cost of sales margin (other)

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Cost of shares repurchased (prior year) (other)

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Credit facility limit (other)

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Current maturities of capital lease obligations (other)

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Current maturities of long-term debt (other)

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Days of inventory (other)

Days of inventory on balance sheet (other)

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Deferred income on shipments to distributors (other)

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Deferred income taxes (other)

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Deferred revenue (other)

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Deferred tax asset (other)

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Deferred tax liability (other)

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Demand change excluding distributor inventory (other)

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Depreciation and amortization (other)

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Design win lead time (other)

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Development tools shipped (other)

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Direct sales percentage (other)

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Directors elected (other)

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Distributor Inventory (other)

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Distributor Inventory Days (other)

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Distributor Sales (other)

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Distributor advances (other)

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Distributor days of inventory (other)

Distributor inventory (other)

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Distributor inventory months (other)

Distributor inventory value change (other)

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Distributor months of inventory (other)

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Distributor net sales (other)

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Distributor revenue share (other)

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Distributor sales mix (other)

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Distributor sales share (other)

Distributor share of net sales (other)

Distributors percentage of net sales (other)

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Dividends declared per share (other)

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Effective tax rate (other)

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Eight-inch wafer mix (other)

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Eight-inch wafer production (other)

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Eight-inch wafer share (other)

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Employees eligible for RSUs (other)

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Europe sales mix (other)

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Europe sales percentage (other)

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Europe sales share (other)

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European business in GBP (other)

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European business in USD (other)

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European sales in USD (other)

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European sales mix (other)

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European sales percentage (other)

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External foundry sales percentage (other)

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Fab 2 closure annual cash savings (other)

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Fab 3 construction cost (other)

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Foreign Patent Applications Pending (other)

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Foreign Patents Owned (other)

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Foreign Sales (other)

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Foreign credit facility limit (other)

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Foreign customer sales share (other)

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Foreign customer share of net sales (other)

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Foreign line of credit capacity (other)

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Foreign net sales (other)

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Foreign patent applications pending (other)

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Foreign patents owned (other)

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Foreign sales (other)

Foreign sales mix (other)

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Foreign sales percentage (other)

Foreign sales percentage of net sales (other)

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Foreign sales share (other)

Foreign share of net sales (other)

Foundry Sourced Sales Percentage (other)

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Foundry production percentage (other)

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Foundry-produced sales share (other)

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Foundry-sourced sales mix (other)

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Foundry-sourced sales share (other)

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Gross margin (other)

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Gross profit (other)

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Gross profit margin (other)

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Holders of record (other)

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In-house assembly percentage (other)

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In-house assembly requirements (other)

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In-house assembly share (other)

In-house test share (other)

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Income before income taxes (other)

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Income taxes (other)

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Increase in accounts payable and accrued liabilities (other)

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Increase in accounts receivable (other)

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Increase in inventories (other)

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Interest expense (other)

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Interest income (other)

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Internal Assembly Percentage (other)

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Internal Test Percentage (other)

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Internal Wafer Fabrication Sales (other)

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Internal assembly and test share (other)

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Internal assembly mix (other)

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Internal assembly percentage (other)

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Internal assembly share (other)

Internal manufacturing share (other)

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Internal test mix (other)

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Internal test percentage (other)

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Internal test share (other)

Inventory Days (other)

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Inventory balance (other)

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Inventory days (other)

Inventory days on balance sheet (other)

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Largest distributor share (other)

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Line of credit capacity (other)

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Litigation - Lucent counterclaim patents (other)

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Litigation - Lucent declaratory judgment patents (other)

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Long-lived assets (other)

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Long-term debt (other)

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Long-term pension accrual (other)

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Market value of voting stock (other)

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Memory product sales mix (other)

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Memory products revenue percentage (other)

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Microcontroller revenue share (other)

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Microcontroller sales mix (other)

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Microcontroller share of net sales (other)

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Microcontrollers in portfolio (other)

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Microcontrollers revenue percentage (other)

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Microcontrollers sales mix (other)

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Net cash provided by financing activities (other)

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Net cash provided by operating activities (other)

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Net cash used in investing activities (other)

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Net income (other)

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Net income per share (fully diluted) (other)

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Net income per share (primary) (other)

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Net increase in cash and cash equivalents (other)

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Net sales (other)

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Net sales by channel (other)

Net sales by geography (other)

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Net sales by product line (other)

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Net sales from Europe (other)

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Net sales from outside foundries (other)

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Net sales from outside wafer foundries (other)

Net sales growth (YoY) (other)

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Net sales to China (other)

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Net sales to Taiwan (other)

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Net sales to foreign customers (other)

New credit facility limit (other)

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Number of Reportable Segments (other)

Operating income (other)

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Operating income margin (other)

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Other assets (other)

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Other current assets (other)

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Other income, net (other)

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Outside foundry net sales percentage (other)

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Outside foundry percentage (other)

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Outside foundry revenue share (other)

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Outside foundry sales mix (other)

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Outside foundry sales percentage (other)

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Outside foundry sales share (other)

Outside foundry share of net sales (other)

Outside foundry wafer share (other)

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Outsourced Wafer Fabrication Sales (other)

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Outsourced wafer fabrication percentage (other)

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Outsourced wafer foundry share (other)

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Outsourced wafer production share (other)

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Outstanding common shares (other)

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Outstanding indebtedness (other)

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Outstanding put options (other)

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Outstanding stock options (other)

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Patent Applications Pending (other)

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Patents Owned (other)

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Patents owned (other)

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Payments on capital lease obligations (other)

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Payments on long-term debt (other)

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Planned capital expenditures (other)

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Planned capital spend (other)

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Prepaid expenses (other)

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Prime Rate (other)

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Proceeds from put options (other)

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Proceeds from sale of stock and put options (other)

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Product lead times (other)

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Product mix percentage (other)

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Product revenue mix (other)

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Production capacity reduction (other)

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Production on 8-inch wafers (other)

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Proforma basic EPS (Statement 128) (other)

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Proforma diluted EPS (Statement 128) (other)

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Property, plant & equipment, net (other)

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Property, plant and equipment - Building and improvements (other)

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Property, plant and equipment - Land (other)

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Property, plant and equipment - Machinery and equipment (other)

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Property, plant and equipment - Projects in process (other)

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Proprietary analog mix (other)

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Provision for doubtful accounts (other)

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Provision for inventory valuation (other)

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Provision for pension accrual (other)

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Purchase commitments (other)

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Put options outstanding (other)

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Put options sold (other)

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Quarterly cash dividend (other)

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Quarterly dividend per share (other)

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R&D expense margin (other)

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R&D investment growth (YoY) (other)

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Remaining share repurchase authorization (other)

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Repurchase authorization remaining (other)

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Research and development expense (other)

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Restricted stock units outstanding (other)

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Restructuring cash requirements (other)

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Retained earnings (other)

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Revenue from outside wafer foundries (other)

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Revenue mix (other)

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SG&A expense margin (other)

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SG&A expense ratio (other)

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SMSC net sales contribution (other)

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Sales and support centers (other)

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Sales from outside foundries (other)

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Sales from outside wafer foundries (other)

Sales from own U.S. wafer fabs (other)

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Sales through distributors (other)

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Sales to China (other)

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Sales to Taiwan (other)

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Sales to foreign customers (other)

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Securities under equity plans (other)

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Selling, general and administrative expense (other)

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Selling, general and administrative expense ratio (other)

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Semiconductor unit volume growth (other)

Serial EEPROM revenue share (other)

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Serial EEPROM sales mix (other)

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Share of sales from outside wafer foundries (other)

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Share of sales from own U.S. wafer fabs (other)

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Shares available for future issuance (other)

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Shares available for repurchase (other)

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Shares outstanding (other)

Shares repurchased (other)

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Shares repurchased (prior year) (other)

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Shares voted against ESPP amendment (other)

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Shares voted against auditor ratification (other)

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Shares voted against authorized share increase (other)

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Shares voted against stock option plan amendment (other)

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Shares voted for ESPP amendment (other)

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Shares voted for auditor ratification (other)

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Shares voted for authorized share increase (other)

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Shares voted for director election (Albert J. Hugo-Martinez) (other)

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Shares voted for director election (Jon H. Beedle) (other)

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Shares voted for director election (L.B. Day) (other)

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Shares voted for director election (Matthew W. Chapman) (other)

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Shares voted for director election (Steve Sanghi) (other)

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Shares voted for stock option plan amendment (other)

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Shipment delinquencies (other)

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Short-term debt (other)

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Silicon ASP change (other)

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Silicon product ASP change (other)

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Silicon unit volume growth (other)

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Stock options outstanding (other)

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Stock repurchase authorization remaining (other)

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Stock repurchases (other)

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Stock repurchases cost (other)

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Stockholders' equity (other)

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Taiwan sales share (other)

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Taiwan share of net sales (other)

Technical Support Centers (other)

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Tempe Fab II expansion cost (other)

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Tempe wafer fab expansion (other)

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Test in Thailand (other)

Test in Thailand facility (other)

Test internal percentage (other)

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Test performed in Thailand (other)

Test performed in Thailand and Philippines (other)

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Test performed in Thailand facility (other)

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Test performed internally (other)

Thailand assembly mix (other)

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Thailand assembly share (other)

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Thailand facility share (other)

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Thailand facility workload (other)

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Thailand test share (other)

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Third-Party Tool Suppliers (other)

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Third-party assembly share (other)

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Third-party foundry production (other)

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Third-party test share (other)

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Third-party tool suppliers (other)

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Top 10 customer concentration (other)

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Top 10 customer revenue share (other)

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Top 10 direct customer share (other)

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Top customer revenue share (other)

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Top ten customer concentration (other)

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Top ten customer revenue concentration (other)

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Top ten customer revenue share (other)

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Top ten customer share (other)

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Top-10 customer revenue share (other)

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Total assets (other)

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Total available liquidity (other)

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Total current assets (other)

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Total current liabilities (other)

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Trade accounts receivable (other)

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Treasury shares (other)

Treasury shares held (other)

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Treasury shares reissued (other)

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Treasury shares repurchased (other)

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Turns orders required (other)

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U.S. Patent Applications Pending (other)

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U.S. Patents Owned (other)

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U.S. patent applications pending (other)

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U.S. patents owned (other)

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US patents owned (other)

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USD denominated sales (other)

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Unabsorbed capacity charge (other)

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Unabsorbed capacity charges (other)

Unearned share-based compensation (other)

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Unexpired put options (other)

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Unit sales growth (other)

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Unit volume change (other)

Unit volume growth (other)

Vendor Y2K compliance (other)

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Wafer fab line yield (other)

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Wafer fab line yields (other)

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Wafer fabrication from outside foundries (other)

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Weighted average shares outstanding (fully diluted) (other)

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Weighted average shares outstanding (primary) (other)

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Workforce reduction (other)

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Y2K compliance cost (other)

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Y2K compliance vendors (other)

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Y2K program spend (other)

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Y2K remediation costs (other)

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Y2K remediation costs incurred (other)

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Y2K remediation spend (other)

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Y2K vendor compliance (other)

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Y2K vendor compliance letters (other)

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Test requirements in Thailand (production_volume)

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Wafer fab line yields (recovery_rate)

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Remaining performance obligations (rpo)

Thailand facility expansion size (square_footage)

Outsourced wafer foundry share (throughput)

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PIC microcontrollers shipped (units_shipped)

Wafer fab line yields (utilization_rate)

Wafer Fab Yield (yield_rate)

No 10-Q data
Human capital disclosures. Workforce totals and demographics are point-in-time. Flow metrics use the year-to-date period for 10-Q and full year for 10-K. Workforce actions (RIFs, restructurings, acquisition-related changes) are listed in the table at the bottom.

Workforce Totals

No 10-Q data
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Demographics

No demographic data found.

Workforce Breakdowns

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HCM Metrics — Point-in-Time

No point-in-time HCM metrics found.

HCM Metrics — Flow (Annual / YTD)

No flow HCM metrics found.

