| Period End | Type | Status | Affected | % Workforce | Announced | Expected Completion | Geography | Segment / Function | Charge | Source | Note |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 2026-06-30 | plant_closure | completed | 2024-12-01 | 2025-05-31 | Tempe, Arizona, United States | Semiconductor products - wafer fabrication (Fab 2) | USD 3 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Closure of Fab 2 wafer fabrication facility announced December 2024 and completed May 2025; residual restructuring expenses of $2.9 million recognized in the three months ended June 30, 2026. No employee count disclosed in this filing. | ||
| 2026-06-30 | plant_closure | in_progress | 2024-12-01 | Tempe, Arizona, United States | Semiconductor products — wafer fabrication (Fab 2) | USD 3 (millions) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Quarterly restructuring expense tied to the Fab 2 closure; closure itself completed May 2025. No employee count disclosed for this quarter's charge. | |||
| 2026-06-30 | restructuring | in_progress | 2025-03-01 | Tempe, Arizona | Manufacturing | USD 3 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Restructuring expenses for the closure of the Tempe, Arizona wafer fabrication facility (Fab 2). Employee count not disclosed in this quarter. | |||
| 2026-06-30 | restructuring | completed | 2025-10-01 | 2026-03-31 | Global | All functions | Risk Factors f5-10q / Qwen3.6-27B-Q8_0 | Global reduction in force implemented in Q4 FY2025 and completed in Q1 FY2026. Specific headcount reduction numbers not disclosed in this 10-Q. | |||
| 2026-03-31 | restructuring | completed | 2025-03-31 | 2026-03-31 | Global | Company-wide | USD 1 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Employee separation costs incurred in fiscal 2026; global headcount reduction announced in Q4 fiscal 2025 and completed in Q1 fiscal 2026. Headcount affected not disclosed. | ||
| 2026-03-31 | plant_closure | completed | 2024-12-31 | 2025-05-31 | United States (Tempe, Arizona) | Wafer fabrication (Fab 2) | USD 22 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Fab 2 closure announced December 2024, closure completed May 2025 (fiscal 2026); charge relates to facility closure costs. Headcount affected not disclosed. | ||
| 2026-03-31 | restructuring | completed | 2025-03-31 | 2026-03-31 | Global | Company-wide (contract exits) | USD 15 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Contract exit costs incurred in fiscal 2026 as part of business recovery plan; no employee count disclosed. | ||
| 2026-03-31 | restructuring | completed | 2025-03-01 | 2026-03-31 | Global | Various | USD 40 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Global reduction in workforce implemented in Q4 FY2025 and completed in Q1 FY2026. Includes closure of Tempe, Arizona wafer fabrication facility (Fab 2) and contract exit costs. Employee separation costs were $0.9 million in FY2026. | ||
| 2026-03-31 | restructuring | in_progress | Employee Severance [Member] | USD 900,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2026-03-31 | restructuring | in_progress | Contract Termination [Member] | USD 14,500,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2026-03-31 | restructuring | in_progress | Other Restructuring [Member] | USD 21,800,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2026-03-31 | restructuring | in_progress | USD 37,200,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2025-12-31 | reduction_in_force | completed | Global | other f5-10q / GLM-5.3-flash-fp4-HTML | Global workforce reduction implemented in Q4 fiscal 2025 and completed in Q1 fiscal 2026; company notes it may have negatively affected employee morale. No headcount or charge figures disclosed in this filing. | ||||||
| 2025-12-31 | plant_closure | completed | 2024-12-02 | 2025-05-31 | Tempe, Arizona, United States | Wafer fabrication (Fab 2) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Fab 2 closure announced December 2, 2024 and completed May 2025; production transferred to Oregon and Colorado facilities. Agreement to sell the site reached October 2025, sale still pending. Closure contributed to restructuring charges of $33.3 million in the nine months ended December 31, 2025. | |||
| 2025-12-31 | restructuring | in_progress | USD 5 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Special charges and other, net of $4.8 million for the quarter (and $33.3 million for the nine months) primarily for restructuring expenses including contract exit costs, Fab 2 closure, and employee separation costs. No employee counts disclosed. | ||||||
| 2025-12-31 | plant_closure | completed | 2024-12-02 | 2025-05-31 | Tempe, Arizona, United States | Semiconductor products — wafer fabrication (Fab 2) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Fab 2 closure announced 2024-12-02, completed May 2025. Ongoing restructuring charges (including contract exit costs and employee separations) of $4.8M in Q3 FY2026 and $33.3M YTD FY2026 recorded under Special charges and other, net. No employee count disclosed. Sale of Fab 2 to a third party agreed October 2025, closing still pending. | |||
| 2025-12-31 | reduction_in_force | completed | 2025-06-30 | Global | Global workforce | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Global reduction in workforce implemented in Q4 FY2025 and completed in Q1 FY2026 (quarter ended 2025-06-30), per risk factor disclosure. No employee count or charge amount disclosed. Referenced in current filing as completed prior to the reporting period. | ||||
| 2025-12-31 | restructuring | completed | 2025-09-30 | 2026-03-31 | Global | Various | USD 33 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Global reduction in force implemented in Q4 FY2025 and completed in Q1 FY2026. Includes contract exit costs, closure of Tempe, Arizona wafer fabrication facility (Fab 2), and employee separation costs. Specific headcount not disclosed. | ||
| 2025-12-31 | plant_closure | completed | 2024-12-02 | 2025-05-31 | Tempe, Arizona | Manufacturing | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Closure of Fab 2 wafer fabrication facility completed in May 2025. Production transferred to Oregon and Colorado locations. Specific headcount impact not disclosed. | |||
| 2025-09-30 | plant_closure | completed | 2024-12-02 | 2025-05-31 | Tempe, Arizona, United States | Wafer fabrication (Fab 2) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Closure of Tempe, Arizona wafer fabrication facility (Fab 2) announced December 2, 2024; closure completed May 2025. Agreement to sell the facility to a third party entered October 2025, with sale expected to complete December 2025. Production being transferred to Oregon and Colorado facilities. No employee count disclosed. | |||
| 2025-09-30 | reduction_in_force | completed | Global | other f5-10q / GLM-5.3-flash-fp4-HTML | Global reduction in force implemented in Q4 fiscal 2025 and completed in Q1 fiscal 2026. No affected-employee count or charge amount disclosed in this filing. | ||||||
| 2025-09-30 | restructuring | in_progress | USD 29 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Special charges and other, net of $28.5 million for the six months ended September 30, 2025, primarily restructuring expenses including contract exit costs, closure of the Tempe, Arizona wafer fabrication facility, and employee separation costs. No headcount disclosed. | ||||||
| 2025-09-30 | reduction_in_force | completed | 2024 | 2025-06-30 | Global | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Filer states a global workforce reduction was implemented in fiscal 2025 Q4 and completed in fiscal 2026 Q1; no employee count or severance amount disclosed. Special charges of $28.5M for the six months ended 2025-09-30 include restructuring, contract exit, Fab 2 closure and employee separation costs combined, not separable to this action. | ||||
| 2025-09-30 | plant_closure | completed | 2024-12-02 | 2025-05 | United States (Tempe, Arizona) | Semiconductor products — wafer fabrication (Fab 2) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Fab 2 closure announced 2024-12-02 and completed May 2025; production transferring to Oregon and Colorado sites. No headcount associated with the closure disclosed. Sale of the facility agreed October 2025, expected to close December 2025. | |||
| 2025-09-30 | restructuring | completed | 2024-10-01 | 2026-03-31 | Global | Various | USD 29 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Global reduction in workforce implemented in Q4 FY2025 and completed in Q1 FY2026. Includes contract exit costs, closure of Tempe, Arizona wafer fabrication facility (Fab 2), and employee separation costs. Specific headcount not disclosed. | ||
| 2025-06-30 | plant_closure | completed | 2024-12-02 | 2025-05-31 | Tempe, Arizona, United States | Semiconductor products — wafer fabrication (Fab 2) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Closure of Tempe, Arizona wafer fabrication facility (Fab 2) announced December 2, 2024; completed in May 2025. Production being transferred to Oregon and Colorado facilities. No employee count disclosed. | |||
| 2025-06-30 | reduction_in_force | completed | 2025-06-30 | Global | USD 22 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Global workforce reduction implemented in Q4 fiscal 2025 and completed in Q1 fiscal 2026. Special charges of $22.2 million in the quarter primarily related to restructuring expenses including contract exit costs, Fab 2 closure and employee separation costs. No employee count disclosed. | ||||
| 2025-06-30 | reduction_in_force | completed | 2025-06-30 | Global | Not specified | USD 22 (millions) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Global workforce reduction announced in Q4 FY2025 and completed in Q1 FY2026; no employee count disclosed. The $22.2M special charge for the quarter bundles employee separation costs with contract exit costs and Fab 2 closure costs, so it is not a pure severance figure. | |||
| 2025-06-30 | plant_closure | completed | 2024-12-02 | 2025-05-31 | Tempe, Arizona, United States | Wafer fabrication (Fab 2) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Closure of Fab 2 announced December 2, 2024 and completed May 2025; production transferring to Oregon and Colorado sites. No associated employee count disclosed; closure costs sit within the $22.2M special charges line. | |||
| 2025-06-30 | acquisition_addition | completed | 2025-04-29 | 2025-05-08 | Not specified | Not specified | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of TF Semiconductor Solutions (TFSS) closed May 8, 2025 with 426,954 shares issued at closing plus 47,434 held back; no headcount added disclosed. | |||
| 2025-06-30 | restructuring | completed | 2024-10-01 | 2025-06-30 | Global | Various | USD 22 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Global reduction in force implemented in Q4 FY2025 and completed in Q1 FY2026. Includes contract exit costs, closure of Tempe, Arizona wafer fabrication facility (Fab 2), and employee separation costs. Specific headcount not disclosed. | ||
| 2025-03-31 | plant_closure | in_progress | 2024-12-02 | 2025-05-31 | United States (Tempe, Arizona) | Manufacturing — Fab 2 wafer fabrication | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | Closure completed May 2025 (after fiscal year end); expected annual cash savings of approximately $90 million. Facility and equipment classified as held for sale at March 31, 2025. No separate employee count disclosed for this action. | |||
| 2025-03-31 | restructuring | in_progress | 2025-03-03 | United States (Gresham, Oregon; Colorado Springs, Colorado) and Philippines | Manufacturing — Fab 4, Fab 5, and backend manufacturing facility in the Philippines | USD 27 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Headcount reduction at manufacturing facilities announced March 3, 2025; expected approximately $25 million in annual savings from temporarily reduced compensation costs. Employee separation costs of $27.1M and contract exit costs of $45.7M recorded in fiscal 2025 restructuring charges (total $76.5M charges, $22.1M accrued at year end). | |||
| 2025-03-31 | reduction_in_force | announced | 2025-03-03 | 2025-06-30 | Global | Company-wide | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | 10% global workforce reduction announced March 3, 2025 to decrease operating expenses; expected to reduce ongoing annualized operating expenses by approximately $90 million to $100 million. To be fully implemented by the June 2025 quarter (after fiscal year end). Implied affected count approximately 1,940 based on ~19,400 total workforce, but no explicit count disclosed. | |||
| 2025-03-31 | plant_closure | completed | 2024-12-02 | 2025-05-31 | Tempe, Arizona | Wafer Fabrication (Fab 2) | Item_1_Business f5-10k / Qwen3.6-27B-Q8_0 | Closure announced Dec 2, 2024; completed May 2025. Expected annual cash savings of approx $90 million. Employee count not disclosed. | |||
| 2025-03-31 | restructuring | in_progress | 2025-03-03 | Global | Manufacturing and Corporate | USD 73 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Announced March 3, 2025. Includes headcount reduction at Fab 4, Fab 5, and Philippines backend; 10% global headcount reduction. Total restructuring charges $76.5 million ($45.7M contract exit, $27.1M employee separation, $3.7M other). Employee count not disclosed. | |||
| 2025-03-31 | restructuring | in_progress | Employee Severance [Member] | USD 27,100,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2025-03-31 | restructuring | in_progress | Contract Termination [Member] | USD 45,700,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2025-03-31 | restructuring | in_progress | Other Restructuring [Member] | USD 3,700,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2025-03-31 | restructuring | in_progress | USD 76,500,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2024-12-31 | plant_closure | announced | 2024-12-02 | 2025-09-30 | Tempe, Arizona, United States | Wafer fabrication (Fab 2) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Closure of Fab 2 wafer fabrication facility expected in the September 2025 quarter; expected annual cash savings of approximately $90 million. No headcount figure disclosed. | |||
| 2024-12-31 | plant_closure | announced | 2024-12-02 | 2025-09-30 | Tempe, Arizona, United States | Semiconductor Products — Wafer Fabrication (Fab 2) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Closure of Fab 2 announced 2024-12-02; expected annual cash savings ~$90M. No employee count or severance charge disclosed. Process technologies to be transferred to Oregon and Colorado facilities. | |||
| 2024-12-31 | plant_closure | announced | 2024-12-02 | 2025-09-30 | Tempe, Arizona | Wafer fabrication | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Company announced decision to close Fab 2 wafer fabrication facility. Expected to generate annual cash savings of approximately $90 million. No specific employee count disclosed. | |||
| 2024-12-31 | restructuring | in_progress | USD 4 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Incurred special charges of $3.5 million for the three months ended Dec 31, 2024, primarily related to employee severance and restructuring of acquired and existing wafer fabrication operations. | ||||||
| 2024-12-31 | restructuring | in_progress | USD 8 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Incurred special charges of $7.6 million for the nine months ended Dec 31, 2024, primarily related to employee severance and restructuring of acquired and existing wafer fabrication operations. | ||||||
| 2024-09-30 | restructuring | in_progress | Wafer fabrication operations | USD 2 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2024-09-30 | restructuring | in_progress | Wafer fabrication operations | USD 4 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | YTD charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2024-06-30 | restructuring | in_progress | wafer fabrication operations | USD 3 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2024-03-31 | restructuring | completed | United States | Wafer fabrication operations | USD 6 (millions) | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2024 restructuring costs related to wafer fabrication operations; employee count not disclosed. | ||||