Workforce Actions

Period EndTypeStatusAffected% WorkforceAnnouncedExpected CompletionGeographySegment / FunctionChargeSourceNote
2026-06-30plant_closurecompleted2024-12-012025-05-31Tempe, Arizona, United StatesSemiconductor products - wafer fabrication (Fab 2)USD 3 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Closure of Fab 2 wafer fabrication facility announced December 2024 and completed May 2025; residual restructuring expenses of $2.9 million recognized in the three months ended June 30, 2026. No employee count disclosed in this filing.
2026-06-30plant_closurein_progress2024-12-01Tempe, Arizona, United StatesSemiconductor products — wafer fabrication (Fab 2)USD 3 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Quarterly restructuring expense tied to the Fab 2 closure; closure itself completed May 2025. No employee count disclosed for this quarter's charge.
2026-06-30restructuringin_progress2025-03-01Tempe, ArizonaManufacturingUSD 3 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Restructuring expenses for the closure of the Tempe, Arizona wafer fabrication facility (Fab 2). Employee count not disclosed in this quarter.
2026-06-30restructuringcompleted2025-10-012026-03-31GlobalAll functionsRisk Factors
f5-10q / Qwen3.6-27B-Q8_0
Global reduction in force implemented in Q4 FY2025 and completed in Q1 FY2026. Specific headcount reduction numbers not disclosed in this 10-Q.
2026-03-31restructuringcompleted2025-03-312026-03-31GlobalCompany-wideUSD 1 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Employee separation costs incurred in fiscal 2026; global headcount reduction announced in Q4 fiscal 2025 and completed in Q1 fiscal 2026. Headcount affected not disclosed.
2026-03-31plant_closurecompleted2024-12-312025-05-31United States (Tempe, Arizona)Wafer fabrication (Fab 2)USD 22 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Fab 2 closure announced December 2024, closure completed May 2025 (fiscal 2026); charge relates to facility closure costs. Headcount affected not disclosed.
2026-03-31restructuringcompleted2025-03-312026-03-31GlobalCompany-wide (contract exits)USD 15 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Contract exit costs incurred in fiscal 2026 as part of business recovery plan; no employee count disclosed.
2026-03-31restructuringcompleted2025-03-012026-03-31GlobalVariousUSD 40 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Global reduction in workforce implemented in Q4 FY2025 and completed in Q1 FY2026. Includes closure of Tempe, Arizona wafer fabrication facility (Fab 2) and contract exit costs. Employee separation costs were $0.9 million in FY2026.
2026-03-31restructuringin_progressEmployee Severance [Member]USD 900,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2026-03-31restructuringin_progressContract Termination [Member]USD 14,500,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2026-03-31restructuringin_progressOther Restructuring [Member]USD 21,800,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2026-03-31restructuringin_progressUSD 37,200,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2025-12-31reduction_in_forcecompletedGlobalother
f5-10q / GLM-5.3-flash-fp4-HTML
Global workforce reduction implemented in Q4 fiscal 2025 and completed in Q1 fiscal 2026; company notes it may have negatively affected employee morale. No headcount or charge figures disclosed in this filing.
2025-12-31plant_closurecompleted2024-12-022025-05-31Tempe, Arizona, United StatesWafer fabrication (Fab 2)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Fab 2 closure announced December 2, 2024 and completed May 2025; production transferred to Oregon and Colorado facilities. Agreement to sell the site reached October 2025, sale still pending. Closure contributed to restructuring charges of $33.3 million in the nine months ended December 31, 2025.
2025-12-31restructuringin_progressUSD 5 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Special charges and other, net of $4.8 million for the quarter (and $33.3 million for the nine months) primarily for restructuring expenses including contract exit costs, Fab 2 closure, and employee separation costs. No employee counts disclosed.
2025-12-31plant_closurecompleted2024-12-022025-05-31Tempe, Arizona, United StatesSemiconductor products — wafer fabrication (Fab 2)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Fab 2 closure announced 2024-12-02, completed May 2025. Ongoing restructuring charges (including contract exit costs and employee separations) of $4.8M in Q3 FY2026 and $33.3M YTD FY2026 recorded under Special charges and other, net. No employee count disclosed. Sale of Fab 2 to a third party agreed October 2025, closing still pending.
2025-12-31reduction_in_forcecompleted2025-06-30GlobalGlobal workforceother
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Global reduction in workforce implemented in Q4 FY2025 and completed in Q1 FY2026 (quarter ended 2025-06-30), per risk factor disclosure. No employee count or charge amount disclosed. Referenced in current filing as completed prior to the reporting period.
2025-12-31restructuringcompleted2025-09-302026-03-31GlobalVariousUSD 33 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Global reduction in force implemented in Q4 FY2025 and completed in Q1 FY2026. Includes contract exit costs, closure of Tempe, Arizona wafer fabrication facility (Fab 2), and employee separation costs. Specific headcount not disclosed.
2025-12-31plant_closurecompleted2024-12-022025-05-31Tempe, ArizonaManufacturingMD&A
f5-10q / Qwen3.6-27B-Q8_0
Closure of Fab 2 wafer fabrication facility completed in May 2025. Production transferred to Oregon and Colorado locations. Specific headcount impact not disclosed.
2025-09-30plant_closurecompleted2024-12-022025-05-31Tempe, Arizona, United StatesWafer fabrication (Fab 2)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Closure of Tempe, Arizona wafer fabrication facility (Fab 2) announced December 2, 2024; closure completed May 2025. Agreement to sell the facility to a third party entered October 2025, with sale expected to complete December 2025. Production being transferred to Oregon and Colorado facilities. No employee count disclosed.
2025-09-30reduction_in_forcecompletedGlobalother
f5-10q / GLM-5.3-flash-fp4-HTML
Global reduction in force implemented in Q4 fiscal 2025 and completed in Q1 fiscal 2026. No affected-employee count or charge amount disclosed in this filing.
2025-09-30restructuringin_progressUSD 29 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Special charges and other, net of $28.5 million for the six months ended September 30, 2025, primarily restructuring expenses including contract exit costs, closure of the Tempe, Arizona wafer fabrication facility, and employee separation costs. No headcount disclosed.
2025-09-30reduction_in_forcecompleted20242025-06-30Globalother
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Filer states a global workforce reduction was implemented in fiscal 2025 Q4 and completed in fiscal 2026 Q1; no employee count or severance amount disclosed. Special charges of $28.5M for the six months ended 2025-09-30 include restructuring, contract exit, Fab 2 closure and employee separation costs combined, not separable to this action.
2025-09-30plant_closurecompleted2024-12-022025-05United States (Tempe, Arizona)Semiconductor products — wafer fabrication (Fab 2)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Fab 2 closure announced 2024-12-02 and completed May 2025; production transferring to Oregon and Colorado sites. No headcount associated with the closure disclosed. Sale of the facility agreed October 2025, expected to close December 2025.
2025-09-30restructuringcompleted2024-10-012026-03-31GlobalVariousUSD 29 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Global reduction in workforce implemented in Q4 FY2025 and completed in Q1 FY2026. Includes contract exit costs, closure of Tempe, Arizona wafer fabrication facility (Fab 2), and employee separation costs. Specific headcount not disclosed.
2025-06-30plant_closurecompleted2024-12-022025-05-31Tempe, Arizona, United StatesSemiconductor products — wafer fabrication (Fab 2)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Closure of Tempe, Arizona wafer fabrication facility (Fab 2) announced December 2, 2024; completed in May 2025. Production being transferred to Oregon and Colorado facilities. No employee count disclosed.
2025-06-30reduction_in_forcecompleted2025-06-30GlobalUSD 22 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Global workforce reduction implemented in Q4 fiscal 2025 and completed in Q1 fiscal 2026. Special charges of $22.2 million in the quarter primarily related to restructuring expenses including contract exit costs, Fab 2 closure and employee separation costs. No employee count disclosed.
2025-06-30reduction_in_forcecompleted2025-06-30GlobalNot specifiedUSD 22 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Global workforce reduction announced in Q4 FY2025 and completed in Q1 FY2026; no employee count disclosed. The $22.2M special charge for the quarter bundles employee separation costs with contract exit costs and Fab 2 closure costs, so it is not a pure severance figure.
2025-06-30plant_closurecompleted2024-12-022025-05-31Tempe, Arizona, United StatesWafer fabrication (Fab 2)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Closure of Fab 2 announced December 2, 2024 and completed May 2025; production transferring to Oregon and Colorado sites. No associated employee count disclosed; closure costs sit within the $22.2M special charges line.
2025-06-30acquisition_additioncompleted2025-04-292025-05-08Not specifiedNot specifiedother
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of TF Semiconductor Solutions (TFSS) closed May 8, 2025 with 426,954 shares issued at closing plus 47,434 held back; no headcount added disclosed.
2025-06-30restructuringcompleted2024-10-012025-06-30GlobalVariousUSD 22 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Global reduction in force implemented in Q4 FY2025 and completed in Q1 FY2026. Includes contract exit costs, closure of Tempe, Arizona wafer fabrication facility (Fab 2), and employee separation costs. Specific headcount not disclosed.
2025-03-31plant_closurein_progress2024-12-022025-05-31United States (Tempe, Arizona)Manufacturing — Fab 2 wafer fabricationMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Closure completed May 2025 (after fiscal year end); expected annual cash savings of approximately $90 million. Facility and equipment classified as held for sale at March 31, 2025. No separate employee count disclosed for this action.
2025-03-31restructuringin_progress2025-03-03United States (Gresham, Oregon; Colorado Springs, Colorado) and PhilippinesManufacturing — Fab 4, Fab 5, and backend manufacturing facility in the PhilippinesUSD 27 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Headcount reduction at manufacturing facilities announced March 3, 2025; expected approximately $25 million in annual savings from temporarily reduced compensation costs. Employee separation costs of $27.1M and contract exit costs of $45.7M recorded in fiscal 2025 restructuring charges (total $76.5M charges, $22.1M accrued at year end).
2025-03-31reduction_in_forceannounced2025-03-032025-06-30GlobalCompany-wideMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
10% global workforce reduction announced March 3, 2025 to decrease operating expenses; expected to reduce ongoing annualized operating expenses by approximately $90 million to $100 million. To be fully implemented by the June 2025 quarter (after fiscal year end). Implied affected count approximately 1,940 based on ~19,400 total workforce, but no explicit count disclosed.
2025-03-31plant_closurecompleted2024-12-022025-05-31Tempe, ArizonaWafer Fabrication (Fab 2)Item_1_Business
f5-10k / Qwen3.6-27B-Q8_0
Closure announced Dec 2, 2024; completed May 2025. Expected annual cash savings of approx $90 million. Employee count not disclosed.
2025-03-31restructuringin_progress2025-03-03GlobalManufacturing and CorporateUSD 73 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Announced March 3, 2025. Includes headcount reduction at Fab 4, Fab 5, and Philippines backend; 10% global headcount reduction. Total restructuring charges $76.5 million ($45.7M contract exit, $27.1M employee separation, $3.7M other). Employee count not disclosed.
2025-03-31restructuringin_progressEmployee Severance [Member]USD 27,100,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2025-03-31restructuringin_progressContract Termination [Member]USD 45,700,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2025-03-31restructuringin_progressOther Restructuring [Member]USD 3,700,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2025-03-31restructuringin_progressUSD 76,500,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2024-12-31plant_closureannounced2024-12-022025-09-30Tempe, Arizona, United StatesWafer fabrication (Fab 2)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Closure of Fab 2 wafer fabrication facility expected in the September 2025 quarter; expected annual cash savings of approximately $90 million. No headcount figure disclosed.
2024-12-31plant_closureannounced2024-12-022025-09-30Tempe, Arizona, United StatesSemiconductor Products — Wafer Fabrication (Fab 2)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Closure of Fab 2 announced 2024-12-02; expected annual cash savings ~$90M. No employee count or severance charge disclosed. Process technologies to be transferred to Oregon and Colorado facilities.
2024-12-31plant_closureannounced2024-12-022025-09-30Tempe, ArizonaWafer fabricationMD&A
f5-10q / Qwen3.6-27B-Q8_0
Company announced decision to close Fab 2 wafer fabrication facility. Expected to generate annual cash savings of approximately $90 million. No specific employee count disclosed.
2024-12-31restructuringin_progressUSD 4 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Incurred special charges of $3.5 million for the three months ended Dec 31, 2024, primarily related to employee severance and restructuring of acquired and existing wafer fabrication operations.
2024-12-31restructuringin_progressUSD 8 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Incurred special charges of $7.6 million for the nine months ended Dec 31, 2024, primarily related to employee severance and restructuring of acquired and existing wafer fabrication operations.
2024-09-30restructuringin_progressWafer fabrication operationsUSD 2 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2024-09-30restructuringin_progressWafer fabrication operationsUSD 4 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
YTD charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2024-06-30restructuringin_progresswafer fabrication operationsUSD 3 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2024-03-31restructuringcompletedUnited StatesWafer fabrication operationsUSD 6 (millions)MD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2024 restructuring costs related to wafer fabrication operations; employee count not disclosed.
2024-03-31otherannounced2024-04-012024-06-30GlobalGlobal production facilitiesMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
During the June 2024 quarter, reduced production levels and implemented up to two weeks of shutdown days in global production facilities; headcount impact not quantified.
2024-03-31otherin_progressUnited StatesFab 4 (Gresham, Oregon) and Fab 5 (Colorado Springs, Colorado)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML
In Q4 FY2024 paused most of the $800M Fab 4 expansion and $880M Fab 5 SiC/silicon expansion; no workforce reduction quantified.
2024-03-31restructuringcompletedWafer fabrication operationsUSD 6 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Restructuring costs of acquired and existing wafer fabrication operations to increase operational efficiency.
2023-12-31otherannouncedGlobal fabrication facilitiesManufacturingMD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Company is reducing production levels and implementing up to two weeks of shutdown days in global fabrication facilities during the March 2024 and June 2024 quarters to manage inventory; no employee headcount impact quantified.
2023-12-31restructuringin_progresswafer fabrication operationsUSD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2023-12-31restructuringin_progresswafer fabrication operationsUSD 5 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
YTD charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2023-09-30restructuringin_progressWafer fabrication operationsUSD 4 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Special charges of $3.5M for six months ended 2023-09-30 relate to restructuring of acquired and existing wafer fab operations; no employee count disclosed.
2023-09-30restructuringin_progresswafer fabrication operationsUSD 2 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2023-09-30restructuringin_progresswafer fabrication operationsUSD 4 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
YTD charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2023-06-30restructuringcompletedWafer fabrication operationsUSD 2 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Incurred special charges of $1.7 million primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2023-03-31restructuringin_progressGlobalWafer fabrication operationsUSD 17 (millions)MD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Fiscal 2023 restructuring expenses related to restructuring of acquired and existing wafer fabrication operations; employee counts not disclosed. No employee-affected figures given in the filing.
2023-03-31restructuringcompletedWafer fabrication operationsUSD 17 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2022-12-31restructuringin_progressWafer fabrication operationsUSD 7 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Special charges incurred during the three months ended Dec 31, 2022 primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. Employee count not disclosed.
2022-12-31restructuringin_progressWafer fabrication operationsMD&A
f5-10q / Qwen3.6-27B-Q8_0
Special income earned during the nine months ended Dec 31, 2022 included favorable resolution of legal matter offset by restructuring costs of acquired and existing wafer fabrication operations. Employee count not disclosed.
2022-09-30restructuringin_progressWafer fabrication operationsother
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Quarterly special charges related to restructuring of acquired and existing wafer fabrication operations for operational efficiency; no employee count, charge allocation, or completion date disclosed. Six-month period recorded net special income of $12.6M (favorable legal resolution offsetting restructuring charges).
2022-09-30restructuringin_progressWafer fabrication operationsUSD 4 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges incurred primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency for the three months ended Sept 30, 2022.
2022-09-30restructuringin_progressWafer fabrication operationsUSD -13 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Net special income of $12.6M for the six months ended Sept 30, 2022. Income primarily related to favorable resolution of a previously accrued legal matter; charges primarily related to restructuring of acquired and existing wafer fabrication operations.
2022-06-30restructuringin_progressWafer fabrication operationsMD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges incurred were primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. Specific employee count not disclosed.
2022-03-31restructuringcompleted2022-03-31United StatesSemiconductor Products — wafer fabrication operationsUSD 21 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2022 charge for restructuring acquired and existing wafer fabrication operations; footnote states these efforts were substantially completed as of March 31, 2022. No employee count disclosed.