| 2024-03-31 | other | announced | 2024-04-01 | 2024-06-30 | Global | Global production facilities | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | During the June 2024 quarter, reduced production levels and implemented up to two weeks of shutdown days in global production facilities; headcount impact not quantified. | |||
| 2024-03-31 | other | in_progress | United States | Fab 4 (Gresham, Oregon) and Fab 5 (Colorado Springs, Colorado) | Item_1_Business f5-10k / MiMo-V2.6-Flash-fp8-HTML | In Q4 FY2024 paused most of the $800M Fab 4 expansion and $880M Fab 5 SiC/silicon expansion; no workforce reduction quantified. | |||||
| 2024-03-31 | restructuring | completed | Wafer fabrication operations | USD 6 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Restructuring costs of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2023-12-31 | other | announced | Global fabrication facilities | Manufacturing | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Company is reducing production levels and implementing up to two weeks of shutdown days in global fabrication facilities during the March 2024 and June 2024 quarters to manage inventory; no employee headcount impact quantified. | |||||
| 2023-12-31 | restructuring | in_progress | wafer fabrication operations | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2023-12-31 | restructuring | in_progress | wafer fabrication operations | USD 5 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | YTD charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2023-09-30 | restructuring | in_progress | Wafer fabrication operations | USD 4 (millions) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Special charges of $3.5M for six months ended 2023-09-30 relate to restructuring of acquired and existing wafer fab operations; no employee count disclosed. | |||||
| 2023-09-30 | restructuring | in_progress | wafer fabrication operations | USD 2 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2023-09-30 | restructuring | in_progress | wafer fabrication operations | USD 4 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | YTD charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2023-06-30 | restructuring | completed | Wafer fabrication operations | USD 2 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Incurred special charges of $1.7 million primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2023-03-31 | restructuring | in_progress | Global | Wafer fabrication operations | USD 17 (millions) | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | Fiscal 2023 restructuring expenses related to restructuring of acquired and existing wafer fabrication operations; employee counts not disclosed. No employee-affected figures given in the filing. | ||||
| 2023-03-31 | restructuring | completed | Wafer fabrication operations | USD 17 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2022-12-31 | restructuring | in_progress | Wafer fabrication operations | USD 7 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Special charges incurred during the three months ended Dec 31, 2022 primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. Employee count not disclosed. | |||||
| 2022-12-31 | restructuring | in_progress | Wafer fabrication operations | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Special income earned during the nine months ended Dec 31, 2022 included favorable resolution of legal matter offset by restructuring costs of acquired and existing wafer fabrication operations. Employee count not disclosed. | ||||||
| 2022-09-30 | restructuring | in_progress | Wafer fabrication operations | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Quarterly special charges related to restructuring of acquired and existing wafer fabrication operations for operational efficiency; no employee count, charge allocation, or completion date disclosed. Six-month period recorded net special income of $12.6M (favorable legal resolution offsetting restructuring charges). | ||||||
| 2022-09-30 | restructuring | in_progress | Wafer fabrication operations | USD 4 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges incurred primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency for the three months ended Sept 30, 2022. | |||||
| 2022-09-30 | restructuring | in_progress | Wafer fabrication operations | USD -13 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Net special income of $12.6M for the six months ended Sept 30, 2022. Income primarily related to favorable resolution of a previously accrued legal matter; charges primarily related to restructuring of acquired and existing wafer fabrication operations. | |||||
| 2022-06-30 | restructuring | in_progress | Wafer fabrication operations | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges incurred were primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. Specific employee count not disclosed. | ||||||
| 2022-03-31 | restructuring | completed | 2022-03-31 | United States | Semiconductor Products — wafer fabrication operations | USD 21 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2022 charge for restructuring acquired and existing wafer fabrication operations; footnote states these efforts were substantially completed as of March 31, 2022. No employee count disclosed. | |||
| 2022-03-31 | restructuring | completed | 2022-03-31 | Not specified | Semiconductor Products — non-manufacturing facilities and other operations | USD 8 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2022 total special charges were $29.5M, comprising $21.1M wafer fab restructuring plus employee separation ($0.6M), contract exit costs ($5.0M), gain on sale of assets (-$7.9M), other (-$0.3M), legal contingencies ($12.5M), and contingent consideration revaluation (-$1.5M). MD&A attributes the non-fab portion to exiting non-manufacturing facilities including contract termination, severance, and asset disposal. Charge shown is the residual non-fab restructuring components (separation + contract exit + other), net of asset sale gains. No employee counts disclosed. | |||
| 2022-03-31 | other | completed | Not specified | Not specified | USD 13 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2022 net legal settlement charges recorded within special charges and other, net; not a workforce action per se but part of the same caption. Included for completeness of the $29.5M total. | ||||
| 2022-03-31 | restructuring | completed | Wafer fabrication operations | USD 21 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Charges related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. Employee separation costs were $0.6 million. Total special charges were $29.5 million. | |||||
| 2022-03-31 | restructuring | completed | Non-manufacturing facilities | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Exiting non-manufacturing facilities including contract termination costs, employee severance, and disposal of assets. Specific headcount not disclosed. | ||||||
| 2022-03-31 | restructuring | in_progress | USD 21,100,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2021-12-31 | restructuring | completed | USD 20 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Nine months ended Dec 31, 2021 incurred special charges of $20.4M primarily related to restructuring of acquired and existing wafer fabrication operations, litigation matters, and exiting non-manufacturing facilities including contract termination costs, employee severance, and asset disposal. No specific employee count disclosed. | ||||||
| 2021-09-30 | restructuring | completed | Wafer fabrication operations | USD 10 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges incurred in Q2 2021 related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency, including employee severance. | |||||
| 2021-09-30 | restructuring | completed | Non-manufacturing facilities | USD 11 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | YTD 2021 charges included $20.7M total; $10.2M was Q2. Remaining YTD charges related to exiting non-manufacturing facilities including contract termination costs, employee severance, and asset disposal. | |||||
| 2021-06-30 | restructuring | in_progress | Wafer fabrication operations | USD 11 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Charges primarily related to restructuring of acquired and existing wafer fabrication operations to increase operational efficiency. | |||||
| 2021-03-31 | restructuring | completed | 2021-03-31 | United States (Colorado Springs, Colorado) | Semiconductor products — wafer fabrication (Fab 5) | USD 8 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2021 costs to re-purpose Fab 5; part of $15.0M total FY2021 wafer fab restructuring. Efforts substantially completed as of March 31, 2021. No employee count disclosed. | |||
| 2021-03-31 | restructuring | completed | 2021-03-31 | Not specified | Semiconductor products — acquired operations (Microsemi/Atmel integration) | USD 7 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2021 restructuring of other acquired operations; includes workforce, property and operating expense rationalizations. Employee separation costs were a net credit of $1.3M in FY2021. No employee count disclosed. | |||
| 2021-03-31 | plant_closure | in_progress | 2021-12-31 | United States (Santa Clara, California) | Wafer fabrication (Microsemi-acquired facility) | Item_1_Business f5-10k / MiMo-V2.6-Flash-fp8-HTML | Company plans to close the Santa Clara facility by December 2021; no headcount or charge quantified. | ||||
| 2021-03-31 | restructuring | completed | 2021-03-31 | Global | Wafer fabrication operations | USD 15 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Charges related to restructuring wafer fabrication operations, including repurposing Fab 5. Efforts substantially completed as of March 31, 2021. Employee count not disclosed. | |||
| 2021-03-31 | restructuring | completed | Global | Other acquired operations | USD -1 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Employee separation costs reported as a credit of $1.3 million. Part of broader restructuring activities related to recent business acquisitions. Employee count not disclosed. | ||||
| 2021-03-31 | restructuring | in_progress | USD 15,000,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2020-12-31 | restructuring | in_progress | 2021-03-31 | Wafer fabrication operations (Fab 5, Colorado Springs) | USD 7 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Fiscal 2020 announcement to re-purpose Fab 5 to manufacture discrete and specialty products; clean room footprint reduced and higher-volume products transferred to Fab 2 and Fab 4. $7.0 million of costs incurred in the nine months ended December 31, 2020 (after $18.0 million in fiscal 2020), recorded in special charges and other, net. Less than $2.0 million expected in Q4 fiscal 2021. No employee counts disclosed. | ||||
| 2020-12-31 | restructuring | in_progress | 2021-03-31 | Wafer fabrication operations | USD 7 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Costs associated with re-purposing Fab 5 to manufacture discrete and specialty products. Filer expects to incur less than $2.0 million in the fourth quarter for remaining associated costs. | ||||
| 2020-09-30 | restructuring | in_progress | United States | Wafer fabrication (Fab 5, Colorado Springs) | USD 4 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Fab 5 re-purposed to discrete and specialty products; clean room footprint reduced and higher-volume products transferred to Fab 2 and Fab 4. $4.0 million of costs incurred in the six months ended September 30, 2020; less than $4.0 million expected in the second half of fiscal 2021. No employee counts disclosed. | ||||
| 2020-09-30 | restructuring | in_progress | Colorado Springs, Colorado (Fab 5) | Wafer fabrication operations | USD 4 (millions) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Fab 5 repurposed for discrete/specialty products; $4.0M costs in six months ended 2020-09-30, less than $4.0M expected in H2 FY2021. No employee count disclosed. | ||||
| 2020-09-30 | restructuring | in_progress | Global | Wafer fabrication operations | USD 4 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Costs associated with re-purposing Fab 5 to manufacture discrete and specialty products. No employee count disclosed. | ||||
| 2020-06-30 | restructuring | in_progress | 2021-03-31 | United States (Colorado Springs, Colorado) | Wafer fabrication (Fab 5) | USD 1 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Fab 5 being re-purposed to manufacture discrete and specialty products; clean room footprint reduced and higher-volume products transferred to Fab 2 and Fab 4. $1.0 million of costs incurred in the quarter; less than $7.0 million expected in fiscal 2021 for remaining costs. No employee count disclosed. | |||
| 2020-06-30 | restructuring | in_progress | United States | Semiconductor Products — wafer fabrication (Fab 5, Colorado Springs) | USD 1 (millions) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Fab 5 re-purposing for discrete and specialty products; $1.0M of restructuring costs incurred in the quarter, $18.0M in fiscal 2020, with less than $7.0M expected in fiscal 2021. No employee count disclosed. | ||||
| 2020-06-30 | restructuring | in_progress | Acquisition-related (Microsemi/Atmel integration) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Filing cites workforce, property and other operating expense rationalizations from recent acquisitions; no employee count or separate current-quarter charge amount disclosed. | ||||||
| 2020-06-30 | restructuring | in_progress | Wafer fabrication operations | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Costs associated with re-purposing Fab 5 to manufacture discrete and specialty products. No employee count disclosed. | |||||
| 2020-03-31 | restructuring | in_progress | United States | Semiconductor Products — wafer fabrication operations | USD 18 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2020 charge for restructuring wafer fabrication operations (Fab 5 re-purposing), comprising $8.2M contract exit costs, $6.6M relocation costs and $2.5M asset impairment; less than $10.0M of remaining costs expected within the next year; no employee count disclosed | ||||
| 2020-03-31 | restructuring | in_progress | Global | Semiconductor Products — acquisition integration (Microsemi/Atmel) | USD 6 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2020 employee separation costs from workforce, property and operating expense rationalizations tied to prior acquisitions; filer states it cannot estimate future amounts; no employee count disclosed | ||||
| 2020-03-31 | plant_closure | announced | 2021-03-31 | United States — Santa Clara, California | Wafer fabrication (Microsemi-acquired facility) | Item_1_Business f5-10k / MiMo-V2.6-Flash-fp8-HTML | Filer plans to close the Santa Clara, California facility by March 2021; no headcount or charge quantified | ||||
| 2020-03-31 | restructuring | completed | Wafer fabrication operations | USD 18 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Costs associated with restructuring wafer fabrication operations, including contract exit costs, relocation costs, and asset impairment charges. | |||||
| 2020-03-31 | restructuring | completed | USD 6 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Employee separation costs related to most recent business acquisitions, resulting from workforce rationalizations. | ||||||
| 2020-03-31 | restructuring | in_progress | Employee Severance [Member] | USD 6,000,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2020-03-31 | restructuring | in_progress | Facility Closing [Member] | USD 13,400,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2020-03-31 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2020-03-31 | restructuring | in_progress | USD 19,400,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2019-12-31 | restructuring | in_progress | United States (Colorado) | Semiconductor products — wafer fabrication operations | USD 12 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Q3 FY2020 charge for restructuring wafer fab operations; MD&A adds that clean-room footprint at the Colorado 6-inch fab is being reduced with higher-volume products transferred to 8-inch fabs in Arizona and Oregon. Company expects less than $10.0 million of remaining costs within the next year. No employee count disclosed; employee separation costs of $10.7 million incurred YTD across all restructuring activities, also without headcount figures. | ||||
| 2019-12-31 | restructuring | in_progress | Not specified | Semiconductor products — acquisition integration (Microsemi and prior acquisitions) | USD 11 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Employee separation costs of $10.7 million for the nine months ended December 31, 2019, primarily related to workforce and property rationalizations from recent acquisitions. Accrued restructuring liability of $40.0 million at quarter-end ($22.6 million current, $17.4 million non-current). No employee counts disclosed. | ||||
| 2019-12-31 | restructuring | in_progress | 2020-12-31 | Wafer fabrication operations | USD 12 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Costs associated with restructuring certain wafer fabrication operations. Company estimates less than $10.0 million remaining costs within next year. | ||||
| 2019-12-31 | restructuring | in_progress | Semiconductor products | USD 11 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred during the nine months ended Dec 31, 2019. Part of ongoing restructuring activities since fiscal 2017. | |||||
| 2019-12-31 | restructuring | in_progress | Semiconductor products | USD 11 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Contract exit costs incurred during the nine months ended Dec 31, 2019. | |||||
| 2019-12-31 | restructuring | in_progress | Employee Severance [Member] | USD 10,700,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-12-31 | restructuring | in_progress | Facility Closing [Member] | USD 10,800,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-12-31 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-12-31 | restructuring | in_progress | USD 21,500,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2019-09-30 | restructuring | in_progress | Semiconductor products segment | USD 1 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $0.6 million in the three months ended September 30, 2019, primarily related to recent business acquisitions | |||||
| 2019-09-30 | restructuring | in_progress | Semiconductor products segment | USD 7 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $7.3 million in the six months ended September 30, 2019; cumulative $112.9 million since start of fiscal 2017 | |||||
| 2019-09-30 | restructuring | announced | Wafer fabrication operations | USD 20 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Company estimates $15 million to $25 million of costs over the next year to restructure certain wafer fabrication operations; midpoint recorded as estimate | |||||
| 2019-09-30 | restructuring | in_progress | Global | Semiconductor Products (wafer fabrication operations) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Company estimates $15M to $25M of restructuring costs for certain wafer fabrication operations over the next year; no employee count disclosed. Employee separation costs of $0.6M (Q2) and $7.3M (YTD) incurred in the period, but no headcount affected is stated. | |||||
| 2019-09-30 | acquisition_addition | completed | 2018-05-29 | 2018-05-29 | Global | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Microsemi acquisition closed May 29, 2018; no headcount added through the acquisition is disclosed in this filing. | |||
| 2019-09-30 | restructuring | in_progress | Semiconductor products | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred in Q2 FY2020 related to workforce rationalizations from recent acquisitions. | |||||
| 2019-09-30 | restructuring | in_progress | Semiconductor products | USD 7 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Cumulative employee separation costs incurred in the six months ended Sept 30, 2019, related to workforce rationalizations from recent acquisitions. | |||||
| 2019-09-30 | restructuring | in_progress | Employee Severance [Member] | USD 7,300,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-09-30 | restructuring | in_progress | Facility Closing [Member] | USD 500,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-09-30 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-09-30 | restructuring | in_progress | USD 7,800,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2019-06-30 | restructuring | in_progress | Semiconductor products segment | USD 7 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $6.7 million in the quarter, primarily related to recent business acquisitions (workforce and operating expense rationalizations); no employee count disclosed. Cumulative employee separation costs since start of fiscal 2017 were $112.3 million. | |||||
| 2019-06-30 | restructuring | in_progress | Global | Semiconductor Products | USD 7 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Employee separation costs of $6.7M in Q1 FY2020 related to Microsemi integration; no employee count disclosed. Company states it cannot estimate future amounts. | ||||
| 2019-06-30 | restructuring | in_progress | Semiconductor products | USD 7 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred during the quarter. Filing states: 'The Company is not able to estimate future expenses, if any, to be incurred in employee separation costs.' | |||||
| 2019-06-30 | restructuring | in_progress | Employee Severance [Member] | USD 6,700,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-06-30 | restructuring | in_progress | Facility Closing [Member] | USD 0 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-06-30 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2019-06-30 | restructuring | in_progress | USD 6,700,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2019-03-31 | restructuring | in_progress | Global | Semiconductor Products | USD 65 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2019 employee separation costs tied to recent acquisitions (Microsemi, Atmel); no headcount affected disclosed. Additional future costs expected but not estimable. | ||||
| 2019-03-31 | plant_closure | completed | 2019-03-31 | United States (Bend, Oregon) | Wafer fabrication (Microsemi legacy facility) | Item_1_Business f5-10k / MiMo-V2.6-Flash-fp8-HTML | Bend, Oregon facility discontinued production in March 2019; associated workforce reduction not quantified. | ||||
| 2019-03-31 | acquisition_addition | completed | 2018-05-29 | 2018-05-29 | United States (Aliso Viejo, California HQ) and global | Semiconductor Products (aerospace, defense, communications, data center, industrial) | USD 22 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Microsemi acquisition closed May 29, 2018; headcount added not disclosed. $22.0M acquisition-related costs incurred; $65.2M share-based compensation recognized on assumed awards during FY2019. | ||
| 2019-03-31 | restructuring | completed | USD 64 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Restructuring charges of $63.9 million incurred in fiscal 2019 related to recent business acquisitions, including workforce rationalizations and combining product roadmaps. Employee separation costs were $65.3 million, partially offset by gains on sale of assets and contract exit cost adjustments. | ||||||
| 2019-03-31 | restructuring | in_progress | Employee Severance [Member] | USD 48,900,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2019-03-31 | restructuring | in_progress | Facility Closing [Member] | USD -4,700,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2019-03-31 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2019-03-31 | restructuring | in_progress | USD 44,200,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2018-12-31 | restructuring | in_progress | Semiconductor products segment | USD 3 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $3.3 million in the quarter, related to Microsemi acquisition integration (workforce, property and operating expense rationalizations). No employee count disclosed. | |||||
| 2018-12-31 | restructuring | in_progress | Semiconductor products segment | USD 61 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $60.5 million for the nine months ended December 31, 2018, tied to Microsemi acquisition integration; no headcount figures disclosed. | |||||
| 2018-12-31 | acquisition_addition | completed | 2018-05-29 | Semiconductor products segment | USD 8,245 (millions) | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Microsemi acquisition completed May 29, 2018 for total consideration of approximately $8.24 billion; headcount added not disclosed. | ||||
| 2018-12-31 | restructuring | in_progress | Global | Semiconductor Products | USD 61 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Employee separation costs of $60.5M for nine months ended Dec 31, 2018 ($3.3M in Q3), related to Microsemi and prior acquisitions. No employee count disclosed. Company states it cannot estimate future separation costs. | ||||
| 2018-12-31 | acquisition_addition | completed | 2018-05-29 | 2018-05-29 | United States | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Microsemi acquisition closed May 29, 2018 for ~$8.24B. No headcount added disclosed. Company notes Microsemi outsources substantially all wafer fabrication and assembly/test. | |||
| 2018-12-31 | restructuring | in_progress | Global | Semiconductor Products | USD 18 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Accrued restructuring and other exit charges of $51.5M at Dec 31, 2018, including $18.0M additions from Microsemi acquisition (employee separation $11.4M, exit costs $6.6M). No employee counts disclosed. | ||||
| 2018-12-31 | restructuring | in_progress | Semiconductor products | USD 3 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred in Q3 2019 related to recent acquisitions, primarily Microsemi. Total employee separation costs for the nine months ended Dec 31, 2018 were $60.5 million. The company states it is not able to estimate future expenses. | |||||
| 2018-12-31 | restructuring | in_progress | Semiconductor products | USD -3 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Contract exit costs (income) for the nine months ended Dec 31, 2018. Related to vacated lease liabilities. Total contract exit costs since fiscal 2016 start are $42.6 million. | |||||
| 2018-12-31 | restructuring | in_progress | USD 41,200,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2018-12-31 | restructuring | in_progress | Employee Severance [Member] | USD 44,100,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-12-31 | restructuring | in_progress | Facility Closing [Member] | USD -2,900,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-12-31 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-09-30 | restructuring | in_progress | Semiconductor products segment | USD 12 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $12.1 million in the three months ended September 30, 2018, related to the Microsemi acquisition; workforce, property and operating expense rationalizations. Company states it cannot estimate future employee separation costs. | |||||
| 2018-09-30 | restructuring | in_progress | Semiconductor products segment | USD 57 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $57.2 million in the six months ended September 30, 2018, related to the Microsemi acquisition; includes $11.4 million of additions due to the acquisition and $40.1 million of charges in the accrual roll-forward. | |||||
| 2018-09-30 | acquisition_addition | completed | 2018-05-29 | 2018-05-29 | Semiconductor products segment | USD 8,245 (millions) | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Microsemi acquisition completed May 29, 2018 for total consideration of approximately $8.24 billion; no employee headcount added through the acquisition was disclosed. | |||
| 2018-09-30 | acquisition_addition | completed | 2018-05-29 | 2018-05-29 | Global | Semiconductor Products | USD 22 (millions) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Microsemi acquisition closed 2018-05-29; headcount added not disclosed. Charge reflects acquisition-related costs. | ||
| 2018-09-30 | restructuring | in_progress | Global | Semiconductor Products | USD 57 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Employee separation costs for six months ended 2018-09-30 related to Microsemi integration; number of employees affected not disclosed. Additional restructuring costs expected as synergies are identified. | ||||
| 2018-09-30 | restructuring | in_progress | Global | Semiconductor Products | USD 4 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Intangible asset impairment charges for six months ended 2018-09-30 from writing off Microsemi intangibles and assets impaired by combined product roadmap changes. | ||||
| 2018-09-30 | restructuring | in_progress | 2018-05-29 | Global | Semiconductor Products | USD 12 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs related to Microsemi acquisition. Specific headcount not disclosed. | |||
| 2018-09-30 | restructuring | in_progress | 2018-05-29 | Global | Semiconductor Products | USD 57 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | YTD employee separation costs related to Microsemi acquisition. Specific headcount not disclosed. | |||
| 2018-09-30 | restructuring | in_progress | 2018-05-29 | Global | Semiconductor Products | USD 2 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Impairment charges for intangible assets written off due to changes in combined product roadmaps post-acquisition. | |||
| 2018-09-30 | restructuring | in_progress | 2018-05-29 | Global | Semiconductor Products | USD 4 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | YTD impairment charges for intangible assets written off due to changes in combined product roadmaps post-acquisition. | |||
| 2018-09-30 | restructuring | in_progress | USD 37,100,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2018-09-30 | restructuring | in_progress | Employee Severance [Member] | USD 40,100,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-09-30 | restructuring | in_progress | Facility Closing [Member] | USD -3,000,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-09-30 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-06-30 | restructuring | in_progress | Semiconductor products segment | USD 45 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs tied to Microsemi acquisition; workforce, property and operating expense rationalizations. No employee count disclosed. Restructuring accrual balance of $83.0 million at June 30, 2018. | |||||
| 2018-06-30 | acquisition_addition | completed | 2018-05-29 | 2018-05-29 | Semiconductor products segment | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Microsemi acquisition completed May 29, 2018; headcount added not disclosed. Assumed equity awards measured at $175.4 million fair value. | ||||
| 2018-06-30 | acquisition_addition | completed | 2018-05-29 | United States (Aliso Viejo, California headquarters); global operations | Semiconductor products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Microsemi acquisition closed 2018-05-29 for ~$8.25B total consideration; no headcount added disclosed. Date shown is the closing date, as the original deal announcement date is not stated in this filing. $22.0M acquisition costs expensed (non-workforce). | ||||