2022-03-31restructuringcompleted2022-03-31Not specifiedSemiconductor Products — non-manufacturing facilities and other operationsUSD 8 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2022 total special charges were $29.5M, comprising $21.1M wafer fab restructuring plus employee separation ($0.6M), contract exit costs ($5.0M), gain on sale of assets (-$7.9M), other (-$0.3M), legal contingencies ($12.5M), and contingent consideration revaluation (-$1.5M). MD&A attributes the non-fab portion to exiting non-manufacturing facilities including contract termination, severance, and asset disposal. Charge shown is the residual non-fab restructuring components (separation + contract exit + other), net of asset sale gains. No employee counts disclosed.
2022-03-31othercompletedNot specifiedNot specifiedUSD 13 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2022 net legal settlement charges recorded within special charges and other, net; not a workforce action per se but part of the same caption. Included for completeness of the $29.5M total.
2022-03-31restructuringcompletedWafer fabrication operationsUSD 21 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Charges related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. Employee separation costs were $0.6 million. Total special charges were $29.5 million.
2022-03-31restructuringcompletedNon-manufacturing facilitiesMD&A
f5-10k / Qwen3.6-27B-Q8_0
Exiting non-manufacturing facilities including contract termination costs, employee severance, and disposal of assets. Specific headcount not disclosed.
2022-03-31restructuringin_progressUSD 21,100,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2021-12-31restructuringcompletedUSD 20 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Nine months ended Dec 31, 2021 incurred special charges of $20.4M primarily related to restructuring of acquired and existing wafer fabrication operations, litigation matters, and exiting non-manufacturing facilities including contract termination costs, employee severance, and asset disposal. No specific employee count disclosed.
2021-09-30restructuringcompletedWafer fabrication operationsUSD 10 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges incurred in Q2 2021 related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency, including employee severance.
2021-09-30restructuringcompletedNon-manufacturing facilitiesUSD 11 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
YTD 2021 charges included $20.7M total; $10.2M was Q2. Remaining YTD charges related to exiting non-manufacturing facilities including contract termination costs, employee severance, and asset disposal.
2021-06-30restructuringin_progressWafer fabrication operationsUSD 11 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency.
2021-03-31restructuringcompleted2021-03-31United States (Colorado Springs, Colorado)Semiconductor products — wafer fabrication (Fab 5)USD 8 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2021 costs to re-purpose Fab 5; part of $15.0M total FY2021 wafer fab restructuring. Efforts substantially completed as of March 31, 2021. No employee count disclosed.
2021-03-31restructuringcompleted2021-03-31Not specifiedSemiconductor products — acquired operations (Microsemi/Atmel integration)USD 7 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2021 restructuring of other acquired operations; includes workforce, property and operating expense rationalizations. Employee separation costs were a net credit of $1.3M in FY2021. No employee count disclosed.
2021-03-31plant_closurein_progress2021-12-31United States (Santa Clara, California)Wafer fabrication (Microsemi-acquired facility)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Company plans to close the Santa Clara facility by December 2021; no headcount or charge quantified.
2021-03-31restructuringcompleted2021-03-31GlobalWafer fabrication operationsUSD 15 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Charges related to restructuring wafer fabrication operations, including repurposing Fab 5. Efforts substantially completed as of March 31, 2021. Employee count not disclosed.
2021-03-31restructuringcompletedGlobalOther acquired operationsUSD -1 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Employee separation costs reported as a credit of $1.3 million. Part of broader restructuring activities related to recent business acquisitions. Employee count not disclosed.
2021-03-31restructuringin_progressUSD 15,000,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2020-12-31restructuringin_progress2021-03-31Wafer fabrication operations (Fab 5, Colorado Springs)USD 7 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Fiscal 2020 announcement to re-purpose Fab 5 to manufacture discrete and specialty products; clean room footprint reduced and higher-volume products transferred to Fab 2 and Fab 4. $7.0 million of costs incurred in the nine months ended December 31, 2020 (after $18.0 million in fiscal 2020), recorded in special charges and other, net. Less than $2.0 million expected in Q4 fiscal 2021. No employee counts disclosed.
2020-12-31restructuringin_progress2021-03-31Wafer fabrication operationsUSD 7 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Costs associated with re-purposing Fab 5 to manufacture discrete and specialty products. Filer expects to incur less than $2.0 million in the fourth quarter for remaining associated costs.
2020-09-30restructuringin_progressUnited StatesWafer fabrication (Fab 5, Colorado Springs)USD 4 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Fab 5 re-purposed to discrete and specialty products; clean room footprint reduced and higher-volume products transferred to Fab 2 and Fab 4. $4.0 million of costs incurred in the six months ended September 30, 2020; less than $4.0 million expected in the second half of fiscal 2021. No employee counts disclosed.
2020-09-30restructuringin_progressColorado Springs, Colorado (Fab 5)Wafer fabrication operationsUSD 4 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Fab 5 repurposed for discrete/specialty products; $4.0M costs in six months ended 2020-09-30, less than $4.0M expected in H2 FY2021. No employee count disclosed.
2020-09-30restructuringin_progressGlobalWafer fabrication operationsUSD 4 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Costs associated with re-purposing Fab 5 to manufacture discrete and specialty products. No employee count disclosed.
2020-06-30restructuringin_progress2021-03-31United States (Colorado Springs, Colorado)Wafer fabrication (Fab 5)USD 1 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Fab 5 being re-purposed to manufacture discrete and specialty products; clean room footprint reduced and higher-volume products transferred to Fab 2 and Fab 4. $1.0 million of costs incurred in the quarter; less than $7.0 million expected in fiscal 2021 for remaining costs. No employee count disclosed.
2020-06-30restructuringin_progressUnited StatesSemiconductor Products — wafer fabrication (Fab 5, Colorado Springs)USD 1 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Fab 5 re-purposing for discrete and specialty products; $1.0M of restructuring costs incurred in the quarter, $18.0M in fiscal 2020, with less than $7.0M expected in fiscal 2021. No employee count disclosed.
2020-06-30restructuringin_progressAcquisition-related (Microsemi/Atmel integration)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Filing cites workforce, property and other operating expense rationalizations from recent acquisitions; no employee count or separate current-quarter charge amount disclosed.
2020-06-30restructuringin_progressWafer fabrication operationsUSD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Costs associated with re-purposing Fab 5 to manufacture discrete and specialty products. No employee count disclosed.
2020-03-31restructuringin_progressUnited StatesSemiconductor Products — wafer fabrication operationsUSD 18 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2020 charge for restructuring wafer fabrication operations (Fab 5 re-purposing), comprising $8.2M contract exit costs, $6.6M relocation costs and $2.5M asset impairment; less than $10.0M of remaining costs expected within the next year; no employee count disclosed
2020-03-31restructuringin_progressGlobalSemiconductor Products — acquisition integration (Microsemi/Atmel)USD 6 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2020 employee separation costs from workforce, property and operating expense rationalizations tied to prior acquisitions; filer states it cannot estimate future amounts; no employee count disclosed
2020-03-31plant_closureannounced2021-03-31United States — Santa Clara, CaliforniaWafer fabrication (Microsemi-acquired facility)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Filer plans to close the Santa Clara, California facility by March 2021; no headcount or charge quantified
2020-03-31restructuringcompletedWafer fabrication operationsUSD 18 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Costs associated with restructuring wafer fabrication operations, including contract exit costs, relocation costs, and asset impairment charges.
2020-03-31restructuringcompletedUSD 6 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Employee separation costs related to most recent business acquisitions, resulting from workforce rationalizations.
2020-03-31restructuringin_progressEmployee Severance [Member]USD 6,000,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2020-03-31restructuringin_progressFacility Closing [Member]USD 13,400,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2020-03-31restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2020-03-31restructuringin_progressUSD 19,400,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2019-12-31restructuringin_progressUnited States (Colorado)Semiconductor products — wafer fabrication operationsUSD 12 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Q3 FY2020 charge for restructuring wafer fab operations; MD&A adds that clean-room footprint at the Colorado 6-inch fab is being reduced with higher-volume products transferred to 8-inch fabs in Arizona and Oregon. Company expects less than $10.0 million of remaining costs within the next year. No employee count disclosed; employee separation costs of $10.7 million incurred YTD across all restructuring activities, also without headcount figures.
2019-12-31restructuringin_progressNot specifiedSemiconductor products — acquisition integration (Microsemi and prior acquisitions)USD 11 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Employee separation costs of $10.7 million for the nine months ended December 31, 2019, primarily related to workforce and property rationalizations from recent acquisitions. Accrued restructuring liability of $40.0 million at quarter-end ($22.6 million current, $17.4 million non-current). No employee counts disclosed.
2019-12-31restructuringin_progress2020-12-31Wafer fabrication operationsUSD 12 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Costs associated with restructuring certain wafer fabrication operations. Company estimates less than $10.0 million remaining costs within next year.
2019-12-31restructuringin_progressSemiconductor productsUSD 11 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred during the nine months ended Dec 31, 2019. Part of ongoing restructuring activities since fiscal 2017.
2019-12-31restructuringin_progressSemiconductor productsUSD 11 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Contract exit costs incurred during the nine months ended Dec 31, 2019.
2019-12-31restructuringin_progressEmployee Severance [Member]USD 10,700,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-12-31restructuringin_progressFacility Closing [Member]USD 10,800,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-12-31restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-12-31restructuringin_progressUSD 21,500,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-09-30restructuringin_progressSemiconductor products segmentUSD 1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $0.6 million in the three months ended September 30, 2019, primarily related to recent business acquisitions
2019-09-30restructuringin_progressSemiconductor products segmentUSD 7 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $7.3 million in the six months ended September 30, 2019; cumulative $112.9 million since start of fiscal 2017
2019-09-30restructuringannouncedWafer fabrication operationsUSD 20 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Company estimates $15 million to $25 million of costs over the next year to restructure certain wafer fabrication operations; midpoint recorded as estimate
2019-09-30restructuringin_progressGlobalSemiconductor Products (wafer fabrication operations)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Company estimates $15M to $25M of restructuring costs for certain wafer fabrication operations over the next year; no employee count disclosed. Employee separation costs of $0.6M (Q2) and $7.3M (YTD) incurred in the period, but no headcount affected is stated.
2019-09-30acquisition_additioncompleted2018-05-292018-05-29GlobalSemiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Microsemi acquisition closed May 29, 2018; no headcount added through the acquisition is disclosed in this filing.
2019-09-30restructuringin_progressSemiconductor productsUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred in Q2 FY2020 related to workforce rationalizations from recent acquisitions.
2019-09-30restructuringin_progressSemiconductor productsUSD 7 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Cumulative employee separation costs incurred in the six months ended Sept 30, 2019, related to workforce rationalizations from recent acquisitions.
2019-09-30restructuringin_progressEmployee Severance [Member]USD 7,300,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-09-30restructuringin_progressFacility Closing [Member]USD 500,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-09-30restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-09-30restructuringin_progressUSD 7,800,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-06-30restructuringin_progressSemiconductor products segmentUSD 7 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $6.7 million in the quarter, primarily related to recent business acquisitions (workforce and operating expense rationalizations); no employee count disclosed. Cumulative employee separation costs since start of fiscal 2017 were $112.3 million.
2019-06-30restructuringin_progressGlobalSemiconductor ProductsUSD 7 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Employee separation costs of $6.7M in Q1 FY2020 related to Microsemi integration; no employee count disclosed. Company states it cannot estimate future amounts.
2019-06-30restructuringin_progressSemiconductor productsUSD 7 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred during the quarter. Filing states: 'The Company is not able to estimate future expenses, if any, to be incurred in employee separation costs.'
2019-06-30restructuringin_progressEmployee Severance [Member]USD 6,700,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-06-30restructuringin_progressFacility Closing [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-06-30restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-06-30restructuringin_progressUSD 6,700,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2019-03-31restructuringin_progressGlobalSemiconductor ProductsUSD 65 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2019 employee separation costs tied to recent acquisitions (Microsemi, Atmel); no headcount affected disclosed. Additional future costs expected but not estimable.
2019-03-31plant_closurecompleted2019-03-31United States (Bend, Oregon)Wafer fabrication (Microsemi legacy facility)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Bend, Oregon facility discontinued production in March 2019; associated workforce reduction not quantified.
2019-03-31acquisition_additioncompleted2018-05-292018-05-29United States (Aliso Viejo, California HQ) and globalSemiconductor Products (aerospace, defense, communications, data center, industrial)USD 22 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Microsemi acquisition closed May 29, 2018; headcount added not disclosed. $22.0M acquisition-related costs incurred; $65.2M share-based compensation recognized on assumed awards during FY2019.
2019-03-31restructuringcompletedUSD 64 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Restructuring charges of $63.9 million incurred in fiscal 2019 related to recent business acquisitions, including workforce rationalizations and combining product roadmaps. Employee separation costs were $65.3 million, partially offset by gains on sale of assets and contract exit cost adjustments.
2019-03-31restructuringin_progressEmployee Severance [Member]USD 48,900,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2019-03-31restructuringin_progressFacility Closing [Member]USD -4,700,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2019-03-31restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2019-03-31restructuringin_progressUSD 44,200,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2018-12-31restructuringin_progressSemiconductor products segmentUSD 3 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $3.3 million in the quarter, related to Microsemi acquisition integration (workforce, property and operating expense rationalizations). No employee count disclosed.
2018-12-31restructuringin_progressSemiconductor products segmentUSD 61 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $60.5 million for the nine months ended December 31, 2018, tied to Microsemi acquisition integration; no headcount figures disclosed.
2018-12-31acquisition_additioncompleted2018-05-29Semiconductor products segmentUSD 8,245 (millions)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Microsemi acquisition completed May 29, 2018 for total consideration of approximately $8.24 billion; headcount added not disclosed.
2018-12-31restructuringin_progressGlobalSemiconductor ProductsUSD 61 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Employee separation costs of $60.5M for nine months ended Dec 31, 2018 ($3.3M in Q3), related to Microsemi and prior acquisitions. No employee count disclosed. Company states it cannot estimate future separation costs.
2018-12-31acquisition_additioncompleted2018-05-292018-05-29United StatesSemiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Microsemi acquisition closed May 29, 2018 for ~$8.24B. No headcount added disclosed. Company notes Microsemi outsources substantially all wafer fabrication and assembly/test.
2018-12-31restructuringin_progressGlobalSemiconductor ProductsUSD 18 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Accrued restructuring and other exit charges of $51.5M at Dec 31, 2018, including $18.0M additions from Microsemi acquisition (employee separation $11.4M, exit costs $6.6M). No employee counts disclosed.
2018-12-31restructuringin_progressSemiconductor productsUSD 3 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred in Q3 2019 related to recent acquisitions, primarily Microsemi. Total employee separation costs for the nine months ended Dec 31, 2018 were $60.5 million. The company states it is not able to estimate future expenses.
2018-12-31restructuringin_progressSemiconductor productsUSD -3 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Contract exit costs (income) for the nine months ended Dec 31, 2018. Related to vacated lease liabilities. Total contract exit costs since fiscal 2016 start are $42.6 million.