| 2018-06-30 | restructuring | in_progress | Not specified | Semiconductor products segment (all restructuring activities) | USD 45 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Employee separation costs of $45.1M incurred in Q1 FY2019 tied to the Microsemi acquisition (workforce, property and operating expense rationalizations). Restructuring accrual roll-forward shows $29.2M in-period separation charges plus $11.4M additions from the Microsemi acquisition; no employee count disclosed. Company states it cannot estimate total or future separation costs; decisions made on a rolling basis. Announcement date not disclosed; restructuring followed the 2018-05-29 acquisition close. | ||||
| 2018-06-30 | restructuring | in_progress | 2018-05-29 | Global | Semiconductor Products | USD 45 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs related to the Microsemi acquisition. The filing states the company is not able to estimate the total amount of expected employee separation costs in advance. | |||
| 2018-06-30 | restructuring | in_progress | 2018-05-29 | Global | Semiconductor Products | USD 2 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Impairment charges recognized as a result of writing off intangible assets purchased from Microsemi prior to the close of the acquisition. | |||
| 2018-06-30 | restructuring | in_progress | 2018-05-29 | Global | Semiconductor Products | USD -7 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Income attributable to a change in assumptions on the vacated lease liability related to Atmel causing a change in timing and amount of cash flows. | |||
| 2018-06-30 | restructuring | in_progress | USD 22,200,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2018-06-30 | restructuring | in_progress | Employee Severance [Member] | USD 29,200,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-06-30 | restructuring | in_progress | Facility Closing [Member] | USD -7,000,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-06-30 | restructuring | in_progress | Other Restructuring [Member] | USD 0 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2018-03-31 | restructuring | in_progress | United States | Semiconductor products | USD 1 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2018 employee separation costs tied to the Atmel acquisition; filer states these activities are now substantially complete. A $0.8M employee separation accrual and $27.3M exit-cost accrual remained at year-end. No affected-employee count disclosed. | ||||
| 2018-03-31 | acquisition_addition | announced | 4,800 | 2018-03-01 | United States (Aliso Viejo, California headquarters; global operations) | Aerospace and defense, communications, data center, industrial | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Pending acquisition of Microsemi Corporation at $68.78/share; count is Microsemi's disclosed global headcount, not a Microchip net addition. Filer expected closing in late May/early June 2018; no completion date stated precisely. | |||
| 2018-03-31 | restructuring | completed | Global | Semiconductor Products | USD 1 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Employee separation costs incurred in connection with the acquisition of Atmel. The filing states these activities are substantially complete. | ||||
| 2018-03-31 | restructuring | completed | Global | Semiconductor Products | USD 1 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Contract exit costs incurred in connection with acquisition-related restructuring activities. The filing states these activities are substantially complete. | ||||
| 2018-03-31 | restructuring | in_progress | USD 1,900,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2018-03-31 | restructuring | in_progress | Employee Severance [Member] | USD 1,200,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2018-03-31 | restructuring | in_progress | Facility Closing [Member] | USD 700,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2017-12-31 | restructuring | in_progress | Semiconductor products | USD 2 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Employee separation costs of $1.5 million for the nine months ended December 31, 2017; no employee counts disclosed. Restructuring accrual balance of $50.8 million at December 31, 2017 includes $2.2 million employee separation and $48.6 million exit costs. | |||||
| 2017-12-31 | restructuring | in_progress | Oregon | Semiconductor products | USD 20 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Charge for fees associated with transitioning from the public utility provider in Oregon to a lower cost direct access provider; not a workforce reduction. | ||||
| 2017-12-31 | restructuring | in_progress | Global | Semiconductor Products | USD 22 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Restructuring accrual roll-forward for nine months ended Dec 31, 2017 shows $21.5M in charges (employee separation $1.5M, exit costs $20.1M); no employee count disclosed. Activities described as substantially complete since March 31, 2017. | ||||
| 2017-12-31 | plant_closure | completed | United States (San Jose, California) | Semiconductor Products — Wafer Fabrication | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Sale of decommissioned San Jose wafer fabrication facility completed during nine months ended Dec 31, 2017 for $10.0M proceeds; no associated headcount reduction disclosed. | |||||
| 2017-12-31 | restructuring | in_progress | Semiconductor products | USD 0 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred in Q3 FY2018. Filing states activities are substantially complete. | |||||
| 2017-12-31 | restructuring | in_progress | Semiconductor products | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred YTD FY2018. Filing states activities are substantially complete. | |||||
| 2017-12-31 | restructuring | in_progress | Semiconductor products | USD 0 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Contract exit costs (income) incurred in Q3 FY2018. Filing states activities are substantially complete. | |||||
| 2017-12-31 | restructuring | in_progress | Semiconductor products | USD 20 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Contract exit costs incurred YTD FY2018. Includes $19.5M charge for Oregon utility transition fees. | |||||
| 2017-12-31 | restructuring | in_progress | USD 21,534,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2017-12-31 | restructuring | in_progress | Employee Severance [Member] | USD 1,477,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2017-12-31 | restructuring | in_progress | Facility Closing [Member] | USD 20,057,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2017-09-30 | restructuring | in_progress | Semiconductor products segment | USD 20 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Quarterly special charges of $19.9 million, primarily a $19.5 million contract exit fee for transitioning from a public utility provider in Oregon to a direct access provider; no employee counts disclosed. Employee separation costs of $0.3 million in the quarter; restructuring activities related to Atmel and Micrel acquisitions substantially complete at March 31, 2017. | |||||
| 2017-09-30 | restructuring | in_progress | Semiconductor products segment | USD 17 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Six-month special charges of $17.1 million including $1.4 million employee separation costs, $20.2 million contract exit costs, offset by a $4.4 million gain on sale of assets; no employee counts disclosed. | |||||
| 2017-09-30 | restructuring | in_progress | Semiconductor products | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred in the three months ended Sept 30, 2017. Part of ongoing restructuring from Atmel and Micrel acquisitions. | |||||
| 2017-09-30 | restructuring | in_progress | Semiconductor products | USD 20 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Contract exit costs incurred in the six months ended Sept 30, 2017. Includes $19.5M charge for transitioning utility provider in Oregon. | |||||
| 2017-09-30 | restructuring | in_progress | USD 21,541,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2017-09-30 | restructuring | in_progress | Employee Severance [Member] | USD 1,387,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2017-09-30 | restructuring | in_progress | Facility Closing [Member] | USD 20,154,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2017-06-30 | restructuring | in_progress | Semiconductor products | USD 2 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Quarterly restructuring charges of $1.1M employee separation and $0.6M contract exit costs tied to Atmel and Micrel integration; activities substantially complete at March 31, 2017. No employee counts disclosed. | |||||
| 2017-06-30 | divestiture_reduction | completed | 2016-11-10 | 2017-03-31 | Mobile touch operations | other f5-10q / GLM-5.3-flash-fp4-HTML | Sale of mobile touch assets to Solomon Systech completed November 10, 2016; transition services substantially complete as of March 31, 2017. No headcount figures disclosed. | ||||
| 2017-06-30 | restructuring | in_progress | Semiconductor products | USD 2 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Post-Atmel/Micrel integration restructuring; $1.1M employee separation and $0.6M exit costs accrued in Q1 FY2018. Filer states activities were substantially complete at March 31, 2017; no employee counts disclosed. Restructuring accrual balance $35.9M at June 30, 2017. | |||||
| 2017-06-30 | restructuring | in_progress | Global | Semiconductor products | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs incurred related to recent business combinations including Atmel and Micrel. Filing states activities are substantially complete but does not disclose specific headcount affected in this period. | ||||
| 2017-06-30 | restructuring | in_progress | Global | Semiconductor products | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Contract exit costs incurred related to recent business combinations. Filing states activities are substantially complete. | ||||
| 2017-06-30 | restructuring | in_progress | USD 1,672,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2017-06-30 | restructuring | in_progress | Employee Severance [Member] | USD 1,086,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2017-06-30 | restructuring | in_progress | Facility Closing [Member] | USD 586,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2017-03-31 | restructuring | in_progress | Not specified | Company-wide; Atmel and Micrel acquisition integration (workforce, property and operating expense rationalizations, combined product roadmaps and manufacturing operations) | USD 99 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2017 special charges of $98.6M comprised employee separation costs $39.2M, exit costs $44.0M (of which $39.0M recorded in Q4), intangible asset impairment $12.6M, and other $2.8M. Restructuring accrual charges of $83.2M plus $6.3M additions from the Atmel acquisition; $40.3M accrual balance at 2017-03-31 ($5.5M accrued, $34.8M other long-term). Number of employees affected not disclosed. | ||||
| 2017-03-31 | acquisition_addition | completed | 2016-01-19 | 2016-04-04 | United States (San Jose, California headquarters) and global operations | Semiconductor products | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Atmel acquired 2016-04-04 for total consideration of approximately $3.47 billion; headcount added through the acquisition not disclosed. Atmel results included in consolidated statements from acquisition date. | |||
| 2017-03-31 | divestiture_reduction | completed | 2016-11-10 | Global | Mobile touch operations (Atmel touch product line) | discontinued_operations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Mobile touch assets sold to Solomon Systech (Limited) International on 2016-11-10; presented as discontinued operations with FY2017 net loss of $6.0M. Headcount removed through the disposition not disclosed. | ||||
| 2017-03-31 | plant_closure | completed | 2017-03-31 | San Jose, California, United States | 6-inch wafer fabrication facility acquired in the Micrel acquisition | Item_1_Business f5-10k / MiMo-V2.6-Flash-fp8-HTML | Products transitioned to Fab 2, Fab 4 and Fab 5; facility decommissioned in the quarter ended 2016-12-31 and presented as held for sale at 2017-03-31, with sale completed after year-end for $10.0M proceeds. Associated workforce reduction not disclosed. | ||||
| 2017-03-31 | restructuring | in_progress | USD 39 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Employee separation costs incurred in fiscal 2017 related to restructuring activities including workforce rationalizations following acquisitions. | ||||||
| 2017-03-31 | restructuring | in_progress | USD 44 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Exit costs incurred in fiscal 2017 related to contract exit costs and other operating expenses from restructuring activities. | ||||||
| 2017-03-31 | acquisition_addition | completed | 2016-04-04 | business_combinations_footnote f5-10k / Qwen3.6-27B-Q8_0 | Acquisition of Atmel closed on April 4, 2016. Headcount added not explicitly quantified in the filing. | ||||||
| 2017-03-31 | restructuring | in_progress | USD 83,223,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | |||||||
| 2017-03-31 | restructuring | in_progress | Employee Severance [Member] | USD 39,183,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2017-03-31 | restructuring | in_progress | Facility Closing [Member] | USD 44,040,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2016-12-31 | restructuring | in_progress | USD 21 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Restructuring from Atmel and Micrel acquisitions: employee separation costs $6.5M, impairment charges $8.1M, exit costs $4.2M, other $2.1M in the quarter; no employee counts disclosed. Restructuring accrual of $9.5M at December 31, 2016 included in accrued liabilities. | ||||||
| 2016-12-31 | restructuring | in_progress | USD 53 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Nine-month restructuring charges: employee separation costs $35.3M, impairment charges $10.0M, exit costs $4.2M, other $2.9M; no employee counts disclosed. | ||||||
| 2016-12-31 | divestiture_reduction | completed | 2016-11-10 | 2016-11-10 | Mobile touch operations (acquired with Atmel) | USD 1 (millions) | other f5-10q / GLM-5.3-flash-fp4-HTML | Sale of mobile touch assets to Solomon Systech (Limited) International completed November 10, 2016; gain on sale of $0.6M; headcount transferred not disclosed. | |||
| 2016-12-31 | plant_closure | in_progress | San Jose, California | Wafer fabrication (facility acquired with Micrel) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | San Jose 6-inch wafer fab decommissioned during the December 2016 quarter; products transitioned to Fab 2 and Fab 4; assets presented as held for sale. Headcount impact not disclosed. | |||||
| 2016-12-31 | restructuring | in_progress | 2016-04-04 | Global | Multiple — workforce, property, and operating expense rationalizations | USD 53 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Nine-month restructuring charges of $52.5M including $35.3M employee separation costs, $10.0M impairment charges, $4.2M exit costs, and $2.9M other. No employee headcount affected disclosed. Restructuring accrual balance of $9.5M at quarter-end. | |||
| 2016-12-31 | acquisition_addition | completed | 2016-04-04 | 2016-04-04 | Global | Semiconductor products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Atmel acquisition closed 2016-04-04 for ~$3.47B total consideration. No headcount added through the acquisition is disclosed in this filing. | |||
| 2016-12-31 | divestiture_reduction | completed | 2016-11-10 | 2016-11-10 | Global | Mobile touch operations (discontinued operations) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Sale of Atmel mobile touch assets to Solomon Systech completed 2016-11-10. No employee count associated with the divestiture is disclosed. | |||
| 2016-12-31 | plant_closure | in_progress | 2016-10-01 | 2017-12-31 | San Jose, California, United States | 6-inch wafer fabrication facility (acquired from Micrel) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | San Jose fab decommissioned during the December 2016 quarter; assets classified as held for sale. Company expects to sell within one year. No employee count disclosed. | |||
| 2016-12-31 | restructuring | in_progress | USD 7 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs for the three months ended Dec 31, 2016. Related to Atmel and Micrel acquisitions. | ||||||
| 2016-12-31 | restructuring | in_progress | USD 35 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee separation costs for the nine months ended Dec 31, 2016. Related to Atmel and Micrel acquisitions. | ||||||
| 2016-12-31 | restructuring | in_progress | USD 4 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Exit costs for the nine months ended Dec 31, 2016. | ||||||
| 2016-12-31 | restructuring | in_progress | USD 10 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Impairment charges for the nine months ended Dec 31, 2016. Result of changes in combined product roadmaps after Atmel acquisition. | ||||||
| 2016-12-31 | acquisition_addition | completed | 2016-04-04 | Semiconductor products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Atmel Corporation completed on April 4, 2016. Headcount not explicitly disclosed. | |||||
| 2016-12-31 | acquisition_addition | completed | 2015-08-03 | Semiconductor products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Micrel, Incorporated completed on August 3, 2015. Headcount not explicitly disclosed. | |||||
| 2016-12-31 | divestiture_reduction | completed | 2016-11-10 | Mobile touch operations | discontinued_operations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Sale of mobile touch assets to Solomon Systech completed on November 10, 2016. Headcount not explicitly disclosed. | |||||
| 2016-12-31 | restructuring | in_progress | USD 39,569,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | |||||||
| 2016-12-31 | restructuring | in_progress | Employee Severance [Member] | USD 35,346,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2016-12-31 | restructuring | in_progress | Facility Closing [Member] | USD 4,223,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2016-09-30 | divestiture_reduction | announced | 2016-11-01 | 2016-11-15 | Mobile touch business (discontinued operations) | subsequent_events f5-10q / GLM-5.3-flash-fp4-HTML | Agreement to sell mobile touch business assets acquired from Atmel to Solomon Systech; sale of products, equipment and patents plus a license to related IP, with transition services. No employee counts disclosed. | ||||
| 2016-09-30 | acquisition_addition | completed | 2016-01-19 | 2016-04-04 | Global (San Jose, California HQ) | Semiconductor products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Atmel became a wholly owned subsidiary on 2016-04-04; filing does not disclose headcount added. | |||
| 2016-09-30 | restructuring | in_progress | Not specified | Not specified | USD 32 (millions) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Six months ended 2016-09-30 special charges for severance, office closing and acquisition-related costs; $25.6M paid in period; no employee count disclosed. | ||||
| 2016-09-30 | divestiture_reduction | announced | 2016-11-01 | 2016-11-30 | Not specified | Mobile touch business (discontinued operations) | subsequent_events f5-10q / MiMo-V2.6-Flash-fp8-HTML | Agreement to sell mobile touch business assets to Solomon Systech; expected to close mid-November 2016; no headcount disclosed. | |||
| 2016-09-30 | restructuring | in_progress | USD 10 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Sept 30, 2016. Employee count not disclosed. | ||||||
| 2016-09-30 | restructuring | in_progress | USD 32 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charges related to severance, office closing and other costs associated with acquisition activity for the six months ended Sept 30, 2016. Employee count not disclosed. | ||||||
| 2016-09-30 | acquisition_addition | completed | 2016-04-04 | Semiconductor products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Atmel Corporation completed on April 4, 2016. Headcount added not explicitly disclosed in this filing. | |||||
| 2016-09-30 | acquisition_addition | completed | 2015-08-03 | Semiconductor products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Micrel, Incorporated completed on August 3, 2015. Headcount added not explicitly disclosed in this filing. | |||||
| 2016-06-30 | acquisition_addition | completed | 2016-04-04 | 2016-04-04 | Semiconductor products | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Company acquired Atmel on April 4, 2016; no employee headcount figures disclosed in the acquisition footnote. | ||||
| 2016-06-30 | restructuring | in_progress | USD 22 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Special charges of $22.0 million for severance, office closing and other acquisition-related costs; $17.0 million paid during the quarter. No employee counts disclosed. | ||||||
| 2016-06-30 | divestiture_reduction | in_progress | 2016-04-04 | Mobile touch business | other f5-10q / GLM-5.3-flash-fp4-HTML | Mobile touch business acquired with Atmel is held for sale; no headcount figures disclosed. | |||||
| 2016-06-30 | restructuring | in_progress | USD 22 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance, office closing, and other acquisition-related costs of $22.0 million for the quarter; $17.0 million paid during the quarter. No employee count disclosed. | ||||||
| 2016-06-30 | acquisition_addition | completed | 2016-01-19 | 2016-04-04 | Global | Semiconductor products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Atmel acquisition closed 2016-04-04; headcount added not disclosed. Related equity awards assumed had $95.9M fair value, with $43.2M share-based compensation recognized in the quarter, including $37.1M from accelerated vesting on termination of certain Atmel employees. | |||
| 2016-06-30 | divestiture_reduction | in_progress | 2016-04-04 | Mobile touch business (discontinued operations) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Mobile touch business acquired with Atmel has been marketed for sale since 2016-04-04 as it was not a strategic fit; associated headcount not disclosed. | |||||
| 2016-06-30 | restructuring | in_progress | 2016-04-04 | Global | Various | USD 22 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charges related to severance, office closing and other costs associated with acquisition activity. $17.0 million paid during the quarter. | |||
| 2016-06-30 | acquisition_addition | completed | 2016-04-04 | Global | Semiconductor Products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Atmel Corporation completed. Headcount not explicitly disclosed. | ||||
| 2016-06-30 | acquisition_addition | completed | 2015-08-03 | Global | Semiconductor Products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Micrel, Incorporated completed in prior period but impacts current quarter operations. Headcount not explicitly disclosed. | ||||
| 2016-03-31 | acquisition_addition | completed | 2015-08-03 | 2015-08-03 | San Jose, California, United States | Semiconductor products (analog, power and mixed-signal) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Micrel acquired August 3, 2015 for approximately $816.2 million total consideration; acquired headcount not disclosed. Micrel net sales included in FY2016 were approximately $116.4 million. | |||
| 2016-03-31 | restructuring | in_progress | Acquisition-related integration | USD 11 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2016 special charges of $11.2 million for severance, office closing and other costs tied to acquisition activity, partly offset by an $11.5 million insurance settlement; net special charges were $4.0 million. Employees affected and completion timing not disclosed. | |||||
| 2016-03-31 | acquisition_addition | completed | 2016-04-04 | 2016-04-04 | San Jose, California, United States | Semiconductor products (microcontrollers, touch, mixed-signal, RF) | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Atmel acquired April 4, 2016 (after fiscal year-end, before filing date) for approximately $3.47 billion total consideration; acquired headcount not disclosed. No Atmel sales or expenses included in FY2016 results. | |||
| 2016-03-31 | restructuring | completed | USD 11 (millions) | Item 6. Selected Financial Data f5-10k / Qwen3.6-27B-Q8_0 | Fiscal 2016 special charges included $11.2 million related to severance, office closing and other costs associated with acquisition activity. | ||||||
| 2016-03-31 | acquisition_addition | completed | 2015-08-03 | Item 1. Business f5-10k / Qwen3.6-27B-Q8_0 | Acquisition of Micrel closed August 3, 2015. Employee count not explicitly disclosed in filing. | ||||||
| 2016-03-31 | acquisition_addition | completed | 2014-07-17 | Item 1. Business f5-10k / Qwen3.6-27B-Q8_0 | Acquisition of controlling interest in ISSC closed July 17, 2014. Employee count not explicitly disclosed in filing. | ||||||
| 2016-03-31 | acquisition_addition | completed | 2014-04-01 | Item 1. Business f5-10k / Qwen3.6-27B-Q8_0 | Acquisition of Supertex closed April 1, 2014. Employee count not explicitly disclosed in filing. | ||||||
| 2016-03-31 | restructuring | in_progress | Unusual or Infrequent Item [Member] | USD 11,200,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2015-12-31 | acquisition_addition | completed | 2015-08-03 | United States | Semiconductor products | USD 10 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Micrel acquisition closed August 3, 2015; nine-month special charges include severance and office closing costs tied to acquisition activity, but no employee counts disclosed. Micrel operations fully integrated as of November 1, 2015. | |||
| 2015-12-31 | restructuring | completed | USD 2 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Special charges of $2.2 million related to severance, office closing and other costs associated with acquisition activity in the three months ended Dec 31, 2015. | ||||||
| 2015-12-31 | restructuring | completed | USD 10 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Special charges of $10.4 million related to severance, office closing and other costs associated with acquisition activity in the nine months ended Dec 31, 2015. | ||||||
| 2015-12-31 | restructuring | in_progress | Unusual or Infrequent Item [Member] | USD 2,200,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2015-09-30 | acquisition_addition | completed | 2015-08-03 | United States | Semiconductor products | USD 7 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Micrel acquisition closed August 3, 2015; special charges of $6.6M (three months) and $8.2M (six months) relate to severance, office closing and other acquisition-related costs. No employee headcount figures disclosed. | |||
| 2015-09-30 | restructuring | in_progress | USD 7 (millions) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Special charges for severance, office closing and other acquisition-related costs; $6.6M in Q2 and $8.2M YTD. No employee counts or timing disclosed. | ||||||
| 2015-09-30 | acquisition_addition | completed | 2015-08-03 | 2015-08-03 | United States | Semiconductor products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Micrel acquisition closed 2015-08-03; headcount added not disclosed in filing. | |||
| 2015-09-30 | restructuring | completed | USD 7 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Sept 30, 2015. | ||||||
| 2015-09-30 | restructuring | completed | USD 8 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charges related to severance, office closing and other costs associated with acquisition activity for the six months ended Sept 30, 2015. | ||||||
| 2015-06-30 | restructuring | in_progress | Acquisition-related (severance, office closing) | USD 2 (millions) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Quarterly special charges of $1.6 million for severance, office closing and other acquisition-related costs; no employee counts or timing disclosed. | |||||
| 2015-06-30 | acquisition_addition | completed | 2015-05-07 | 2015-08-03 | United States | subsequent_events f5-10q / MiMo-V2.6-Flash-fp8-HTML | Micrel acquisition completed 2015-08-03 for ~$430 million cash plus 8,626,795 shares; no headcount added disclosed. | ||||
| 2015-06-30 | acquisition_addition | completed | 2015-06-30 | Taiwan | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Company completed purchase of the remaining ISSC Technologies shares during the quarter, reaching 100% ownership; no employee count disclosed. | |||||
| 2015-06-30 | restructuring | completed | USD 2 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charges related to severance, office closing and other costs associated with acquisition activity. | ||||||
| 2015-03-31 | acquisition_addition | completed | 2014-04-01 | United States (Sunnyvale, California) | Analog, interface and mixed signal products | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Wholly-owned acquisition of Supertex Inc. completed April 1, 2014; headcount added not disclosed. | ||||
| 2015-03-31 | acquisition_addition | in_progress | 2014-07-17 | Taiwan | Wireless / IoT (semiconductor products) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Tender offer for 83.5% of ISSC completed July 17, 2014; ownership reached approximately 94.1% at March 31, 2015, with the remaining noncontrolling interest expected to be acquired in the June 2015 quarter. Headcount added not disclosed. | ||||
| 2015-03-31 | plant_closure | completed | 2015-03-31 | United States (San Jose, California) | Wafer fabrication (6-inch fab acquired with Supertex) | Item_1_Business f5-10k / MiMo-V2.6-Flash-fp8-HTML | Fab was shut down during the March 2015 quarter and is being decommissioned; exact date within the quarter not disclosed. Associated workforce reduction not quantified. | ||||
| 2015-03-31 | plant_closure | completed | 2015-03-31 | Hong Kong | Test facility (acquired with Supertex) | Item_1_Business f5-10k / MiMo-V2.6-Flash-fp8-HTML | Test facility shut down during the March 2015 quarter; exact date within the quarter not disclosed. Associated workforce reduction not quantified. | ||||
| 2015-03-31 | restructuring | in_progress | Not specified | Acquisition-related integration | USD 3 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Fiscal 2015 special charges of $2.8 million for severance, office closing and other costs tied to acquisition activity; employees affected not disclosed. Amount is the full-year fiscal 2015 charge. | ||||
| 2015-03-31 | acquisition_addition | announced | 2015-05-07 | 2015-09-30 | United States | Semiconductor products | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Definitive agreement to acquire Micrel, Incorporated at $14.00 per share (~$839 million equity value); expected to close early in the third quarter of calendar 2015, subject to Micrel shareholder and regulatory approvals. Headcount to be added not disclosed. | |||
| 2015-03-31 | restructuring | completed | USD 3 (millions) | Item 1. Business - Special Charges f5-10k / Qwen3.6-27B-Q8_0 | Fiscal 2015 special charges of $2.8 million related to severance, office closing and other costs associated with acquisition activity. | ||||||
| 2015-03-31 | acquisition_addition | completed | 2014-07-17 | Taiwan | Semiconductor Products | business_combinations_footnote f5-10k / Qwen3.6-27B-Q8_0 | Acquired controlling interest in ISSC Technologies Corporation. Headcount not explicitly disclosed. | ||||
| 2015-03-31 | acquisition_addition | completed | 2014-04-01 | United States | Semiconductor Products | business_combinations_footnote f5-10k / Qwen3.6-27B-Q8_0 | Acquired Supertex Inc. Headcount not explicitly disclosed. | ||||