2018-12-31restructuringin_progressUSD 41,200,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-12-31restructuringin_progressEmployee Severance [Member]USD 44,100,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-12-31restructuringin_progressFacility Closing [Member]USD -2,900,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-12-31restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-09-30restructuringin_progressSemiconductor products segmentUSD 12 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $12.1 million in the three months ended September 30, 2018, related to the Microsemi acquisition; workforce, property and operating expense rationalizations. Company states it cannot estimate future employee separation costs.
2018-09-30restructuringin_progressSemiconductor products segmentUSD 57 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $57.2 million in the six months ended September 30, 2018, related to the Microsemi acquisition; includes $11.4 million of additions due to the acquisition and $40.1 million of charges in the accrual roll-forward.
2018-09-30acquisition_additioncompleted2018-05-292018-05-29Semiconductor products segmentUSD 8,245 (millions)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Microsemi acquisition completed May 29, 2018 for total consideration of approximately $8.24 billion; no employee headcount added through the acquisition was disclosed.
2018-09-30acquisition_additioncompleted2018-05-292018-05-29GlobalSemiconductor ProductsUSD 22 (millions)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Microsemi acquisition closed 2018-05-29; headcount added not disclosed. Charge reflects acquisition-related costs.
2018-09-30restructuringin_progressGlobalSemiconductor ProductsUSD 57 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Employee separation costs for six months ended 2018-09-30 related to Microsemi integration; number of employees affected not disclosed. Additional restructuring costs expected as synergies are identified.
2018-09-30restructuringin_progressGlobalSemiconductor ProductsUSD 4 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Intangible asset impairment charges for six months ended 2018-09-30 from writing off Microsemi intangibles and assets impaired by combined product roadmap changes.
2018-09-30restructuringin_progress2018-05-29GlobalSemiconductor ProductsUSD 12 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs related to Microsemi acquisition. Specific headcount not disclosed.
2018-09-30restructuringin_progress2018-05-29GlobalSemiconductor ProductsUSD 57 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
YTD employee separation costs related to Microsemi acquisition. Specific headcount not disclosed.
2018-09-30restructuringin_progress2018-05-29GlobalSemiconductor ProductsUSD 2 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Impairment charges for intangible assets written off due to changes in combined product roadmaps post-acquisition.
2018-09-30restructuringin_progress2018-05-29GlobalSemiconductor ProductsUSD 4 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
YTD impairment charges for intangible assets written off due to changes in combined product roadmaps post-acquisition.
2018-09-30restructuringin_progressUSD 37,100,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-09-30restructuringin_progressEmployee Severance [Member]USD 40,100,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-09-30restructuringin_progressFacility Closing [Member]USD -3,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-09-30restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-06-30restructuringin_progressSemiconductor products segmentUSD 45 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs tied to Microsemi acquisition; workforce, property and operating expense rationalizations. No employee count disclosed. Restructuring accrual balance of $83.0 million at June 30, 2018.
2018-06-30acquisition_additioncompleted2018-05-292018-05-29Semiconductor products segmentbusiness_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Microsemi acquisition completed May 29, 2018; headcount added not disclosed. Assumed equity awards measured at $175.4 million fair value.
2018-06-30acquisition_additioncompleted2018-05-29United States (Aliso Viejo, California headquarters); global operationsSemiconductor productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Microsemi acquisition closed 2018-05-29 for ~$8.25B total consideration; no headcount added disclosed. Date shown is the closing date, as the original deal announcement date is not stated in this filing. $22.0M acquisition costs expensed (non-workforce).
2018-06-30restructuringin_progressNot specifiedSemiconductor products segment (all restructuring activities)USD 45 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Employee separation costs of $45.1M incurred in Q1 FY2019 tied to the Microsemi acquisition (workforce, property and operating expense rationalizations). Restructuring accrual roll-forward shows $29.2M in-period separation charges plus $11.4M additions from the Microsemi acquisition; no employee count disclosed. Company states it cannot estimate total or future separation costs; decisions made on a rolling basis. Announcement date not disclosed; restructuring followed the 2018-05-29 acquisition close.
2018-06-30restructuringin_progress2018-05-29GlobalSemiconductor ProductsUSD 45 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs related to the Microsemi acquisition. The filing states the company is not able to estimate the total amount of expected employee separation costs in advance.
2018-06-30restructuringin_progress2018-05-29GlobalSemiconductor ProductsUSD 2 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Impairment charges recognized as a result of writing off intangible assets purchased from Microsemi prior to the close of the acquisition.
2018-06-30restructuringin_progress2018-05-29GlobalSemiconductor ProductsUSD -7 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Income attributable to a change in assumptions on the vacated lease liability related to Atmel causing a change in timing and amount of cash flows.
2018-06-30restructuringin_progressUSD 22,200,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-06-30restructuringin_progressEmployee Severance [Member]USD 29,200,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-06-30restructuringin_progressFacility Closing [Member]USD -7,000,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-06-30restructuringin_progressOther Restructuring [Member]USD 0 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2018-03-31restructuringin_progressUnited StatesSemiconductor productsUSD 1 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2018 employee separation costs tied to the Atmel acquisition; filer states these activities are now substantially complete. A $0.8M employee separation accrual and $27.3M exit-cost accrual remained at year-end. No affected-employee count disclosed.
2018-03-31acquisition_additionannounced4,8002018-03-01United States (Aliso Viejo, California headquarters; global operations)Aerospace and defense, communications, data center, industrialsubsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Pending acquisition of Microsemi Corporation at $68.78/share; count is Microsemi's disclosed global headcount, not a Microchip net addition. Filer expected closing in late May/early June 2018; no completion date stated precisely.
2018-03-31restructuringcompletedGlobalSemiconductor ProductsUSD 1 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Employee separation costs incurred in connection with the acquisition of Atmel. The filing states these activities are substantially complete.
2018-03-31restructuringcompletedGlobalSemiconductor ProductsUSD 1 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Contract exit costs incurred in connection with acquisition-related restructuring activities. The filing states these activities are substantially complete.
2018-03-31restructuringin_progressUSD 1,900,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2018-03-31restructuringin_progressEmployee Severance [Member]USD 1,200,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2018-03-31restructuringin_progressFacility Closing [Member]USD 700,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2017-12-31restructuringin_progressSemiconductor productsUSD 2 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Employee separation costs of $1.5 million for the nine months ended December 31, 2017; no employee counts disclosed. Restructuring accrual balance of $50.8 million at December 31, 2017 includes $2.2 million employee separation and $48.6 million exit costs.
2017-12-31restructuringin_progressOregonSemiconductor productsUSD 20 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Charge for fees associated with transitioning from the public utility provider in Oregon to a lower cost direct access provider; not a workforce reduction.
2017-12-31restructuringin_progressGlobalSemiconductor ProductsUSD 22 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Restructuring accrual roll-forward for nine months ended Dec 31, 2017 shows $21.5M in charges (employee separation $1.5M, exit costs $20.1M); no employee count disclosed. Activities described as substantially complete since March 31, 2017.
2017-12-31plant_closurecompletedUnited States (San Jose, California)Semiconductor Products — Wafer FabricationMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Sale of decommissioned San Jose wafer fabrication facility completed during nine months ended Dec 31, 2017 for $10.0M proceeds; no associated headcount reduction disclosed.
2017-12-31restructuringin_progressSemiconductor productsUSD 0 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred in Q3 FY2018. Filing states activities are substantially complete.
2017-12-31restructuringin_progressSemiconductor productsUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred YTD FY2018. Filing states activities are substantially complete.
2017-12-31restructuringin_progressSemiconductor productsUSD 0 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Contract exit costs (income) incurred in Q3 FY2018. Filing states activities are substantially complete.
2017-12-31restructuringin_progressSemiconductor productsUSD 20 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Contract exit costs incurred YTD FY2018. Includes $19.5M charge for Oregon utility transition fees.
2017-12-31restructuringin_progressUSD 21,534,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-12-31restructuringin_progressEmployee Severance [Member]USD 1,477,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-12-31restructuringin_progressFacility Closing [Member]USD 20,057,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-09-30restructuringin_progressSemiconductor products segmentUSD 20 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Quarterly special charges of $19.9 million, primarily a $19.5 million contract exit fee for transitioning from a public utility provider in Oregon to a direct access provider; no employee counts disclosed. Employee separation costs of $0.3 million in the quarter; restructuring activities related to Atmel and Micrel acquisitions substantially complete at March 31, 2017.
2017-09-30restructuringin_progressSemiconductor products segmentUSD 17 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Six-month special charges of $17.1 million including $1.4 million employee separation costs, $20.2 million contract exit costs, offset by a $4.4 million gain on sale of assets; no employee counts disclosed.
2017-09-30restructuringin_progressSemiconductor productsUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred in the three months ended Sept 30, 2017. Part of ongoing restructuring from Atmel and Micrel acquisitions.
2017-09-30restructuringin_progressSemiconductor productsUSD 20 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Contract exit costs incurred in the six months ended Sept 30, 2017. Includes $19.5M charge for transitioning utility provider in Oregon.
2017-09-30restructuringin_progressUSD 21,541,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-09-30restructuringin_progressEmployee Severance [Member]USD 1,387,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-09-30restructuringin_progressFacility Closing [Member]USD 20,154,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-06-30restructuringin_progressSemiconductor productsUSD 2 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Quarterly restructuring charges of $1.1M employee separation and $0.6M contract exit costs tied to Atmel and Micrel integration; activities substantially complete at March 31, 2017. No employee counts disclosed.
2017-06-30divestiture_reductioncompleted2016-11-102017-03-31Mobile touch operationsother
f5-10q / GLM-5.3-flash-fp4-HTML
Sale of mobile touch assets to Solomon Systech completed November 10, 2016; transition services substantially complete as of March 31, 2017. No headcount figures disclosed.
2017-06-30restructuringin_progressSemiconductor productsUSD 2 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Post-Atmel/Micrel integration restructuring; $1.1M employee separation and $0.6M exit costs accrued in Q1 FY2018. Filer states activities were substantially complete at March 31, 2017; no employee counts disclosed. Restructuring accrual balance $35.9M at June 30, 2017.
2017-06-30restructuringin_progressGlobalSemiconductor productsUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs incurred related to recent business combinations including Atmel and Micrel. Filing states activities are substantially complete but does not disclose specific headcount affected in this period.
2017-06-30restructuringin_progressGlobalSemiconductor productsUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Contract exit costs incurred related to recent business combinations. Filing states activities are substantially complete.
2017-06-30restructuringin_progressUSD 1,672,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-06-30restructuringin_progressEmployee Severance [Member]USD 1,086,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-06-30restructuringin_progressFacility Closing [Member]USD 586,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2017-03-31restructuringin_progressNot specifiedCompany-wide; Atmel and Micrel acquisition integration (workforce, property and operating expense rationalizations, combined product roadmaps and manufacturing operations)USD 99 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2017 special charges of $98.6M comprised employee separation costs $39.2M, exit costs $44.0M (of which $39.0M recorded in Q4), intangible asset impairment $12.6M, and other $2.8M. Restructuring accrual charges of $83.2M plus $6.3M additions from the Atmel acquisition; $40.3M accrual balance at 2017-03-31 ($5.5M accrued, $34.8M other long-term). Number of employees affected not disclosed.
2017-03-31acquisition_additioncompleted2016-01-192016-04-04United States (San Jose, California headquarters) and global operationsSemiconductor productsbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Atmel acquired 2016-04-04 for total consideration of approximately $3.47 billion; headcount added through the acquisition not disclosed. Atmel results included in consolidated statements from acquisition date.
2017-03-31divestiture_reductioncompleted2016-11-10GlobalMobile touch operations (Atmel touch product line)discontinued_operations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Mobile touch assets sold to Solomon Systech (Limited) International on 2016-11-10; presented as discontinued operations with FY2017 net loss of $6.0M. Headcount removed through the disposition not disclosed.
2017-03-31plant_closurecompleted2017-03-31San Jose, California, United States6-inch wafer fabrication facility acquired in the Micrel acquisitionItem_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Products transitioned to Fab 2, Fab 4 and Fab 5; facility decommissioned in the quarter ended 2016-12-31 and presented as held for sale at 2017-03-31, with sale completed after year-end for $10.0M proceeds. Associated workforce reduction not disclosed.
2017-03-31restructuringin_progressUSD 39 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Employee separation costs incurred in fiscal 2017 related to restructuring activities including workforce rationalizations following acquisitions.
2017-03-31restructuringin_progressUSD 44 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Exit costs incurred in fiscal 2017 related to contract exit costs and other operating expenses from restructuring activities.
2017-03-31acquisition_additioncompleted2016-04-04business_combinations_footnote
f5-10k / Qwen3.6-27B-Q8_0
Acquisition of Atmel closed on April 4, 2016. Headcount added not explicitly quantified in the filing.
2017-03-31restructuringin_progressUSD 83,223,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2017-03-31restructuringin_progressEmployee Severance [Member]USD 39,183,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2017-03-31restructuringin_progressFacility Closing [Member]USD 44,040,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2016-12-31restructuringin_progressUSD 21 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Restructuring from Atmel and Micrel acquisitions: employee separation costs $6.5M, impairment charges $8.1M, exit costs $4.2M, other $2.1M in the quarter; no employee counts disclosed. Restructuring accrual of $9.5M at December 31, 2016 included in accrued liabilities.
2016-12-31restructuringin_progressUSD 53 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Nine-month restructuring charges: employee separation costs $35.3M, impairment charges $10.0M, exit costs $4.2M, other $2.9M; no employee counts disclosed.
2016-12-31divestiture_reductioncompleted2016-11-102016-11-10Mobile touch operations (acquired with Atmel)USD 1 (millions)other
f5-10q / GLM-5.3-flash-fp4-HTML
Sale of mobile touch assets to Solomon Systech (Limited) International completed November 10, 2016; gain on sale of $0.6M; headcount transferred not disclosed.
2016-12-31plant_closurein_progressSan Jose, CaliforniaWafer fabrication (facility acquired with Micrel)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
San Jose 6-inch wafer fab decommissioned during the December 2016 quarter; products transitioned to Fab 2 and Fab 4; assets presented as held for sale. Headcount impact not disclosed.
2016-12-31restructuringin_progress2016-04-04GlobalMultiple — workforce, property, and operating expense rationalizationsUSD 53 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Nine-month restructuring charges of $52.5M including $35.3M employee separation costs, $10.0M impairment charges, $4.2M exit costs, and $2.9M other. No employee headcount affected disclosed. Restructuring accrual balance of $9.5M at quarter-end.
2016-12-31acquisition_additioncompleted2016-04-042016-04-04GlobalSemiconductor productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Atmel acquisition closed 2016-04-04 for ~$3.47B total consideration. No headcount added through the acquisition is disclosed in this filing.
2016-12-31divestiture_reductioncompleted2016-11-102016-11-10GlobalMobile touch operations (discontinued operations)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Sale of Atmel mobile touch assets to Solomon Systech completed 2016-11-10. No employee count associated with the divestiture is disclosed.
2016-12-31plant_closurein_progress2016-10-012017-12-31San Jose, California, United States6-inch wafer fabrication facility (acquired from Micrel)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
San Jose fab decommissioned during the December 2016 quarter; assets classified as held for sale. Company expects to sell within one year. No employee count disclosed.
2016-12-31restructuringin_progressUSD 7 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs for the three months ended Dec 31, 2016. Related to Atmel and Micrel acquisitions.