| 2015-03-31 | acquisition_addition | completed | 2014-04-30 | United States | Analog and mixed-signal products (Supertex) | other f5-10k / MiMo-V2.6-Flash-fp8-HTML | Supertex acquired April 2014; referenced only via assumption of 404,856 shares under the Supertex 2009 Equity Plan. No employee headcount added disclosed. | ||||
| 2015-03-31 | acquisition_addition | completed | 2014-07-31 | United States | Wireless connectivity (ISSC / ISSC 2011 Equity Plan) | other f5-10k / MiMo-V2.6-Flash-fp8-HTML | ISSC acquired July 2014; referenced only via assumption of 60,883 option shares. No employee headcount added disclosed. | ||||
| 2014-12-31 | acquisition_addition | completed | 2014-07-17 | Taiwan | Semiconductor products | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Acquired 83.5% controlling interest in ISSC Technologies; no employee headcount figures disclosed. Ownership increased to approximately 91.1% by December 31, 2014. | ||||
| 2014-12-31 | acquisition_addition | completed | 2014-04-01 | United States | Semiconductor products | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Acquired Supertex Inc. for $391.8 million; no employee headcount figures disclosed. | ||||
| 2014-12-31 | restructuring | completed | USD 1 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Special charges of $1.0 million (three months) and $2.1 million (nine months) for severance, office closing and other costs associated with acquisition activity; employee counts not disclosed. | ||||||
| 2014-12-31 | acquisition_addition | completed | 2014-07-17 | Taiwan | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquired 83.5% interest in ISSC Technologies; ownership reached 91.1% by quarter-end. Headcount added not disclosed. | ||||
| 2014-12-31 | acquisition_addition | completed | 2014-04-01 | United States | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquired Supertex Inc. for $391.8 million; fully integrated by July 1, 2014. Headcount added not disclosed. | ||||
| 2014-12-31 | restructuring | in_progress | USD 2 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Special charges for severance, office closing and acquisition-related costs; employee counts not disclosed. | ||||||
| 2014-12-31 | plant_closure | announced | 2015-03-31 | San Jose, California, United States | Semiconductor Products — Wafer Fabrication | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Plan to shut down San Jose fab acquired with Supertex and transfer wafer production to Fab 2 within six months; workforce impact not quantified. | ||||
| 2014-12-31 | plant_closure | announced | 2015-03-31 | Hong Kong | Semiconductor Products — Test Operations | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Test facility acquired with Supertex planned for shutdown during March 2015 quarter; workforce impact not quantified. | ||||
| 2014-12-31 | restructuring | completed | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Special charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Dec 31, 2014. | ||||||
| 2014-12-31 | restructuring | completed | USD 2 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Special charges related to severance, office closing and other costs associated with acquisition activity for the nine months ended Dec 31, 2014. | ||||||
| 2014-09-30 | restructuring | in_progress | USD 1 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance, office closing, and other costs tied to acquisition activity; no employee count disclosed. | ||||||
| 2014-09-30 | restructuring | in_progress | USD 1 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Six-month YTD figure for same acquisition-related severance and office closing costs; no employee count disclosed. | ||||||
| 2014-09-30 | restructuring | completed | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Special charges related to severance, office closing and other costs associated with acquisition activity for the three months ended Sept 30, 2014. | ||||||
| 2014-09-30 | restructuring | completed | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Special charges related to severance, office closing and other costs associated with acquisition activity for the six months ended Sept 30, 2014. | ||||||
| 2014-06-30 | acquisition_addition | completed | 2014-04-01 | 2014-04-01 | United States (Sunnyvale, California) | Semiconductor products | USD 392 (millions) | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Acquisition of Supertex Incorporated completed April 1, 2014 for $391.8 million total consideration; no employee headcount figures disclosed. Supertex results consolidated from acquisition date. | ||
| 2014-06-30 | acquisition_addition | announced | 2014-07-14 | Taiwan | Semiconductor products (Bluetooth/wireless, IoT) | USD 329 (millions) | subsequent_events f5-10q / GLM-5.3-flash-fp4-HTML | Tender offer for ISSC Technologies completed July 14, 2014; ~83.46% of shares tendered at NT$143 (~US$4.74) per share; total equity value ~$328.5 million. Consolidation to begin in quarter ended September 30, 2014. No headcount disclosed. | |||
| 2014-06-30 | acquisition_addition | completed | 2014-04-01 | United States | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Supertex completed 2014-04-01 for $391.8M; headcount added not disclosed. | ||||
| 2014-06-30 | acquisition_addition | announced | 2014-07-14 | Taiwan | Semiconductor Products | subsequent_events f5-10q / MiMo-V2.6-Flash-fp8-HTML | Tender offer for ISSC Technologies completed 2014-07-14 (~83.46% of shares); consolidation begins quarter ended 2014-09-30. Headcount added not disclosed. | ||||
| 2014-06-30 | restructuring | completed | USD 0 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charges related to severance, office closing and other costs associated with acquisition activity. | ||||||
| 2014-06-30 | acquisition_addition | completed | 2014-04-01 | Sunnyvale, California | Semiconductor products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Supertex Incorporated completed on April 1, 2014. Employee count not disclosed. | ||||
| 2014-03-31 | restructuring | completed | USD 3 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | FY2014 special charges for severance, office closing and other acquisition-related costs; per Note 4 the $3.0M comprises $1.7M acquisition expenses and $1.4M contingent consideration adjustment. No employee count disclosed. | ||||||
| 2014-03-31 | acquisition_addition | completed | 2014-02-09 | 2014-04-01 | United States | Analog and mixed-signal products | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Supertex acquisition closed 2014-04-01 for approximately $234.2M net of acquired cash; no headcount disclosed. | |||
| 2014-03-31 | acquisition_addition | announced | 2014-05-22 | Taiwan | Wireless connectivity | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Definitive agreement to acquire ISSC Technologies via tender offer at NT$143 per share, total equity value about $328.5M; no headcount disclosed. | ||||
| 2014-03-31 | acquisition_addition | completed | 2013-11-21 | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of remaining 81.7% interest completed 2013-11-21 for $9.0M net of cash; no headcount disclosed. | ||||||
| 2014-03-31 | restructuring | completed | USD 2 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Fiscal 2014 special charges of $1.7 million related to severance, office closing and other costs associated with acquisition activity. | ||||||
| 2014-03-31 | acquisition_addition | completed | 2014-04-01 | United States, Hong Kong | subsequent_events f5-10k / Qwen3.6-27B-Q8_0 | Acquisition of Supertex Inc. closed April 1, 2014. Supertex has offices, manufacturing and research facilities in California and Hong Kong. | |||||
| 2013-12-31 | restructuring | in_progress | Acquisition-related integration | USD 3 (millions) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Nine months ended 2013-12-31 severance, office closing and other acquisition-related costs of $2.5M ($0.8M in the quarter); no employee count disclosed. | |||||
| 2013-12-31 | restructuring | completed | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Severance-related, office closing and other costs associated with acquisition activity for the three months ended Dec 31, 2013. | ||||||
| 2013-12-31 | restructuring | completed | USD 3 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Severance-related, office closing and other costs associated with acquisition activity for the nine months ended Dec 31, 2013. | ||||||
| 2013-12-31 | restructuring | in_progress | Unusual or Infrequent Item [Member] | USD 2,500,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2013-09-30 | restructuring | completed | USD 0 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Severance-related, office closing, and other costs associated with the acquisition of SMSC incurred in Q2 2014. | ||||||
| 2013-09-30 | restructuring | completed | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Severance-related, office closing, and other costs associated with the acquisition of SMSC incurred YTD 2014. | ||||||
| 2013-09-30 | restructuring | in_progress | SMSC Acquisition [Member] / Unusual or Infrequent Item [Member] | USD 700,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2013-06-30 | restructuring | completed | SMSC acquisition integration | USD 0 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Severance-related, office closing, and other costs associated with the SMSC acquisition; no employee count disclosed. Total special charges of $1.7 million also included a $1.4 million contingent consideration fair value increase. | |||||
| 2013-06-30 | restructuring | completed | USD 0 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Severance-related, office closing, and other costs associated with the acquisition of SMSC. | ||||||
| 2013-06-30 | restructuring | in_progress | SMSC Acquisition [Member] / Unusual or Infrequent Item [Member] | USD 300,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2013-03-31 | acquisition_addition | completed | 2012-04-18 | 2012-04-18 | United States (Los Gatos, California) | Semiconductor products | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Privately-held low-power Wi-Fi/Bluetooth company acquired for approximately $20.6 million plus contingent consideration; acquired headcount not disclosed. | |||
| 2013-03-31 | acquisition_addition | completed | 2012-08-02 | 2012-08-02 | United States (Hauppauge, New York) | Semiconductor products | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | SMSC acquired for $37.00 per share, total consideration $919.6 million; SMSC operations fully integrated as of December 1, 2012. Acquired headcount not disclosed; SMSC contributed $234.3 million of net sales in fiscal 2013. | |||
| 2013-03-31 | restructuring | completed | 2012-08-02 | 2013-03-31 | United States | Corporate / acquired SMSC operations | USD 16 (millions) | other f5-10k / MiMo-V2.6-Flash-fp8-HTML | Fiscal 2013 special charges of $16.3 million, primarily severance-related costs plus office closing and other costs tied to the SMSC acquisition; number of employees affected not disclosed. Total fiscal 2013 special charges were $32.2 million, including a $4.4 million contingent-consideration adjustment and an $11.5 million SST-related legal settlement. | ||
| 2013-03-31 | restructuring | completed | USD 16 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Incurred $16.3 million of primarily severance-related costs in addition to office closing and other costs associated with the acquisition of SMSC. | ||||||
| 2013-03-31 | acquisition_addition | completed | 2012-08-02 | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Completed acquisition of SMSC on August 2, 2012. Headcount added not explicitly disclosed. | ||||||
| 2013-03-31 | restructuring | in_progress | SMSC Acquisition [Member] / Unusual or Infrequent Item [Member] | USD 16,300,000 (absolute) | restructuring_footnote f5-10k / no-ai-xblr | ||||||
| 2012-12-31 | restructuring | in_progress | 2012-08-02 | USD 13 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance, office closing, and other costs tied to SMSC integration; $2.6M incurred in Q3. No employee count disclosed. | |||||
| 2012-12-31 | acquisition_addition | completed | 2012-08-02 | 2012-12-01 | United States | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | SMSC acquisition closed 2012-08-02; operations fully integrated 2012-12-01. Headcount added not disclosed. | |||
| 2012-12-31 | acquisition_addition | completed | 2012-04-18 | United States | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Roving Networks acquisition closed 2012-04-18. Headcount added not disclosed. | ||||
| 2012-12-31 | restructuring | in_progress | 2012-08-02 | USD 3 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance-related, office closing, and other costs associated with the acquisition of SMSC for the three months ended Dec 31, 2012. | |||||
| 2012-12-31 | restructuring | in_progress | 2012-08-02 | USD 13 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance-related, office closing, and other costs associated with the acquisition of SMSC for the nine months ended Dec 31, 2012. | |||||
| 2012-12-31 | other | completed | USD 12 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Legal settlement costs for certain legal matters related to Silicon Storage Technology, Inc. in excess of previously accrued amounts. | ||||||
| 2012-12-31 | restructuring | in_progress | SMSC Acquisition [Member] / Unusual or Infrequent Item [Member] | USD 13,400,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2012-09-30 | acquisition_addition | completed | 2012-08-02 | United States (SMSC headquartered in Hauppauge, New York) | Semiconductor products | USD 11 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | SMSC acquisition completed August 2, 2012 for $919.6 million total consideration; special charges of approximately $10.9 million covered severance, office closing and other acquisition-related costs. No employee headcount figures disclosed. | |||
| 2012-09-30 | acquisition_addition | completed | 2012-08-02 | United States (Hauppauge, New York) | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Standard Microsystems Corporation (SMSC) for $919.6 million; headcount added not disclosed in filing. | ||||
| 2012-09-30 | restructuring | in_progress | SMSC acquisition integration | USD 11 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance, office closing, and other costs tied to SMSC acquisition; employee count not disclosed. | |||||
| 2012-09-30 | acquisition_addition | completed | 2012-04-18 | United States (Los Gatos, California) | Semiconductor Products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Roving Networks for approximately $20.6 million; headcount added not disclosed in filing. | ||||
| 2012-09-30 | restructuring | completed | 2012-08-02 | USD 11 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance related, office closing, and other costs associated with the acquisition of SMSC. Employee count not disclosed. | |||||
| 2012-09-30 | acquisition_addition | completed | 2012-08-02 | Semiconductor products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Standard Microsystems Corporation (SMSC). Headcount added not explicitly disclosed. | |||||
| 2012-09-30 | acquisition_addition | completed | 2012-04-18 | Semiconductor products | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of Roving Networks. Headcount added not explicitly disclosed. | |||||
| 2012-09-30 | restructuring | in_progress | SMSC Acquisition [Member] / Unusual or Infrequent Item [Member] | USD 10,900,000 (absolute) | restructuring_footnote f5-10q / no-ai-xblr | ||||||
| 2012-06-30 | acquisition_addition | completed | 2012-04-18 | 2012-04-18 | United States (Los Gatos, California) | Semiconductor products | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquired Roving Networks (low-power embedded Wi-Fi and Bluetooth) for ~$20.6M plus ~$14.7M contingent consideration; no employee headcount disclosed. | |||
| 2012-06-30 | acquisition_addition | announced | 2012-05-01 | 2012-08-02 | United States (New York) with offices in North America, Asia, and Europe | Semiconductor products (mixed-signal connectivity) | subsequent_events f5-10q / MiMo-V2.6-Flash-fp8-HTML | Closed 2012-08-02 at $37.00/share cash; financed with ~$258.8M cash and ~$600.0M credit facility borrowings. No employee headcount disclosed. | |||
| 2012-03-31 | acquisition_addition | completed | 2012-02-09 | 2012-02-09 | Germany | Semiconductor products (touch screen IP and solutions) | USD 40 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Total consideration approximately $39.5 million; no headcount disclosed for the acquired workforce. | ||
| 2012-03-31 | other | completed | Prior-year acquisition | USD 0 (millions) | other f5-10k / MiMo-V2.6-Flash-fp8-HTML | Fiscal 2012 special charges included $0.3 million of severance-related charges tied to a prior-year acquisition; employee count not disclosed. | |||||
| 2012-03-31 | acquisition_addition | announced | 2012-04-19 | United States (Los Gatos, California) | Low-power embedded Wi-Fi and Bluetooth solutions | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Announced after fiscal year-end; filer states the acquisition was not material to its financial position. No headcount disclosed. | ||||
| 2012-03-31 | acquisition_addition | announced | 2012-05-02 | 2012-09-30 | United States (New York) | Smart Mixed-Signal Connectivity (automotive, consumer, PC connectivity) | USD 939 (millions) | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Definitive agreement to acquire Standard Microsystems Corporation at $37.00 per share; total equity value ~$939 million, enterprise value ~$766 million. Expected to close in Q3 calendar 2012 (fiscal 2013 Q2 per Note 27); no headcount disclosed. Filer expects to fund with cash and borrowings under its $750 million credit facility. | ||
| 2012-03-31 | restructuring | completed | USD 0 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Severance-related charges related to a prior year acquisition. | ||||||
| 2011-12-31 | restructuring | completed | USD 0 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Filing reports $0.3 million of severance-related charges included in special income for the three and nine months ended Dec 31, 2011. No employee count disclosed. | ||||||
| 2011-09-30 | restructuring | completed | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance-related and office closing costs associated with the acquisition of SST. No employee count disclosed. | ||||||
| 2011-09-30 | restructuring | completed | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | YTD severance-related and office closing costs associated with the acquisition of SST. No employee count disclosed. | ||||||
| 2011-06-30 | restructuring | completed | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance-related costs associated with the acquisition of SST. All costs paid during the quarter. | ||||||
| 2011-03-31 | acquisition_addition | completed | 2010-04-08 | 2010-04-08 | United States (Sunnyvale, California) | Semiconductor products; technology licensing; memory | USD 354 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Silicon Storage Technology, Inc. at $3.05 per share; no employee count disclosed for the acquired workforce. | ||
| 2011-03-31 | restructuring | completed | Not specified | SST acquired operations | USD 2 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Severance and office closure costs incurred in fiscal 2011 from the SST acquisition; no employee count or completion date disclosed. | ||||
| 2011-03-31 | divestiture_reduction | completed | 2010-05-21 | 2010-05-21 | Not specified | Discontinued memory product lines (NAND drives, NAND controllers, Smart Card ICs, Combo Memory and related Flash lines) | discontinued_operations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Sale of acquired SST product lines to Greenliant Systems, Ltd.; approximately $23.6 million of assets disposed; no gain or loss recognized and no headcount disclosed. | |||
| 2011-03-31 | acquisition_addition | completed | 2011-02-16 | 2011-02-16 | Thailand | Assembly and test services | USD 7 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Two business acquisitions completed in fiscal 2011 in addition to SST, including Millennium Microtech Thailand (MMT) on 2011-02-16; combined consideration net of cash acquired was $6.5 million; no employee counts disclosed. One acquisition carried a bankruptcy reorganization liability of approximately $19.4 million. | ||
| 2011-03-31 | restructuring | completed | 2010-04-08 | Global | General | USD 2 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Severance-related and office closure costs associated with the acquisition of SST incurred during fiscal 2011. | |||
| 2011-03-31 | acquisition_addition | completed | 2010-04-08 | 2010-04-08 | United States | Semiconductor products and technology licensing | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Silicon Storage Technology, Inc. for $353.8 million; headcount added not disclosed. SST operations fully integrated as of October 1, 2010. | |||
| 2011-03-31 | restructuring | completed | United States | SST acquired operations | USD 2 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Fiscal 2011 severance-related and office closure costs associated with the SST acquisition; number of employees affected not disclosed. | ||||
| 2011-03-31 | divestiture_reduction | completed | 2010-05-21 | 2010-05-21 | United States | Discontinued memory product lines (NAND drives, NAND controllers, Smart Card ICs, Combo Memory and related Flash lines) | discontinued_operations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Sale of certain acquired SST product lines to Greenliant Systems, Ltd.; approximately $23.6 million of assets held for sale disposed; headcount removed not disclosed. | |||
| 2011-03-31 | acquisition_addition | completed | 2011-02-16 | 2011-02-16 | Thailand | Assembly and test | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquired to provide assembly and test expansion capabilities; headcount added not disclosed. | |||
| 2011-03-31 | acquisition_addition | completed | Other | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Two additional fiscal 2011 business acquisitions with total consideration of $6.5 million net of cash acquired; one assumed a bankruptcy reorganization liability of approximately $19.4 million; headcount added not disclosed. | ||||||
| 2010-12-31 | restructuring | completed | USD 2 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance-related and office closing costs tied to the SST acquisition; $0.6M in Q3 and $1.7M YTD. No employee count disclosed. | ||||||
| 2010-12-31 | acquisition_addition | completed | 2010-04-08 | United States | Multiple (licensing, microcontroller, memory, Wi-Fi) | USD 354 (millions) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | SST acquired April 8, 2010 for $353.8M total purchase price. No headcount added disclosed. | |||
| 2010-12-31 | divestiture_reduction | completed | 2010-05-21 | 2010-05-21 | Memory product lines (NAND Drives, NAND controllers, Smart Card ICs, Combo Memory, Concurrent SuperFlash, Small-Sector Flash, MTP Flash) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Sale of certain SST product lines to Greenliant Systems Ltd. No employee count disclosed. | ||||
| 2010-12-31 | restructuring | completed | 2010-04-08 | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Severance-related and office closing costs associated with the acquisition of SST. Employee count not disclosed. | |||||
| 2010-12-31 | restructuring | completed | 2010-04-08 | USD 2 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Cumulative YTD severance-related and office closing costs associated with the acquisition of SST. Employee count not disclosed. | |||||
| 2010-09-30 | acquisition_addition | completed | 2010-04-08 | 2010-04-08 | United States | Semiconductor products; licensing technology | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | SST acquired in a $353.8 million merger; no employee headcount added was disclosed in the filing. | |||
| 2010-09-30 | restructuring | in_progress | 2010-04-08 | United States | SST-acquired operations | USD 1 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance-related and office closing costs tied to the SST acquisition: $0.6M in the three months and $1.0M in the six months ended September 30, 2010; number of employees affected not disclosed. | |||
| 2010-09-30 | divestiture_reduction | completed | 2010-05-21 | 2010-05-21 | Asia | Memory product lines (NAND drives/controllers, Smart Card ICs, Combo Memory, Concurrent SuperFlash, Small-Sector Flash, MTP Flash) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Sale of approximately $23.6 million of assets to Greenliant Systems Ltd.; no gain or loss recognized and no employee count disclosed. | |||
| 2010-09-30 | restructuring | completed | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance-related and office closing costs associated with the acquisition of SST for the three months ended Sept 30, 2010. | ||||||
| 2010-09-30 | restructuring | completed | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance-related and office closing costs associated with the acquisition of SST for the six months ended Sept 30, 2010. | ||||||
| 2010-06-30 | acquisition_addition | completed | 2010-04-08 | 2010-04-08 | United States (Sunnyvale, California) | Semiconductor products; licensing technology | USD 1 (millions) | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | SST acquisition completed April 8, 2010 for $353.8 million; headcount added not disclosed. $0.5 million of severance-related costs associated with the acquisition were incurred and paid during the quarter. | ||
| 2010-06-30 | divestiture_reduction | completed | 2010-05-21 | 2010-05-21 | Discontinued operations (NAND Drives, NAND controllers, Smart Card ICs, Combo Memory, Concurrent SuperFlash, Small-Sector Flash, MTP Flash) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Sale of SST product lines to Greenliant Systems Ltd.; approximately $23.6 million of assets held for sale disposed. No gain or loss recognized; employee headcount affected not disclosed. | ||||
| 2010-06-30 | acquisition_addition | completed | 2010-04-08 | United States | Semiconductor products; Licensing technology | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Merger completed April 8, 2010 for $353.8 million; headcount added not disclosed in filing. | ||||
| 2010-06-30 | restructuring | completed | 2010-04-08 | 2010-06-30 | SST acquisition integration | USD 1 (millions) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance-related costs from SST acquisition integration; all paid during the quarter; affected employee count not disclosed. | |||
| 2010-06-30 | divestiture_reduction | completed | 2010-05-21 | 2010-05-21 | Discontinued memory product lines and Wi-Fi power amplifier business | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Sale of certain SST-acquired product lines to Greenliant Systems Ltd.; approximately $23.6 million of assets disposed; headcount removed not disclosed. | ||||
| 2010-06-30 | restructuring | completed | 2010-04-08 | 2010-06-30 | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Severance-related costs associated with the acquisition of SST. All costs paid during the quarter. | ||||
| 2010-03-31 | acquisition_addition | completed | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | One business acquisition completed during fiscal 2010 for approximately $9.3 million total consideration; headcount added not disclosed. | |||||||
| 2010-03-31 | acquisition_addition | completed | 2010-02-02 | 2010-04-08 | USD 354 (millions) | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Silicon Storage Technology, Inc. closed April 8, 2010 for $3.05 per share, $353.8 million total including $58.4 million of shares acquired March 8, 2010; headcount added not disclosed. Charge value represents total purchase consideration, not a workforce charge. | ||||
| 2010-03-31 | divestiture_reduction | completed | 2010-05-24 | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Sale of certain non-core assets from the SST acquisition (inventory, equipment, IP and related product lines) consummated May 24, 2010; associated headcount not disclosed. | ||||||
| 2009-12-31 | acquisition_addition | announced | 2010-02-02 | subsequent_events f5-10q / MiMo-V2.6-Flash-fp8-HTML | Definitive agreement signed to acquire Silicon Storage Technology, Inc. at $2.85 per share (~$275 million); expected to close in Q1 fiscal 2011. No headcount added disclosed. | ||||||
| 2009-09-30 | other | in_progress | United States (Fab 2 and Fab 4) | Wafer fabrication operations | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Rotating unpaid time off implemented at both wafer fabs beginning in fiscal Q3/Q4 2009 to control inventory; reduced production levels continued through fiscal Q2 2010. No employee counts disclosed. | |||||
| 2009-09-30 | other | in_progress | Global | R&D; Selling, General and Administrative | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Cost-cutting actions begun in fiscal 2009 second half, including broad-based salary and compensation reductions, lower travel and other variable expense cuts; no headcount reduction counts disclosed. | |||||
| 2009-09-30 | other | completed | 2009-07-09 | USD 1 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Patent license settlement with unrelated third-party; $1.2 million expensed in Q1 FY2010. | |||||
| 2009-09-30 | other | completed | Fab 2 and Fab 4 | Manufacturing | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Implemented rotating unpaid time off to control inventory levels due to adverse economic conditions. | |||||
| 2009-06-30 | other | completed | 2009-06-30 | Global | All | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Implemented rotating unpaid time off at Fab 2 and Fab 4 to control inventory levels due to adverse economic conditions. No specific employee count or severance charge disclosed. | ||||
| 2009-03-31 | acquisition_addition | completed | Not disclosed | Touch screen controllers | USD 1 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Hampshire Company completed during the third quarter of fiscal 2009 (quarter ended 2008-12-31); exact date and headcount added not disclosed. Charge is in-process R&D, not severance. | ||||
| 2009-03-31 | acquisition_addition | completed | Not disclosed | Software development tools and compilers | USD 0 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of HI-TECH Software completed during the fourth quarter of fiscal 2009 (quarter ended 2009-03-31); exact date and headcount added not disclosed. Charge is in-process R&D, not severance. | ||||
| 2009-03-31 | acquisition_addition | completed | Not disclosed | Smoke and carbon monoxide detector and life-safety integrated circuits | USD 0 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of R&E International completed during the fourth quarter of fiscal 2009 (quarter ended 2009-03-31); exact date and headcount added not disclosed. Charge is in-process R&D, not severance. | ||||
| 2009-03-31 | other | completed | United States (Arizona, Oregon) | Wafer fabrication (Fab 2 and Fab 4) | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | During the third and fourth quarters of fiscal 2009 the company reduced wafer starts and implemented rotating unpaid time off at both fabrication facilities to control inventory; no employee count or headcount reduction disclosed. Related under-absorbed fixed manufacturing costs of $21.4 million were charged to cost of sales for the full year. | |||||
| 2009-03-31 | other | completed | Global | Company-wide | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | Cost-cutting actions in the third and fourth quarters of fiscal 2009 included salary reductions, elimination of bonuses and reduced travel costs; no layoffs or headcount reductions disclosed. | |||||