2016-12-31restructuringin_progressUSD 35 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee separation costs for the nine months ended Dec 31, 2016. Related to Atmel and Micrel acquisitions.
2016-12-31restructuringin_progressUSD 4 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Exit costs for the nine months ended Dec 31, 2016.
2016-12-31restructuringin_progressUSD 10 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Impairment charges for the nine months ended Dec 31, 2016. Result of changes in combined product roadmaps after Atmel acquisition.
2016-12-31acquisition_additioncompleted2016-04-04Semiconductor productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Atmel Corporation completed on April 4, 2016. Headcount not explicitly disclosed.
2016-12-31acquisition_additioncompleted2015-08-03Semiconductor productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Micrel, Incorporated completed on August 3, 2015. Headcount not explicitly disclosed.
2016-12-31divestiture_reductioncompleted2016-11-10Mobile touch operationsdiscontinued_operations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Sale of mobile touch assets to Solomon Systech completed on November 10, 2016. Headcount not explicitly disclosed.
2016-12-31restructuringin_progressUSD 39,569,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2016-12-31restructuringin_progressEmployee Severance [Member]USD 35,346,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2016-12-31restructuringin_progressFacility Closing [Member]USD 4,223,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2016-09-30divestiture_reductionannounced2016-11-012016-11-15Mobile touch business (discontinued operations)subsequent_events
f5-10q / GLM-5.3-flash-fp4-HTML
Agreement to sell mobile touch business assets acquired from Atmel to Solomon Systech; sale of products, equipment and patents plus a license to related IP, with transition services. No employee counts disclosed.
2016-09-30acquisition_additioncompleted2016-01-192016-04-04Global (San Jose, California HQ)Semiconductor productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Atmel became a wholly owned subsidiary on 2016-04-04; filing does not disclose headcount added.
2016-09-30restructuringin_progressNot specifiedNot specifiedUSD 32 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Six months ended 2016-09-30 special charges for severance, office closing and acquisition-related costs; $25.6M paid in period; no employee count disclosed.
2016-09-30divestiture_reductionannounced2016-11-012016-11-30Not specifiedMobile touch business (discontinued operations)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Agreement to sell mobile touch business assets to Solomon Systech; expected to close mid-November 2016; no headcount disclosed.
2016-09-30restructuringin_progressUSD 10 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Sept 30, 2016. Employee count not disclosed.
2016-09-30restructuringin_progressUSD 32 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charges related to severance, office closing and other costs associated with acquisition activity for the six months ended Sept 30, 2016. Employee count not disclosed.
2016-09-30acquisition_additioncompleted2016-04-04Semiconductor productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Atmel Corporation completed on April 4, 2016. Headcount added not explicitly disclosed in this filing.
2016-09-30acquisition_additioncompleted2015-08-03Semiconductor productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Micrel, Incorporated completed on August 3, 2015. Headcount added not explicitly disclosed in this filing.
2016-06-30acquisition_additioncompleted2016-04-042016-04-04Semiconductor productsbusiness_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Company acquired Atmel on April 4, 2016; no employee headcount figures disclosed in the acquisition footnote.
2016-06-30restructuringin_progressUSD 22 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Special charges of $22.0 million for severance, office closing and other acquisition-related costs; $17.0 million paid during the quarter. No employee counts disclosed.
2016-06-30divestiture_reductionin_progress2016-04-04Mobile touch businessother
f5-10q / GLM-5.3-flash-fp4-HTML
Mobile touch business acquired with Atmel is held for sale; no headcount figures disclosed.
2016-06-30restructuringin_progressUSD 22 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance, office closing, and other acquisition-related costs of $22.0 million for the quarter; $17.0 million paid during the quarter. No employee count disclosed.
2016-06-30acquisition_additioncompleted2016-01-192016-04-04GlobalSemiconductor productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Atmel acquisition closed 2016-04-04; headcount added not disclosed. Related equity awards assumed had $95.9M fair value, with $43.2M share-based compensation recognized in the quarter, including $37.1M from accelerated vesting on termination of certain Atmel employees.
2016-06-30divestiture_reductionin_progress2016-04-04Mobile touch business (discontinued operations)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Mobile touch business acquired with Atmel has been marketed for sale since 2016-04-04 as it was not a strategic fit; associated headcount not disclosed.
2016-06-30restructuringin_progress2016-04-04GlobalVariousUSD 22 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charges related to severance, office closing and other costs associated with acquisition activity. $17.0 million paid during the quarter.
2016-06-30acquisition_additioncompleted2016-04-04GlobalSemiconductor Productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Atmel Corporation completed. Headcount not explicitly disclosed.
2016-06-30acquisition_additioncompleted2015-08-03GlobalSemiconductor Productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Micrel, Incorporated completed in prior period but impacts current quarter operations. Headcount not explicitly disclosed.
2016-03-31acquisition_additioncompleted2015-08-032015-08-03San Jose, California, United StatesSemiconductor products (analog, power and mixed-signal)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Micrel acquired August 3, 2015 for approximately $816.2 million total consideration; acquired headcount not disclosed. Micrel net sales included in FY2016 were approximately $116.4 million.
2016-03-31restructuringin_progressAcquisition-related integrationUSD 11 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2016 special charges of $11.2 million for severance, office closing and other costs tied to acquisition activity, partly offset by an $11.5 million insurance settlement; net special charges were $4.0 million. Employees affected and completion timing not disclosed.
2016-03-31acquisition_additioncompleted2016-04-042016-04-04San Jose, California, United StatesSemiconductor products (microcontrollers, touch, mixed-signal, RF)subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Atmel acquired April 4, 2016 (after fiscal year-end, before filing date) for approximately $3.47 billion total consideration; acquired headcount not disclosed. No Atmel sales or expenses included in FY2016 results.
2016-03-31restructuringcompletedUSD 11 (millions)Item 6. Selected Financial Data
f5-10k / Qwen3.6-27B-Q8_0
Fiscal 2016 special charges included $11.2 million related to severance, office closing and other costs associated with acquisition activity.
2016-03-31acquisition_additioncompleted2015-08-03Item 1. Business
f5-10k / Qwen3.6-27B-Q8_0
Acquisition of Micrel closed August 3, 2015. Employee count not explicitly disclosed in filing.
2016-03-31acquisition_additioncompleted2014-07-17Item 1. Business
f5-10k / Qwen3.6-27B-Q8_0
Acquisition of controlling interest in ISSC closed July 17, 2014. Employee count not explicitly disclosed in filing.
2016-03-31acquisition_additioncompleted2014-04-01Item 1. Business
f5-10k / Qwen3.6-27B-Q8_0
Acquisition of Supertex closed April 1, 2014. Employee count not explicitly disclosed in filing.
2016-03-31restructuringin_progressUnusual or Infrequent Item [Member]USD 11,200,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2015-12-31acquisition_additioncompleted2015-08-03United StatesSemiconductor productsUSD 10 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Micrel acquisition closed August 3, 2015; nine-month special charges include severance and office closing costs tied to acquisition activity, but no employee counts disclosed. Micrel operations fully integrated as of November 1, 2015.
2015-12-31restructuringcompletedUSD 2 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Special charges of $2.2 million related to severance, office closing and other costs associated with acquisition activity in the three months ended Dec 31, 2015.
2015-12-31restructuringcompletedUSD 10 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Special charges of $10.4 million related to severance, office closing and other costs associated with acquisition activity in the nine months ended Dec 31, 2015.
2015-12-31restructuringin_progressUnusual or Infrequent Item [Member]USD 2,200,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2015-09-30acquisition_additioncompleted2015-08-03United StatesSemiconductor productsUSD 7 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Micrel acquisition closed August 3, 2015; special charges of $6.6M (three months) and $8.2M (six months) relate to severance, office closing and other acquisition-related costs. No employee headcount figures disclosed.
2015-09-30restructuringin_progressUSD 7 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Special charges for severance, office closing and other acquisition-related costs; $6.6M in Q2 and $8.2M YTD. No employee counts or timing disclosed.
2015-09-30acquisition_additioncompleted2015-08-032015-08-03United StatesSemiconductor productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Micrel acquisition closed 2015-08-03; headcount added not disclosed in filing.
2015-09-30restructuringcompletedUSD 7 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Sept 30, 2015.
2015-09-30restructuringcompletedUSD 8 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charges related to severance, office closing and other costs associated with acquisition activity for the six months ended Sept 30, 2015.
2015-06-30restructuringin_progressAcquisition-related (severance, office closing)USD 2 (millions)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Quarterly special charges of $1.6 million for severance, office closing and other acquisition-related costs; no employee counts or timing disclosed.
2015-06-30acquisition_additioncompleted2015-05-072015-08-03United Statessubsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Micrel acquisition completed 2015-08-03 for ~$430 million cash plus 8,626,795 shares; no headcount added disclosed.
2015-06-30acquisition_additioncompleted2015-06-30Taiwanbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Company completed purchase of the remaining ISSC Technologies shares during the quarter, reaching 100% ownership; no employee count disclosed.
2015-06-30restructuringcompletedUSD 2 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charges related to severance, office closing and other costs associated with acquisition activity.
2015-03-31acquisition_additioncompleted2014-04-01United States (Sunnyvale, California)Analog, interface and mixed signal productsbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Wholly-owned acquisition of Supertex Inc. completed April 1, 2014; headcount added not disclosed.
2015-03-31acquisition_additionin_progress2014-07-17TaiwanWireless / IoT (semiconductor products)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Tender offer for 83.5% of ISSC completed July 17, 2014; ownership reached approximately 94.1% at March 31, 2015, with the remaining noncontrolling interest expected to be acquired in the June 2015 quarter. Headcount added not disclosed.
2015-03-31plant_closurecompleted2015-03-31United States (San Jose, California)Wafer fabrication (6-inch fab acquired with Supertex)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Fab was shut down during the March 2015 quarter and is being decommissioned; exact date within the quarter not disclosed. Associated workforce reduction not quantified.
2015-03-31plant_closurecompleted2015-03-31Hong KongTest facility (acquired with Supertex)Item_1_Business
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Test facility shut down during the March 2015 quarter; exact date within the quarter not disclosed. Associated workforce reduction not quantified.
2015-03-31restructuringin_progressNot specifiedAcquisition-related integrationUSD 3 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Fiscal 2015 special charges of $2.8 million for severance, office closing and other costs tied to acquisition activity; employees affected not disclosed. Amount is the full-year fiscal 2015 charge.
2015-03-31acquisition_additionannounced2015-05-072015-09-30United StatesSemiconductor productssubsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Definitive agreement to acquire Micrel, Incorporated at $14.00 per share (~$839 million equity value); expected to close early in the third quarter of calendar 2015, subject to Micrel shareholder and regulatory approvals. Headcount to be added not disclosed.
2015-03-31restructuringcompletedUSD 3 (millions)Item 1. Business - Special Charges
f5-10k / Qwen3.6-27B-Q8_0
Fiscal 2015 special charges of $2.8 million related to severance, office closing and other costs associated with acquisition activity.
2015-03-31acquisition_additioncompleted2014-07-17TaiwanSemiconductor Productsbusiness_combinations_footnote
f5-10k / Qwen3.6-27B-Q8_0
Acquired controlling interest in ISSC Technologies Corporation. Headcount not explicitly disclosed.
2015-03-31acquisition_additioncompleted2014-04-01United StatesSemiconductor Productsbusiness_combinations_footnote
f5-10k / Qwen3.6-27B-Q8_0
Acquired Supertex Inc. Headcount not explicitly disclosed.
2015-03-31acquisition_additioncompleted2014-04-30United StatesAnalog and mixed-signal products (Supertex)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Supertex acquired April 2014; referenced only via assumption of 404,856 shares under the Supertex 2009 Equity Plan. No employee headcount added disclosed.
2015-03-31acquisition_additioncompleted2014-07-31United StatesWireless connectivity (ISSC / ISSC 2011 Equity Plan)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML
ISSC acquired July 2014; referenced only via assumption of 60,883 option shares. No employee headcount added disclosed.
2014-12-31acquisition_additioncompleted2014-07-17TaiwanSemiconductor productsbusiness_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Acquired 83.5% controlling interest in ISSC Technologies; no employee headcount figures disclosed. Ownership increased to approximately 91.1% by December 31, 2014.
2014-12-31acquisition_additioncompleted2014-04-01United StatesSemiconductor productsbusiness_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Acquired Supertex Inc. for $391.8 million; no employee headcount figures disclosed.
2014-12-31restructuringcompletedUSD 1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Special charges of $1.0 million (three months) and $2.1 million (nine months) for severance, office closing and other costs associated with acquisition activity; employee counts not disclosed.
2014-12-31acquisition_additioncompleted2014-07-17TaiwanSemiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquired 83.5% interest in ISSC Technologies; ownership reached 91.1% by quarter-end. Headcount added not disclosed.
2014-12-31acquisition_additioncompleted2014-04-01United StatesSemiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquired Supertex Inc. for $391.8 million; fully integrated by July 1, 2014. Headcount added not disclosed.
2014-12-31restructuringin_progressUSD 2 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Special charges for severance, office closing and acquisition-related costs; employee counts not disclosed.
2014-12-31plant_closureannounced2015-03-31San Jose, California, United StatesSemiconductor Products — Wafer FabricationMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Plan to shut down San Jose fab acquired with Supertex and transfer wafer production to Fab 2 within six months; workforce impact not quantified.
2014-12-31plant_closureannounced2015-03-31Hong KongSemiconductor Products — Test OperationsMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Test facility acquired with Supertex planned for shutdown during March 2015 quarter; workforce impact not quantified.
2014-12-31restructuringcompletedUSD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Special charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Dec 31, 2014.
2014-12-31restructuringcompletedUSD 2 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Special charges related to severance, office closing and other costs associated with acquisition activity for the nine months ended Dec 31, 2014.
2014-09-30restructuringin_progressUSD 1 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance, office closing, and other costs tied to acquisition activity; no employee count disclosed.
2014-09-30restructuringin_progressUSD 1 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Six-month YTD figure for same acquisition-related severance and office closing costs; no employee count disclosed.
2014-09-30restructuringcompletedUSD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Special charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Sept 30, 2014.
2014-09-30restructuringcompletedUSD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Special charges related to severance, office closing and other costs associated with acquisition activity for the six months ended Sept 30, 2014.
2014-06-30acquisition_additioncompleted2014-04-012014-04-01United States (Sunnyvale, California)Semiconductor productsUSD 392 (millions)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Acquisition of Supertex Incorporated completed April 1, 2014 for $391.8 million total consideration; no employee headcount figures disclosed. Supertex results consolidated from acquisition date.
2014-06-30acquisition_additionannounced2014-07-14TaiwanSemiconductor products (Bluetooth/wireless, IoT)USD 329 (millions)subsequent_events
f5-10q / GLM-5.3-flash-fp4-HTML
Tender offer for ISSC Technologies completed July 14, 2014; ~83.46% of shares tendered at NT$143 (~US$4.74) per share; total equity value ~$328.5 million. Consolidation to begin in quarter ended September 30, 2014. No headcount disclosed.
2014-06-30acquisition_additioncompleted2014-04-01United StatesSemiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Supertex completed 2014-04-01 for $391.8M; headcount added not disclosed.
2014-06-30acquisition_additionannounced2014-07-14TaiwanSemiconductor Productssubsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Tender offer for ISSC Technologies completed 2014-07-14 (~83.46% of shares); consolidation begins quarter ended 2014-09-30. Headcount added not disclosed.
2014-06-30restructuringcompletedUSD 0 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charges related to severance, office closing and other costs associated with acquisition activity.
2014-06-30acquisition_additioncompleted2014-04-01Sunnyvale, CaliforniaSemiconductor productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Supertex Incorporated completed on April 1, 2014. Employee count not disclosed.
2014-03-31restructuringcompletedUSD 3 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
FY2014 special charges for severance, office closing and other acquisition-related costs; per Note 4 the $3.0M comprises $1.7M acquisition expenses and $1.4M contingent consideration adjustment. No employee count disclosed.
2014-03-31acquisition_additioncompleted2014-02-092014-04-01United StatesAnalog and mixed-signal productssubsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Supertex acquisition closed 2014-04-01 for approximately $234.2M net of acquired cash; no headcount disclosed.
2014-03-31acquisition_additionannounced2014-05-22TaiwanWireless connectivitysubsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Definitive agreement to acquire ISSC Technologies via tender offer at NT$143 per share, total equity value about $328.5M; no headcount disclosed.
2014-03-31acquisition_additioncompleted2013-11-21business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of remaining 81.7% interest completed 2013-11-21 for $9.0M net of cash; no headcount disclosed.
2014-03-31restructuringcompletedUSD 2 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Fiscal 2014 special charges of $1.7 million related to severance, office closing and other costs associated with acquisition activity.
2014-03-31acquisition_additioncompleted2014-04-01United States, Hong Kongsubsequent_events
f5-10k / Qwen3.6-27B-Q8_0
Acquisition of Supertex Inc. closed April 1, 2014. Supertex has offices, manufacturing and research facilities in California and Hong Kong.
2013-12-31restructuringin_progressAcquisition-related integrationUSD 3 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Nine months ended 2013-12-31 severance, office closing and other acquisition-related costs of $2.5M ($0.8M in the quarter); no employee count disclosed.
2013-12-31restructuringcompletedUSD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Severance-related, office closing and other costs associated with acquisition activity for the three months ended Dec 31, 2013.
2013-12-31restructuringcompletedUSD 3 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Severance-related, office closing and other costs associated with acquisition activity for the nine months ended Dec 31, 2013.
2013-12-31restructuringin_progressUnusual or Infrequent Item [Member]USD 2,500,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2013-09-30restructuringcompletedUSD 0 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Severance-related, office closing, and other costs associated with the acquisition of SMSC incurred in Q2 2014.
2013-09-30restructuringcompletedUSD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Severance-related, office closing, and other costs associated with the acquisition of SMSC incurred YTD 2014.
2013-09-30restructuringin_progressSMSC Acquisition [Member] / Unusual or Infrequent Item [Member]USD 700,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2013-06-30restructuringcompletedSMSC acquisition integrationUSD 0 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Severance-related, office closing, and other costs associated with the SMSC acquisition; no employee count disclosed. Total special charges of $1.7 million also included a $1.4 million contingent consideration fair value increase.
2013-06-30restructuringcompletedUSD 0 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Severance-related, office closing, and other costs associated with the acquisition of SMSC.
2013-06-30restructuringin_progressSMSC Acquisition [Member] / Unusual or Infrequent Item [Member]USD 300,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2013-03-31acquisition_additioncompleted2012-04-182012-04-18United States (Los Gatos, California)Semiconductor productsbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Privately-held low-power Wi-Fi/Bluetooth company acquired for approximately $20.6 million plus contingent consideration; acquired headcount not disclosed.
2013-03-31acquisition_additioncompleted2012-08-022012-08-02United States (Hauppauge, New York)Semiconductor productsbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
SMSC acquired for $37.00 per share, total consideration $919.6 million; SMSC operations fully integrated as of December 1, 2012. Acquired headcount not disclosed; SMSC contributed $234.3 million of net sales in fiscal 2013.
2013-03-31restructuringcompleted2012-08-022013-03-31United StatesCorporate / acquired SMSC operationsUSD 16 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Fiscal 2013 special charges of $16.3 million, primarily severance-related costs plus office closing and other costs tied to the SMSC acquisition; number of employees affected not disclosed. Total fiscal 2013 special charges were $32.2 million, including a $4.4 million contingent-consideration adjustment and an $11.5 million SST-related legal settlement.
2013-03-31restructuringcompletedUSD 16 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Incurred $16.3 million of primarily severance-related costs in addition to office closing and other costs associated with the acquisition of SMSC.
2013-03-31acquisition_additioncompleted2012-08-02MD&A
f5-10k / Qwen3.6-27B-Q8_0
Completed acquisition of SMSC on August 2, 2012. Headcount added not explicitly disclosed.
2013-03-31restructuringin_progressSMSC Acquisition [Member] / Unusual or Infrequent Item [Member]USD 16,300,000 (absolute)restructuring_footnote
f5-10k / no-ai-xblr
2012-12-31restructuringin_progress2012-08-02USD 13 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance, office closing, and other costs tied to SMSC integration; $2.6M incurred in Q3. No employee count disclosed.
2012-12-31acquisition_additioncompleted2012-08-022012-12-01United StatesSemiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
SMSC acquisition closed 2012-08-02; operations fully integrated 2012-12-01. Headcount added not disclosed.
2012-12-31acquisition_additioncompleted2012-04-18United StatesSemiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Roving Networks acquisition closed 2012-04-18. Headcount added not disclosed.
2012-12-31restructuringin_progress2012-08-02USD 3 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance-related, office closing, and other costs associated with the acquisition of SMSC for the three months ended Dec 31, 2012.
2012-12-31restructuringin_progress2012-08-02USD 13 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance-related, office closing, and other costs associated with the acquisition of SMSC for the nine months ended Dec 31, 2012.
2012-12-31othercompletedUSD 12 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Legal settlement costs for certain legal matters related to Silicon Storage Technology, Inc. in excess of previously accrued amounts.
2012-12-31restructuringin_progressSMSC Acquisition [Member] / Unusual or Infrequent Item [Member]USD 13,400,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2012-09-30acquisition_additioncompleted2012-08-02United States (SMSC headquartered in Hauppauge, New York)Semiconductor productsUSD 11 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
SMSC acquisition completed August 2, 2012 for $919.6 million total consideration; special charges of approximately $10.9 million covered severance, office closing and other acquisition-related costs. No employee headcount figures disclosed.
2012-09-30acquisition_additioncompleted2012-08-02United States (Hauppauge, New York)Semiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Standard Microsystems Corporation (SMSC) for $919.6 million; headcount added not disclosed in filing.
2012-09-30restructuringin_progressSMSC acquisition integrationUSD 11 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance, office closing, and other costs tied to SMSC acquisition; employee count not disclosed.
2012-09-30acquisition_additioncompleted2012-04-18United States (Los Gatos, California)Semiconductor Productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Roving Networks for approximately $20.6 million; headcount added not disclosed in filing.
2012-09-30restructuringcompleted2012-08-02USD 11 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance related, office closing, and other costs associated with the acquisition of SMSC. Employee count not disclosed.
2012-09-30acquisition_additioncompleted2012-08-02Semiconductor productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Standard Microsystems Corporation (SMSC). Headcount added not explicitly disclosed.
2012-09-30acquisition_additioncompleted2012-04-18Semiconductor productsbusiness_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of Roving Networks. Headcount added not explicitly disclosed.
2012-09-30restructuringin_progressSMSC Acquisition [Member] / Unusual or Infrequent Item [Member]USD 10,900,000 (absolute)restructuring_footnote
f5-10q / no-ai-xblr
2012-06-30acquisition_additioncompleted2012-04-182012-04-18United States (Los Gatos, California)Semiconductor productsbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquired Roving Networks (low-power embedded Wi-Fi and Bluetooth) for ~$20.6M plus ~$14.7M contingent consideration; no employee headcount disclosed.
2012-06-30acquisition_additionannounced2012-05-012012-08-02United States (New York) with offices in North America, Asia, and EuropeSemiconductor products (mixed-signal connectivity)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Closed 2012-08-02 at $37.00/share cash; financed with ~$258.8M cash and ~$600.0M credit facility borrowings. No employee headcount disclosed.
2012-03-31acquisition_additioncompleted2012-02-092012-02-09GermanySemiconductor products (touch screen IP and solutions)USD 40 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Total consideration approximately $39.5 million; no headcount disclosed for the acquired workforce.
2012-03-31othercompletedPrior-year acquisitionUSD 0 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Fiscal 2012 special charges included $0.3 million of severance-related charges tied to a prior-year acquisition; employee count not disclosed.
2012-03-31acquisition_additionannounced2012-04-19United States (Los Gatos, California)Low-power embedded Wi-Fi and Bluetooth solutionssubsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Announced after fiscal year-end; filer states the acquisition was not material to its financial position. No headcount disclosed.
2012-03-31acquisition_additionannounced2012-05-022012-09-30United States (New York)Smart Mixed-Signal Connectivity (automotive, consumer, PC connectivity)USD 939 (millions)subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Definitive agreement to acquire Standard Microsystems Corporation at $37.00 per share; total equity value ~$939 million, enterprise value ~$766 million. Expected to close in Q3 calendar 2012 (fiscal 2013 Q2 per Note 27); no headcount disclosed. Filer expects to fund with cash and borrowings under its $750 million credit facility.
2012-03-31restructuringcompletedUSD 0 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Severance-related charges related to a prior year acquisition.
2011-12-31restructuringcompletedUSD 0 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Filing reports $0.3 million of severance-related charges included in special income for the three and nine months ended Dec 31, 2011. No employee count disclosed.
2011-09-30restructuringcompletedUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance-related and office closing costs associated with the acquisition of SST. No employee count disclosed.
2011-09-30restructuringcompletedUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
YTD severance-related and office closing costs associated with the acquisition of SST. No employee count disclosed.
2011-06-30restructuringcompletedUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance-related costs associated with the acquisition of SST. All costs paid during the quarter.
2011-03-31acquisition_additioncompleted2010-04-082010-04-08United States (Sunnyvale, California)Semiconductor products; technology licensing; memoryUSD 354 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Silicon Storage Technology, Inc. at $3.05 per share; no employee count disclosed for the acquired workforce.
2011-03-31restructuringcompletedNot specifiedSST acquired operationsUSD 2 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Severance and office closure costs incurred in fiscal 2011 from the SST acquisition; no employee count or completion date disclosed.
2011-03-31divestiture_reductioncompleted2010-05-212010-05-21Not specifiedDiscontinued memory product lines (NAND drives, NAND controllers, Smart Card ICs, Combo Memory and related Flash lines)discontinued_operations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Sale of acquired SST product lines to Greenliant Systems, Ltd.; approximately $23.6 million of assets disposed; no gain or loss recognized and no headcount disclosed.
2011-03-31acquisition_additioncompleted2011-02-162011-02-16ThailandAssembly and test servicesUSD 7 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Two business acquisitions completed in fiscal 2011 in addition to SST, including Millennium Microtech Thailand (MMT) on 2011-02-16; combined consideration net of cash acquired was $6.5 million; no employee counts disclosed. One acquisition carried a bankruptcy reorganization liability of approximately $19.4 million.
2011-03-31restructuringcompleted2010-04-08GlobalGeneralUSD 2 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Severance-related and office closure costs associated with the acquisition of SST incurred during fiscal 2011.
2011-03-31acquisition_additioncompleted2010-04-082010-04-08United StatesSemiconductor products and technology licensingbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Silicon Storage Technology, Inc. for $353.8 million; headcount added not disclosed. SST operations fully integrated as of October 1, 2010.
2011-03-31restructuringcompletedUnited StatesSST acquired operationsUSD 2 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Fiscal 2011 severance-related and office closure costs associated with the SST acquisition; number of employees affected not disclosed.
2011-03-31divestiture_reductioncompleted2010-05-212010-05-21United StatesDiscontinued memory product lines (NAND drives, NAND controllers, Smart Card ICs, Combo Memory and related Flash lines)discontinued_operations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Sale of certain acquired SST product lines to Greenliant Systems, Ltd.; approximately $23.6 million of assets held for sale disposed; headcount removed not disclosed.
2011-03-31acquisition_additioncompleted2011-02-162011-02-16ThailandAssembly and testMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquired to provide assembly and test expansion capabilities; headcount added not disclosed.
2011-03-31acquisition_additioncompletedOtherbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Two additional fiscal 2011 business acquisitions with total consideration of $6.5 million net of cash acquired; one assumed a bankruptcy reorganization liability of approximately $19.4 million; headcount added not disclosed.
2010-12-31restructuringcompletedUSD 2 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance-related and office closing costs tied to the SST acquisition; $0.6M in Q3 and $1.7M YTD. No employee count disclosed.
2010-12-31acquisition_additioncompleted2010-04-08United StatesMultiple (licensing, microcontroller, memory, Wi-Fi)USD 354 (millions)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
SST acquired April 8, 2010 for $353.8M total purchase price. No headcount added disclosed.
2010-12-31divestiture_reductioncompleted2010-05-212010-05-21Memory product lines (NAND Drives, NAND controllers, Smart Card ICs, Combo Memory, Concurrent SuperFlash, Small-Sector Flash, MTP Flash)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Sale of certain SST product lines to Greenliant Systems Ltd. No employee count disclosed.
2010-12-31restructuringcompleted2010-04-08USD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Severance-related and office closing costs associated with the acquisition of SST. Employee count not disclosed.
2010-12-31restructuringcompleted2010-04-08USD 2 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Cumulative YTD severance-related and office closing costs associated with the acquisition of SST. Employee count not disclosed.
2010-09-30acquisition_additioncompleted2010-04-082010-04-08United StatesSemiconductor products; licensing technologybusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
SST acquired in a $353.8 million merger; no employee headcount added was disclosed in the filing.
2010-09-30restructuringin_progress2010-04-08United StatesSST-acquired operationsUSD 1 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance-related and office closing costs tied to the SST acquisition: $0.6M in the three months and $1.0M in the six months ended September 30, 2010; number of employees affected not disclosed.
2010-09-30divestiture_reductioncompleted2010-05-212010-05-21AsiaMemory product lines (NAND drives/controllers, Smart Card ICs, Combo Memory, Concurrent SuperFlash, Small-Sector Flash, MTP Flash)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Sale of approximately $23.6 million of assets to Greenliant Systems Ltd.; no gain or loss recognized and no employee count disclosed.
2010-09-30restructuringcompletedUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance-related and office closing costs associated with the acquisition of SST for the three months ended Sept 30, 2010.
2010-09-30restructuringcompletedUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance-related and office closing costs associated with the acquisition of SST for the six months ended Sept 30, 2010.
2010-06-30acquisition_additioncompleted2010-04-082010-04-08United States (Sunnyvale, California)Semiconductor products; licensing technologyUSD 1 (millions)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
SST acquisition completed April 8, 2010 for $353.8 million; headcount added not disclosed. $0.5 million of severance-related costs associated with the acquisition were incurred and paid during the quarter.
2010-06-30divestiture_reductioncompleted2010-05-212010-05-21Discontinued operations (NAND Drives, NAND controllers, Smart Card ICs, Combo Memory, Concurrent SuperFlash, Small-Sector Flash, MTP Flash)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Sale of SST product lines to Greenliant Systems Ltd.; approximately $23.6 million of assets held for sale disposed. No gain or loss recognized; employee headcount affected not disclosed.
2010-06-30acquisition_additioncompleted2010-04-08United StatesSemiconductor products; Licensing technologybusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Merger completed April 8, 2010 for $353.8 million; headcount added not disclosed in filing.
2010-06-30restructuringcompleted2010-04-082010-06-30SST acquisition integrationUSD 1 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance-related costs from SST acquisition integration; all paid during the quarter; affected employee count not disclosed.
2010-06-30divestiture_reductioncompleted2010-05-212010-05-21Discontinued memory product lines and Wi-Fi power amplifier businessother
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Sale of certain SST-acquired product lines to Greenliant Systems Ltd.; approximately $23.6 million of assets disposed; headcount removed not disclosed.
2010-06-30restructuringcompleted2010-04-082010-06-30USD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Severance-related costs associated with the acquisition of SST. All costs paid during the quarter.
2010-03-31acquisition_additioncompletedbusiness_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
One business acquisition completed during fiscal 2010 for approximately $9.3 million total consideration; headcount added not disclosed.
2010-03-31acquisition_additioncompleted2010-02-022010-04-08USD 354 (millions)subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Silicon Storage Technology, Inc. closed April 8, 2010 for $3.05 per share, $353.8 million total including $58.4 million of shares acquired March 8, 2010; headcount added not disclosed. Charge value represents total purchase consideration, not a workforce charge.
2010-03-31divestiture_reductioncompleted2010-05-24subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Sale of certain non-core assets from the SST acquisition (inventory, equipment, IP and related product lines) consummated May 24, 2010; associated headcount not disclosed.
2009-12-31acquisition_additionannounced2010-02-02subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Definitive agreement signed to acquire Silicon Storage Technology, Inc. at $2.85 per share (~$275 million); expected to close in Q1 fiscal 2011. No headcount added disclosed.
2009-09-30otherin_progressUnited States (Fab 2 and Fab 4)Wafer fabrication operationsMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Rotating unpaid time off implemented at both wafer fabs beginning in fiscal Q3/Q4 2009 to control inventory; reduced production levels continued through fiscal Q2 2010. No employee counts disclosed.
2009-09-30otherin_progressGlobalR&D; Selling, General and AdministrativeMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Cost-cutting actions begun in fiscal 2009 second half, including broad-based salary and compensation reductions, lower travel and other variable expense cuts; no headcount reduction counts disclosed.
2009-09-30othercompleted2009-07-09USD 1 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Patent license settlement with unrelated third-party; $1.2 million expensed in Q1 FY2010.
2009-09-30othercompletedFab 2 and Fab 4ManufacturingMD&A
f5-10q / Qwen3.6-27B-Q8_0
Implemented rotating unpaid time off to control inventory levels due to adverse economic conditions.
2009-06-30othercompleted2009-06-30GlobalAllMD&A
f5-10q / Qwen3.6-27B-Q8_0
Implemented rotating unpaid time off at Fab 2 and Fab 4 to control inventory levels due to adverse economic conditions. No specific employee count or severance charge disclosed.
2009-03-31acquisition_additioncompletedNot disclosedTouch screen controllersUSD 1 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Hampshire Company completed during the third quarter of fiscal 2009 (quarter ended 2008-12-31); exact date and headcount added not disclosed. Charge is in-process R&D, not severance.
2009-03-31acquisition_additioncompletedNot disclosedSoftware development tools and compilersUSD 0 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of HI-TECH Software completed during the fourth quarter of fiscal 2009 (quarter ended 2009-03-31); exact date and headcount added not disclosed. Charge is in-process R&D, not severance.
2009-03-31acquisition_additioncompletedNot disclosedSmoke and carbon monoxide detector and life-safety integrated circuitsUSD 0 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of R&E International completed during the fourth quarter of fiscal 2009 (quarter ended 2009-03-31); exact date and headcount added not disclosed. Charge is in-process R&D, not severance.
2009-03-31othercompletedUnited States (Arizona, Oregon)Wafer fabrication (Fab 2 and Fab 4)MD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
During the third and fourth quarters of fiscal 2009 the company reduced wafer starts and implemented rotating unpaid time off at both fabrication facilities to control inventory; no employee count or headcount reduction disclosed. Related under-absorbed fixed manufacturing costs of $21.4 million were charged to cost of sales for the full year.
2009-03-31othercompletedGlobalCompany-wideMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Cost-cutting actions in the third and fourth quarters of fiscal 2009 included salary reductions, elimination of bonuses and reduced travel costs; no layoffs or headcount reductions disclosed.
2009-03-31otherannounced2009-06-30ThailandAssembly and test operationsMD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Planned multiple plant shutdowns of the Thailand facility in the first quarter of fiscal 2010 to control inventory amid adverse economic conditions; temporary shutdowns rather than facility closure, no headcount impact quantified. Disclosed in the FY2009 10-K as a forward-looking plan.
2008-12-31acquisition_additioncompleted2008-10-15Touch screen controllersUSD 1 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of Hampshire Company announced 2008-10-15; a $0.5M in-process R&D charge was recorded. No headcount added through the acquisition is disclosed.
2008-12-31otherin_progressUnited StatesWafer fabrication (Fab 2 and Fab 4)MD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Rotating unpaid time off implemented at both wafer fabs during the March 2009 quarter to control inventory; no employee count or charge disclosed.
2008-12-31otherannouncedThailandAssembly and test operationsMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Multiple plant shutdowns of the Thailand assembly and test facility planned for Q4 fiscal 2009 to control inventory; no employee count or charge disclosed.
2008-12-31otherannouncedCompany-wideMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Cost-reduction actions in Q4 fiscal 2009 including salary reductions, elimination of bonuses, and reduced discretionary/travel spend; some already taken in Q3. No headcount reduction or employee count disclosed.
2008-12-31otherin_progress2008-12-31United StatesManufacturingMD&A
f5-10q / Qwen3.6-27B-Q8_0
Implementing rotating unpaid time off at Fab 2 and Fab 4 facilities during the March 2009 quarter to control inventory levels.
2008-12-31otherannounced2008-12-31ThailandManufacturingMD&A
f5-10q / Qwen3.6-27B-Q8_0
Planning multiple plant shutdowns of the Thailand assembly and test facility in the fourth quarter of fiscal 2009.
2008-12-31otherin_progress2008-12-31GlobalResearch and DevelopmentMD&A
f5-10q / Qwen3.6-27B-Q8_0
Implementing actions to reduce payroll and discretionary costs, including salary reductions and elimination of bonuses.
2008-12-31otherin_progress2008-12-31GlobalSelling, General and AdministrativeMD&A
f5-10q / Qwen3.6-27B-Q8_0
Implementing actions to reduce payroll and discretionary costs, including salary reductions and elimination of bonuses.
2008-03-31plant_closurecompleted2007-09-212007-10-19Puyallup, Washington, United StatesWafer Fabrication (Fab 3)USD 27 (millions)other
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Unsolicited offer accepted; facility sold October 19, 2007 for $27.5M net cash. Charge is an impairment/loss on sale, not severance. No employee-impact count disclosed.
2007-09-30plant_closurecompleted2007-09-212007-10-19Puyallup, Washington, United StatesWafer fabrication (Fab 3)USD 27 (millions)other
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Unsolicited offer accepted for the Fab 3 facility; sale closed October 19, 2007 for $27.5 million net cash, with a $26.8 million loss recognized. No employee counts, severance amounts, or workforce impacts are disclosed in the filing.
2005-03-31plant_closurecompleted2072003-04-072003-06-30Chandler, ArizonaManufacturingUSD 31,755 (thousands)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Closure of Fab 1 wafer fabrication facility. Reduction in force of 207 employees. Charges included accelerated depreciation and severance.
2004-12-31plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesWafer fabrication (Fab 1) and manufacturing supportUSD 32 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Historical action completed in fiscal Q1 2004 (quarter ended June 30, 2003), not the current reporting period; disclosed in this filing as context for prior-year special charges. Charges included $30.6M accelerated depreciation plus severance, material and other costs in cost of sales, with additional operating-expense special charges. Integration of certain Fab 1 personnel into Fab 2 accompanied the closure.
2004-12-31plant_closurecompleted2072003-04-072003-06-30Chandler, ArizonaManufacturingUSD 32 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Closure of Fab 1 wafer fabrication facility completed in Q2 FY2004. Charges included accelerated depreciation and severance.
2004-09-30plant_closurecompleted2072003-04-072003-06-30Chandler, ArizonaManufacturingUSD 32 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Closure of Fab 1 wafer fabrication facility completed in Q1 FY2004. Reduction in force of 207 employees directly involved in manufacturing or supporting Fab 1. Charges included accelerated depreciation and severance.
2004-06-30plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesWafer fabrication (Fab 1)USD 32 (millions)MD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Closure of Fab 1 wafer fab with integration of certain personnel into Fab 2; reduction in force of 207 manufacturing and support employees. Charges of $30.6M accelerated depreciation plus $1.1M severance/material costs in cost of sales, and $1.6M special charges in operating expenses, all recorded in the prior-year quarter ended June 30, 2003; integration completed during that quarter. Included here as the only workforce action disclosed in this filing.
2004-06-30restructuringcompleted2072003-04-072003-06-30Chandler, ArizonaManufacturingUSD 32 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Closure of Fab 1 wafer fabrication facility completed in Q1 FY2005. Charge includes accelerated depreciation and severance.
2004-03-31plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesWafer fabrication operations (Fab 1) and supporting functionsUSD 865 (thousands)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Special charges of $865 thousand cover contract cancellation, severance and other Fab 1 closure costs; separately, $31.8 million of accelerated depreciation and other charges ($30.6M accelerated depreciation plus $1.1M Fab 1 related charges) were recorded in cost of sales in the quarter ended June 30, 2003 and are not severance. Integration into Fab 2 completed during the quarter ended June 30, 2003.
2004-03-31restructuringcompleted2072003-04-072003-06-30Chandler, ArizonaManufacturingUSD 32 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Closure of Fab 1 wafer fabrication facility. Integration completed June 30, 2003. Charge includes accelerated depreciation and severance.
2003-12-31plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesWafer fabrication (Fab 1) and manufacturing supportUSD 32 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Fab 1 closure with integration of certain personnel into Fab 2 (Tempe, AZ); reduction in force of 207 employees in manufacturing and support functions. Charges in cost of sales of $31.8M ($30.6M accelerated depreciation plus $1.1M severance, material and other costs) recorded in the June 2003 quarter; an additional $1.6M of special charges in operating expenses that quarter. Integration completed during the quarter ended June 30, 2003.
2003-12-31restructuringcompleted2003-04-072003-06-30United StatesOperating expensesUSD 1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Special charges in operating expenses of $1.6M recorded in the June 2003 quarter for contract cancellation, severance and other costs related to the Fab 1 closure and other actions; $0.9M net incurred for the nine months ended December 31, 2003 after a $0.7M reversal in the December 2003 quarter from a favorable contract-cancellation settlement.
2003-12-31plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesManufacturing operations and support functions (Fab 1)USD 33,367 (thousands)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Fab 1 closure with integration into Fab 2; $31,755K charges in cost of sales (incl. $30,608K accelerated depreciation) plus $1,612K of special charges in operating expenses for the quarter ended June 30, 2003. Integration completed during the quarter ended June 30, 2003; $747K of special charges reversed in the quarter ended December 31, 2003.
2003-12-31restructuringcompleted2072003-04-072003-06-30Chandler, ArizonaManufacturing and support functionsUSD 31,755 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Reduction in force of 207 employees directly involved in manufacturing or providing support to Fab 1. Integration completed June 30, 2003. Charges include accelerated depreciation and severance.
2003-09-30plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesWafer fabrication (Fab 1) and related support functionsUSD 33 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Fab 1 closure with integration of certain personnel into Fab 2; reduction in force of 207 employees in manufacturing and support roles. Charges include $30.6M accelerated depreciation plus $1.1M severance/material costs in cost of sales, and $1.6M special charges in operating expenses for contract cancellation, severance and other costs. Integration completed during the quarter ended June 30, 2003.
2003-09-30plant_closurecompleted2072003-04-07Chandler, Arizona, United StatesManufacturing (wafer fabrication, Fab 1)USD 33,367 (thousands)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Reduction in force of 207 employees in manufacturing or Fab 1 support functions; integration into Fab 2 completed during the quarter ended June 30, 2003. Charges comprise $30,608K accelerated depreciation plus $1,147K severance/material/other in cost of sales and $1,612K of special charges in operating expenses (the latter also covers other actions). $712K of such expenditures paid in the six months ended September 30, 2003; about $900K expected to be paid during the remainder of fiscal 2004. Fab 1 space to remain idle with no specific reuse plans.
2003-09-30plant_closurecompleted2072003-04-072003-06-30Chandler, ArizonaManufacturingUSD 31,755 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Closure of Fab 1 wafer fabrication facility; integration of personnel into Fab 2. Charges include accelerated depreciation and severance.
2003-06-30plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesWafer fabrication (Fab 1); certain personnel integrated into Tempe, Arizona Fab 2USD 31,755 (thousands)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Closure of Fab 1 completed during the quarter ended June 30, 2003. Charges in cost of sales of $31,755 thousand comprised $30,608 thousand accelerated depreciation and $1,147 thousand severance, material and other costs. An additional $1,612 thousand of special charges was recorded in operating expenses for contract cancellation, severance and other costs. Approximately $900 thousand of expenditures remained to be paid during the remainder of fiscal 2004.
2003-06-30plant_closurecompleted2072003-04-072003-06-30Chandler, Arizona, United StatesWafer fabrication (Fab 1); personnel and processes integrated into Tempe, Arizona (Fab 2)USD 33 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Reduction in force of 207 employees in manufacturing and Fab 1 support functions; integration completed during the quarter. Total special charges of $33.4M comprise $30.6M accelerated depreciation, $1.1M severance/material/other in cost of sales, and $1.6M special charges in operating expenses. Company incurred $0.7M of expenditures in the quarter with approximately $0.9M to be paid during the remainder of fiscal 2004.
2003-06-30plant_closurecompleted2072003-04-072003-06-30Chandler, ArizonaManufacturing and support functionsUSD 33,367 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Closure of Fab 1 wafer fabrication facility. Charges include $30.6M accelerated depreciation and $1.1M severance/material costs in cost of sales, plus $1.6M special charges in operating expenses.
2003-03-31plant_closureannounced1402003-04-072003-06-30Chandler, Arizona, United StatesWafer Fabrication (Fab 1)subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Announced after fiscal year-end; closure of Fab 1 with integration into Fab 2. Filer expects $27–33M accelerated depreciation and other expenses in Q1 FY2004; no severance charge quantified.
2003-03-31acquisition_additioncompleted2002-06-052002-06-05United StatesSmart battery management (PowerSmart, Inc.)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition completed June 5, 2002 for $54.0M cash; headcount added not disclosed.
2003-03-31reduction_in_forceannounced1402003-04-072003-06-30Chandler, ArizonaFab Operationssubsequent_events
f5-10k / Qwen3.6-27B-Q8_0
Announced April 7, 2003, closure of Fab 1 and integration into Fab 2. Expected to incur accelerated depreciation and other expenses of $27-$33 million in Q1 FY2004.
2002-12-31acquisition_additioncompleted2002-06-05United StatesUSD 9 (millions)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of PowerSmart, Inc. for $54.0M cash; no employee headcount disclosed. $9.3M in-process R&D written off.
2002-12-31acquisition_additioncompleted2002-08-23United StatesManufacturingbusiness_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Fab 4 facility acquired for $183.5M cash plus ~$1.2M acquisition costs; no employee headcount disclosed. Facility expected in production Q2 FY2004.
2002-12-31plant_closurein_progress2002-09-30United StatesManufacturingUSD 42 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Fab 3 (Puyallup, WA) classified as held-for-sale; $41.5M impairment charge ($36.9M facility + $4.6M equipment). No employee count disclosed; equipment transferred to other fabs.
2002-06-30acquisition_additioncompleted2002-06-05United States (Shelton, Connecticut headquarters closed)Battery management / PowerSmart, Inc.USD 1 (millions)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Microchip acquired PowerSmart for $54.0 million cash; liabilities assumed include roughly $0.8 million of severance, exit and lease termination accruals tied to terminating PowerSmart headquarters staff and closing the Shelton, Connecticut leased facility. No headcount figures disclosed.
2002-06-30acquisition_additioncompleted2002-06-052002-06-05United StatesBattery management (PowerSmart, Inc.)USD 54 (millions)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Cash purchase price of $54.0 million; no employee headcount acquired disclosed.
2002-06-30plant_closurein_progress2002-06-05Shelton, Connecticut, United StatesPowerSmart headquarters personnelUSD 1 (millions)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Accrual covers severance, exit and lease termination costs for terminating PowerSmart HQ personnel and closing the Shelton, CT leased facility; employee count not disclosed.
2002-06-30restructuringcompleted2002-06-052002-06-05Shelton, ConnecticutHeadquarters personnelUSD 1 (millions)business_combinations_footnote
f5-10q / Qwen3.6-27B-Q8_0
Accruals for severance, exit and lease termination costs related to terminating employment of headquarters personnel and closing leased facility.
2002-03-31acquisition_additionannounced2002-05-222002-06-07United StatesAnalog / battery managementUSD 54 (millions)subsequent_events
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Cash purchase of PowerSmart, Inc.; no headcount disclosed. Assumed balance sheet includes ~$4.0M cash and other net assets plus certain employee stock options.
2002-03-31restructuringcompleted2001-03-312001-06-30United States; Hong KongManufacturing; Test OperationsUSD 6 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Capacity reduction at Fabs 1 and 2 (Chandler/Tempe, AZ) and closure of Hong Kong test facility. Charge includes $2.1M employee severance. Completion by June 30, 2001.
2001-06-30restructuringin_progress2001-01-16USD 10,949 (thousands)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Merger-related accrual from January 16, 2001 TelCom Semiconductor pooling-of-interests merger; $10.7 million of cash expenses incurred through June 30, 2001, $240 thousand accrual remaining. Employee counts not disclosed.
2001-06-30restructuringin_progress2001-03-31USD 2,454 (thousands)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Restructuring charges taken in quarter ended March 31, 2001, including $2,149 thousand employee severance costs; $2,324 thousand cash expenses incurred through June 30, 2001, $130 thousand accrual remaining. Number of employees affected not disclosed.
2001-06-30plant_closurecompleted2001-04-30ManufacturingMD&A
f5-10q / GLM-5.3-flash-fp4-HTML
One-week plant shutdown in April 2001 as a cost-reduction measure; reduced labor costs in R&D and SG&A and contributed to gross margin factors. Temporary shutdown, not a permanent closure; no headcount impact disclosed.
2001-06-30restructuringin_progressUSD 2,454 (thousands)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance and other restructuring charges recorded in the quarter ended March 31, 2001; $2,324 thousand paid through June 30, 2001, $130 thousand accrual remaining. Employee severance component was $2,149 thousand (fully paid). No employee count disclosed.
2001-06-30othercompleted2001-01-16USD 912 (thousands)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Severance costs associated with the January 16, 2001 merger with TelCom Semiconductor, Inc.; fully paid through June 30, 2001 with no accrual remaining. Merger accounted for as a pooling of interests; no headcount added disclosed.
2001-06-30restructuringin_progress2001-03-31USD 2,149 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Employee severance costs incurred during the quarter ended March 31, 2001. Cash expenses incurred through June 30, 2001 were $2,149 thousand with no remaining accrual.
2001-06-30restructuringin_progress2001-03-31USD 305 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Other restructuring costs incurred during the quarter ended March 31, 2001. Cash expenses incurred through June 30, 2001 were $175 thousand with $130 thousand remaining accrual.
2001-03-31restructuringcompleted2001-02-012001-03-31United States (Chandler and Tempe, Arizona)Wafer fabrication (Fabs 1 and 2)USD 6 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Cumulative wafer fab capacity reduced approximately 24%; charge includes $4.0M equipment write-off, $2.1M severance, $0.3M other. Capacity reduction completed by end of March 2001 quarter. Headcount impact not separately disclosed.
2001-03-31plant_closurein_progress2001-02-012001-06-30Hong KongTest operationsrestructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Hong Kong test facility acquired via TelCom merger to be closed; test requirements migrating to Thailand facility. Expected to reduce operating expenses by $4.4M annually when complete. Charge included in consolidated $6.4M restructuring charge. Headcount impact not disclosed.
2001-03-31acquisition_additioncompleted2001-01-162001-01-16United StatesAnalog and mixed-signal productsUSD 11 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Merger with TelCom Semiconductor completed January 16, 2001; 9,801,456 Microchip shares issued. Headcount added not disclosed. $10.9M special charge for transaction costs including $7.3M investment banking, $1.6M legal/accounting, $0.9M severance.
2001-03-31restructuringin_progress2001-02-012001-06-30GlobalManufacturingUSD 6 (millions)MD&A
f5-10k / Qwen3.6-27B-Q8_0
Announced in February 2001. Includes 24% reduction in wafer fab capacity at Fabs 1 and 2 and closure of Hong Kong test facility. Charge includes $4.0M equipment write-off, $2.1M severance, and $0.3M other costs. Hong Kong closure expected to complete by end of June 2001.
2001-03-31acquisition_additioncompleted2001-01-162001-01-16GlobalAllMD&A
f5-10k / Qwen3.6-27B-Q8_0
Merger with TelCom Semiconductor, Inc. completed January 16, 2001. Specific headcount added not disclosed in filing.
2000-12-31acquisition_additioncompleted2000-10-262001-01-16United StatesAnalog and mixed-signal integrated circuits (TelCom Semiconductor)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of TelCom Semiconductor completed 2001-01-16 as a pooling of interests; 9,801,456 Microchip shares issued and TelCom stock options assumed. Filing does not disclose TelCom headcount added.
2000-12-31acquisition_additionannounced2001-01-16subsequent_events
f5-10q / Qwen3.6-27B-Q8_0
Acquisition of TelCom Semiconductor, Inc. completed Jan 16, 2001. Issued ~9.8M shares and assumed all outstanding TelCom stock options. No specific headcount disclosed.
2000-06-30acquisition_additioncompleted2000-05-232000-07-26Puyallup, Washington, United StatesWafer fabrication / manufacturingUSD 80 (millions)subsequent_events
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Closed 2000-07-26; $80 million cash purchase price for an inoperative semiconductor manufacturing complex from Matsushita Semiconductor Corporation of America. No employee or headcount figures disclosed; facility was inoperative, with equipment installation planned from November 2000 and volume production expected August 2001.
2000-03-31othercompleted2000-04-012000-06-30AmericasSalesUSD 1 (millions)MD&A
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Terminated contractual relationships with predominantly all manufacturers' representatives in the Americas; $0.6M termination costs recorded in quarter ended March 31, 2000. Direct sales force resources to be in place by June 30, 2000. Affects external representatives, not employee headcount.
2000-03-31restructuringcompleted1999-03-311999-03-31United StatesManufacturingUSD 8 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Closure of 5-inch wafer line. Charge includes equipment write-off, severance, and other costs. Employee count not explicitly disclosed.
2000-03-31plant_closurecompleted1999-03-311999-03-31TaiwanTest OperationsUSD 6 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Closure of Kaohsiung facility and migration to Thailand. Charge includes severance and other costs. Employee count not explicitly disclosed.
2000-03-31restructuringcompleted1999-03-311999-03-31GlobalSalesUSD 0 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Restructure of a portion of the sales infrastructure. Employee count not explicitly disclosed.
1999-06-30plant_closurein_progress1999-03-31Chandler, Arizona, United StatesWafer fabricationUSD 13,650 (thousands)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Shutdown of 5-inch wafer production line announced in March 1999 quarter; reduces production capacity by approximately 20%, to be replaced with 8-inch wafer production. No employee count disclosed. Remaining restructuring accrual of $4,311 thousand at June 30, 1999.
1999-06-30plant_closurecompleted1999-03-311999-06-30Kaohsiung, TaiwanTest operationsMD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Test facility in Kaohsiung closed and capacity transferred to the more cost-effective test facility in Thailand; restructuring completed during the June 1999 quarter. No employee count disclosed.
1999-06-30plant_closurein_progressChandler, Arizona (5-inch wafer line); Kaohsiung, Taiwan (test facility)Manufacturing / Test operationsUSD 13,650 (thousands)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Program initiated during the quarter ended March 31, 1999; no specific announcement date or employee-impact count disclosed. Charge line combines 5-inch wafer fab restructuring and Kaohsiung closure; $9,339K paid and $4,311K accrual remaining at June 30, 1999. Kaohsiung test capacity transferred to Thailand.
1999-06-30restructuringin_progressChandler, ArizonaManufacturingUSD 13,650 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
5-inch wafer fab restructuring. Charge incurred in prior quarter (March 1999); $9.3M cash paid, $4.3M remaining accrual as of June 30, 1999.
1999-06-30plant_closurecompletedKaohsiungTest OperationsUSD 0 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Kaohsiung closure included in 5-inch wafer fab restructuring charge. Capacity transferred to Thailand.
1999-06-30restructuringin_progressSalesUSD 350 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Sales infrastructure actions. Charge incurred in prior quarter; $0.15M cash paid, $0.2M remaining accrual as of June 30, 1999.
1999-03-31plant_closurecompleted1999-03-311999-03-31Chandler, Arizona, United StatesWafer fabrication (5-inch wafer line, Fab 1)USD 8 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Closure completed in March 1999 quarter; reduced productive capacity ~20%. Charge comprised $6.758M equipment write-off, $0.310M severance, $0.493M other.
1999-03-31plant_closurein_progress1999-03-311999-09-30Kaohsiung, TaiwanFinal test operationsUSD 6 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Test capacity migrating to Thailand facility over first two quarters of fiscal 2000. Charge comprised $5.579M severance and $0.510M other.
1999-03-31restructuringcompleted1999-03-311999-03-31United StatesSales infrastructureUSD 0 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Restructuring of a portion of sales infrastructure recorded in March 1999 quarter.
1999-03-31restructuringcompleted1999-03-311999-03-31United StatesManufacturingUSD 8 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Closure of 5-inch wafer line at Fab 1. Charge includes $6.758M equipment write-off, $0.31M severance, $0.493M other. Employee count not explicitly disclosed.
1999-03-31restructuringin_progress1999-03-312000-06-30TaiwanManufacturingUSD 6 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Closure of Kaohsiung test facility and migration to Thailand. Charge includes $5.579M severance, $0.51M other. Employee count not explicitly disclosed.
1999-03-31restructuringcompleted1999-03-311999-03-31GlobalSalesUSD 0 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Restructuring of a portion of the Company's sales infrastructure. Employee count not explicitly disclosed.
1998-12-31restructuringannounced1999-03-31ManufacturingMD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Company will close its 5-inch wafer line, its least cost-effective capacity, reducing productive capacity by roughly 20%; capacity to be replaced with 6-inch and 8-inch production once inventories are reduced. Expected special restructuring charge of $15 to $17 million in the March 1999 quarter; no employee count disclosed.
1998-12-31restructuringannounced1999-06-30Assembly and Test OperationsMD&A
f5-10q / GLM-5.3-flash-fp4-HTML
Company plans to restructure assembly and test operations over the next two quarters, migrating more test and a portion of assembly to lower-cost company-owned facilities; part of the same $15-17 million expected restructuring charge as the wafer line closure.
1998-12-31restructuringcompletedSales organizationUSD 1 (millions)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Part of a $5.5 million special charge recognized in the quarter ended June 30, 1998, which also included a $3.3 million legal settlement and a $1.7 million obsolete product write-off; the $0.5 million component related to restructuring a portion of the sales organization. No employee count disclosed.
1998-12-31plant_closureannounced1999-02-121999-03-31United StatesWafer FabricationMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Closure of the 5-inch wafer line in the March 1999 quarter; reduces productive capacity ~20%. Combined with the assembly/test restructuring, expected special restructuring charge of $15-17 million in the March 1999 quarter. No employee count disclosed.
1998-12-31restructuringannounced1999-02-121999-09-30Not specifiedAssembly and Test OperationsMD&A
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Restructuring of assembly and test operations over the next two quarters, migrating test and part of assembly to lower-cost Company-owned facilities. Shares the combined $15-17 million expected charge with the 5-inch wafer line closure. No employee count disclosed.
1998-12-31restructuringannounced1998-12-311999-03-31GlobalManufacturing, Assembly, TestUSD 16 (millions)MD&A
f5-10q / Qwen3.6-27B-Q8_0
Company announced closure of 5-inch wafer line and restructuring of assembly/test operations. Expected special charge of $15-17 million in March 1999 quarter. Employee count not disclosed.
1998-12-31restructuringcompleted1998-06-301998-06-30GlobalSalesUSD 1 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charge associated with restructuring of a portion of the Company's sales organization recognized in quarter ended June 30, 1998. Employee count not disclosed.
1998-09-30restructuringcompleted1998-06-30Sales organizationUSD 500,000 (units)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Part of a $5.5M special charge recognized in the quarter ended June 30, 1998 (Q1 FY1999), within the YTD period. No employee count disclosed.
1998-09-30restructuringcompleted1998-06-301998-06-30SalesUSD 500 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charge associated with the restructuring of a portion of the Company's sales organization. Employee count not disclosed.
1998-06-30restructuringcompletedSalesUSD 1 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Part of a $5.5M special charge; $500,000 related to restructuring a portion of the sales organization. No employee count, dates, or geography disclosed.
1998-06-30restructuringcompleted1998-06-301998-06-30SalesUSD 500 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Charge associated with the restructuring of a portion of the Company's sales organization. Employee count not disclosed.
1998-03-31restructuringcompleted3%1996-04WorldwideUSD 6 (millions)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Headcount reduction representing approximately 3% of worldwide employees in early April 1996. Pre-tax special charge of $5.969 million recorded in quarter ended June 30, 1996.
1997-03-31restructuringcompleted3%1996-04-011996-07-31WorldwideWafer fabrication and corporateUSD 6 (millions)restructuring_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Headcount reduction of approximately 3% of worldwide employees in April 1996; charge covered idled 5-inch wafer fab capacity, two-week fab shutdown in July 1996, and severance costs. Fiscal 1997 Q1 (quarter ended June 30, 1996).
1997-03-31acquisition_additioncompleted1996-06-251996-06-25United StatesQuickASIC gate array productsUSD 2 (millions)business_combinations_footnote
f5-10k / MiMo-V2.6-Flash-fp8-HTML
Acquisition of ASIC Technical Solutions, Inc. completed June 25, 1996; headcount added not disclosed. Charge represents write-off of in-process R&D.
1997-03-31restructuringcompleted3%1996-04-01WorldwideUSD 5,969 (thousands)restructuring_footnote
f5-10k / Qwen3.6-27B-Q8_0
Headcount reduction representing approximately 3% of worldwide employees occurred in early April 1996. Pre-tax restructuring charge of $5,969,000 recorded in Q2 FY1996 for idling wafer fab capacity, shutdown costs, and severance.
1996-12-31restructuringcompleted3%1996-04-01WorldwideCompany-wideUSD 5,969 (thousands)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
April 1996 headcount reduction of roughly 3% of worldwide employees, part of broader actions including a 15% wafer fab production cutback and a two-week fab shutdown in July 1996; pre-tax charge of $5,969,000 recorded in the nine months ended December 31, 1996 covering fab idling costs, shutdown expenses and severance.
1996-12-31restructuringcompleted3%1996-04-01WorldwideWafer fabrication and general operationsUSD 6 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Headcount reduction of approximately 3% of worldwide employees in early April 1996; absolute count not disclosed. Charge also covers idling 5-inch wafer fab capacity and a two-week fab shutdown in July 1996.
1996-12-31acquisition_additioncompleted1996-06-25United StatesQuick-turn gate array devices (fabless)USD 2 (millions)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of ASiC Technical Solutions, Inc. completed 1996-06-25 for $1.75M total; headcount added not disclosed. $1.575M charged to in-process R&D write-off.
1996-12-31restructuringcompleted3%1996-04WorldwideUSD 5,969 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Headcount reduction in early April 1996 representing approximately 3% of worldwide employees. Pre-tax restructuring charge of $5,969,000 recorded for nine months ended Dec 31, 1996, covering idling of 5-inch wafer fab capacity, shutdown expenses, and severance.
1996-09-30restructuringin_progress3%1996-04-01WorldwideCompany-wideUSD 5,969 (thousands)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Actions taken in quarter ended June 30, 1996 in response to customer inventory correction: delayed capital expansion, 15% wafer fab production cutback, headcount reduction in early April 1996 of approximately 3% of worldwide employees, and a two-week wafer fab shutdown in early July 1996. Pre-tax charge covers idling part of 5-inch wafer fab capacity, continuing expenses during the shutdown, and severance costs from the April 1996 headcount reduction.
1996-09-30restructuringcompleted3%1996-04WorldwideWafer fabrication and general operationsUSD 5,969 (thousands)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Headcount reduction of approximately 3% of worldwide employees in early April 1996; part of broader restructuring including 15% wafer fab production cutback and two-week fab shutdown in July 1996. Charge covers idled 5-inch capacity, shutdown expenses, and severance.
1996-09-30acquisition_additioncompleted1996-06-25United StatesQuick-turn gate array devices (fabless)USD 1,575 (thousands)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of ASiC Technical Solutions, Inc. for $1,750,000 total; $1,575,000 one-time write-off of in-process R&D. No headcount added disclosed; impact described as immaterial.
1996-09-30restructuringcompleted3%1996-04-01WorldwideUSD 6 (millions)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Headcount reduction in early April 1996 representing approximately 3% of worldwide employees. Pre-tax charge of $5.969 million covers severance, wafer fab shutdown, and idling capacity.
1996-06-30restructuringcompleted3%1996-04worldwideUSD 5,969 (thousands)restructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Pre-tax charge covers idling part of 5-inch wafer fab capacity, expenses during a two-week July 1996 fab shutdown, and severance from an April 1996 headcount reduction of roughly 3% of worldwide employees. Related actions included a 15% wafer fabrication production cutback and deferred capital spending.
1996-06-30plant_closurecompleted1996-071996-07wafer fabricationrestructuring_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Two-week wafer fab shutdown in early July 1996, part of capacity-reduction actions; continuing expenses during the shutdown are covered by the restructuring charge.
1996-06-30acquisition_additioncompleted1996-06-25USD 1,750 (thousands)business_combinations_footnote
f5-10q / GLM-5.3-flash-fp4-HTML
Acquired ASiC Technical Solutions, a fabless gate array provider, for $1.75 million including related costs; $1,575,000 written off as in-process R&D. No headcount added disclosed.
1996-06-30restructuringin_progress3%1996-041996-07WorldwideWafer fabrication / operationsUSD 6 (millions)restructuring_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Program responded to customer inventory corrections: 15% wafer fab production cutback, headcount reduction in early April 1996 equal to about 3% of worldwide employees, and a two-week wafer fab shutdown in early July 1996. Charge covers idled 5-inch capacity, shutdown-period expenses, and severance. Absolute headcount not disclosed; only month-level dates given.
1996-06-30acquisition_additioncompleted1996-06-25Quick-turn gate array devices (fabless)USD 2 (millions)business_combinations_footnote
f5-10q / MiMo-V2.6-Flash-fp8-HTML
Acquisition of ASiC Technical Solutions, Inc. for $1.75 million including related costs; purchase price largely allocated to in-process R&D written off ($1.575 million). No employee headcount added disclosed.
1996-06-30restructuringcompleted3%1996-04-01WorldwideUSD 5,969 (thousands)restructuring_footnote
f5-10q / Qwen3.6-27B-Q8_0
Headcount reduction in early April 1996 representing approximately 3% of worldwide employees. Pre-tax charge of $5,969,000 covers severance, idling 5-inch wafer fab capacity, and shutdown expenses.