| 2009-03-31 | other | announced | 2009-06-30 | Thailand | Assembly and test operations | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | Planned multiple plant shutdowns of the Thailand facility in the first quarter of fiscal 2010 to control inventory amid adverse economic conditions; temporary shutdowns rather than facility closure, no headcount impact quantified. Disclosed in the FY2009 10-K as a forward-looking plan. | ||||
| 2008-12-31 | acquisition_addition | completed | 2008-10-15 | Touch screen controllers | USD 1 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of Hampshire Company announced 2008-10-15; a $0.5M in-process R&D charge was recorded. No headcount added through the acquisition is disclosed. | ||||
| 2008-12-31 | other | in_progress | United States | Wafer fabrication (Fab 2 and Fab 4) | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Rotating unpaid time off implemented at both wafer fabs during the March 2009 quarter to control inventory; no employee count or charge disclosed. | |||||
| 2008-12-31 | other | announced | Thailand | Assembly and test operations | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Multiple plant shutdowns of the Thailand assembly and test facility planned for Q4 fiscal 2009 to control inventory; no employee count or charge disclosed. | |||||
| 2008-12-31 | other | announced | Company-wide | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Cost-reduction actions in Q4 fiscal 2009 including salary reductions, elimination of bonuses, and reduced discretionary/travel spend; some already taken in Q3. No headcount reduction or employee count disclosed. | ||||||
| 2008-12-31 | other | in_progress | 2008-12-31 | United States | Manufacturing | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Implementing rotating unpaid time off at Fab 2 and Fab 4 facilities during the March 2009 quarter to control inventory levels. | ||||
| 2008-12-31 | other | announced | 2008-12-31 | Thailand | Manufacturing | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Planning multiple plant shutdowns of the Thailand assembly and test facility in the fourth quarter of fiscal 2009. | ||||
| 2008-12-31 | other | in_progress | 2008-12-31 | Global | Research and Development | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Implementing actions to reduce payroll and discretionary costs, including salary reductions and elimination of bonuses. | ||||
| 2008-12-31 | other | in_progress | 2008-12-31 | Global | Selling, General and Administrative | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Implementing actions to reduce payroll and discretionary costs, including salary reductions and elimination of bonuses. | ||||
| 2008-03-31 | plant_closure | completed | 2007-09-21 | 2007-10-19 | Puyallup, Washington, United States | Wafer Fabrication (Fab 3) | USD 27 (millions) | other f5-10k / MiMo-V2.6-Flash-fp8-HTML | Unsolicited offer accepted; facility sold October 19, 2007 for $27.5M net cash. Charge is an impairment/loss on sale, not severance. No employee-impact count disclosed. | ||
| 2007-09-30 | plant_closure | completed | 2007-09-21 | 2007-10-19 | Puyallup, Washington, United States | Wafer fabrication (Fab 3) | USD 27 (millions) | other f5-10q / MiMo-V2.6-Flash-fp8-HTML | Unsolicited offer accepted for the Fab 3 facility; sale closed October 19, 2007 for $27.5 million net cash, with a $26.8 million loss recognized. No employee counts, severance amounts, or workforce impacts are disclosed in the filing. | ||
| 2005-03-31 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing | USD 31,755 (thousands) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Closure of Fab 1 wafer fabrication facility. Reduction in force of 207 employees. Charges included accelerated depreciation and severance. | |
| 2004-12-31 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer fabrication (Fab 1) and manufacturing support | USD 32 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Historical action completed in fiscal Q1 2004 (quarter ended June 30, 2003), not the current reporting period; disclosed in this filing as context for prior-year special charges. Charges included $30.6M accelerated depreciation plus severance, material and other costs in cost of sales, with additional operating-expense special charges. Integration of certain Fab 1 personnel into Fab 2 accompanied the closure. | |
| 2004-12-31 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing | USD 32 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Closure of Fab 1 wafer fabrication facility completed in Q2 FY2004. Charges included accelerated depreciation and severance. | |
| 2004-09-30 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing | USD 32 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Closure of Fab 1 wafer fabrication facility completed in Q1 FY2004. Reduction in force of 207 employees directly involved in manufacturing or supporting Fab 1. Charges included accelerated depreciation and severance. | |
| 2004-06-30 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer fabrication (Fab 1) | USD 32 (millions) | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Closure of Fab 1 wafer fab with integration of certain personnel into Fab 2; reduction in force of 207 manufacturing and support employees. Charges of $30.6M accelerated depreciation plus $1.1M severance/material costs in cost of sales, and $1.6M special charges in operating expenses, all recorded in the prior-year quarter ended June 30, 2003; integration completed during that quarter. Included here as the only workforce action disclosed in this filing. | |
| 2004-06-30 | restructuring | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing | USD 32 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Closure of Fab 1 wafer fabrication facility completed in Q1 FY2005. Charge includes accelerated depreciation and severance. | |
| 2004-03-31 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer fabrication operations (Fab 1) and supporting functions | USD 865 (thousands) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Special charges of $865 thousand cover contract cancellation, severance and other Fab 1 closure costs; separately, $31.8 million of accelerated depreciation and other charges ($30.6M accelerated depreciation plus $1.1M Fab 1 related charges) were recorded in cost of sales in the quarter ended June 30, 2003 and are not severance. Integration into Fab 2 completed during the quarter ended June 30, 2003. | |
| 2004-03-31 | restructuring | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing | USD 32 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Closure of Fab 1 wafer fabrication facility. Integration completed June 30, 2003. Charge includes accelerated depreciation and severance. | |
| 2003-12-31 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer fabrication (Fab 1) and manufacturing support | USD 32 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Fab 1 closure with integration of certain personnel into Fab 2 (Tempe, AZ); reduction in force of 207 employees in manufacturing and support functions. Charges in cost of sales of $31.8M ($30.6M accelerated depreciation plus $1.1M severance, material and other costs) recorded in the June 2003 quarter; an additional $1.6M of special charges in operating expenses that quarter. Integration completed during the quarter ended June 30, 2003. | |
| 2003-12-31 | restructuring | completed | 2003-04-07 | 2003-06-30 | United States | Operating expenses | USD 1 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Special charges in operating expenses of $1.6M recorded in the June 2003 quarter for contract cancellation, severance and other costs related to the Fab 1 closure and other actions; $0.9M net incurred for the nine months ended December 31, 2003 after a $0.7M reversal in the December 2003 quarter from a favorable contract-cancellation settlement. | ||
| 2003-12-31 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Manufacturing operations and support functions (Fab 1) | USD 33,367 (thousands) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Fab 1 closure with integration into Fab 2; $31,755K charges in cost of sales (incl. $30,608K accelerated depreciation) plus $1,612K of special charges in operating expenses for the quarter ended June 30, 2003. Integration completed during the quarter ended June 30, 2003; $747K of special charges reversed in the quarter ended December 31, 2003. | |
| 2003-12-31 | restructuring | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing and support functions | USD 31,755 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Reduction in force of 207 employees directly involved in manufacturing or providing support to Fab 1. Integration completed June 30, 2003. Charges include accelerated depreciation and severance. | |
| 2003-09-30 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer fabrication (Fab 1) and related support functions | USD 33 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Fab 1 closure with integration of certain personnel into Fab 2; reduction in force of 207 employees in manufacturing and support roles. Charges include $30.6M accelerated depreciation plus $1.1M severance/material costs in cost of sales, and $1.6M special charges in operating expenses for contract cancellation, severance and other costs. Integration completed during the quarter ended June 30, 2003. | |
| 2003-09-30 | plant_closure | completed | 207 | 2003-04-07 | Chandler, Arizona, United States | Manufacturing (wafer fabrication, Fab 1) | USD 33,367 (thousands) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Reduction in force of 207 employees in manufacturing or Fab 1 support functions; integration into Fab 2 completed during the quarter ended June 30, 2003. Charges comprise $30,608K accelerated depreciation plus $1,147K severance/material/other in cost of sales and $1,612K of special charges in operating expenses (the latter also covers other actions). $712K of such expenditures paid in the six months ended September 30, 2003; about $900K expected to be paid during the remainder of fiscal 2004. Fab 1 space to remain idle with no specific reuse plans. | ||
| 2003-09-30 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing | USD 31,755 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Closure of Fab 1 wafer fabrication facility; integration of personnel into Fab 2. Charges include accelerated depreciation and severance. | |
| 2003-06-30 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer fabrication (Fab 1); certain personnel integrated into Tempe, Arizona Fab 2 | USD 31,755 (thousands) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Closure of Fab 1 completed during the quarter ended June 30, 2003. Charges in cost of sales of $31,755 thousand comprised $30,608 thousand accelerated depreciation and $1,147 thousand severance, material and other costs. An additional $1,612 thousand of special charges was recorded in operating expenses for contract cancellation, severance and other costs. Approximately $900 thousand of expenditures remained to be paid during the remainder of fiscal 2004. | |
| 2003-06-30 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer fabrication (Fab 1); personnel and processes integrated into Tempe, Arizona (Fab 2) | USD 33 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Reduction in force of 207 employees in manufacturing and Fab 1 support functions; integration completed during the quarter. Total special charges of $33.4M comprise $30.6M accelerated depreciation, $1.1M severance/material/other in cost of sales, and $1.6M special charges in operating expenses. Company incurred $0.7M of expenditures in the quarter with approximately $0.9M to be paid during the remainder of fiscal 2004. | |
| 2003-06-30 | plant_closure | completed | 207 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Manufacturing and support functions | USD 33,367 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Closure of Fab 1 wafer fabrication facility. Charges include $30.6M accelerated depreciation and $1.1M severance/material costs in cost of sales, plus $1.6M special charges in operating expenses. | |
| 2003-03-31 | plant_closure | announced | 140 | 2003-04-07 | 2003-06-30 | Chandler, Arizona, United States | Wafer Fabrication (Fab 1) | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Announced after fiscal year-end; closure of Fab 1 with integration into Fab 2. Filer expects $27–33M accelerated depreciation and other expenses in Q1 FY2004; no severance charge quantified. | ||
| 2003-03-31 | acquisition_addition | completed | 2002-06-05 | 2002-06-05 | United States | Smart battery management (PowerSmart, Inc.) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition completed June 5, 2002 for $54.0M cash; headcount added not disclosed. | |||
| 2003-03-31 | reduction_in_force | announced | 140 | 2003-04-07 | 2003-06-30 | Chandler, Arizona | Fab Operations | subsequent_events f5-10k / Qwen3.6-27B-Q8_0 | Announced April 7, 2003, closure of Fab 1 and integration into Fab 2. Expected to incur accelerated depreciation and other expenses of $27-$33 million in Q1 FY2004. | ||
| 2002-12-31 | acquisition_addition | completed | 2002-06-05 | United States | USD 9 (millions) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of PowerSmart, Inc. for $54.0M cash; no employee headcount disclosed. $9.3M in-process R&D written off. | ||||
| 2002-12-31 | acquisition_addition | completed | 2002-08-23 | United States | Manufacturing | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Fab 4 facility acquired for $183.5M cash plus ~$1.2M acquisition costs; no employee headcount disclosed. Facility expected in production Q2 FY2004. | ||||
| 2002-12-31 | plant_closure | in_progress | 2002-09-30 | United States | Manufacturing | USD 42 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Fab 3 (Puyallup, WA) classified as held-for-sale; $41.5M impairment charge ($36.9M facility + $4.6M equipment). No employee count disclosed; equipment transferred to other fabs. | |||
| 2002-06-30 | acquisition_addition | completed | 2002-06-05 | United States (Shelton, Connecticut headquarters closed) | Battery management / PowerSmart, Inc. | USD 1 (millions) | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Microchip acquired PowerSmart for $54.0 million cash; liabilities assumed include roughly $0.8 million of severance, exit and lease termination accruals tied to terminating PowerSmart headquarters staff and closing the Shelton, Connecticut leased facility. No headcount figures disclosed. | |||
| 2002-06-30 | acquisition_addition | completed | 2002-06-05 | 2002-06-05 | United States | Battery management (PowerSmart, Inc.) | USD 54 (millions) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Cash purchase price of $54.0 million; no employee headcount acquired disclosed. | ||
| 2002-06-30 | plant_closure | in_progress | 2002-06-05 | Shelton, Connecticut, United States | PowerSmart headquarters personnel | USD 1 (millions) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Accrual covers severance, exit and lease termination costs for terminating PowerSmart HQ personnel and closing the Shelton, CT leased facility; employee count not disclosed. | |||
| 2002-06-30 | restructuring | completed | 2002-06-05 | 2002-06-05 | Shelton, Connecticut | Headquarters personnel | USD 1 (millions) | business_combinations_footnote f5-10q / Qwen3.6-27B-Q8_0 | Accruals for severance, exit and lease termination costs related to terminating employment of headquarters personnel and closing leased facility. | ||
| 2002-03-31 | acquisition_addition | announced | 2002-05-22 | 2002-06-07 | United States | Analog / battery management | USD 54 (millions) | subsequent_events f5-10k / MiMo-V2.6-Flash-fp8-HTML | Cash purchase of PowerSmart, Inc.; no headcount disclosed. Assumed balance sheet includes ~$4.0M cash and other net assets plus certain employee stock options. | ||
| 2002-03-31 | restructuring | completed | 2001-03-31 | 2001-06-30 | United States; Hong Kong | Manufacturing; Test Operations | USD 6 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Capacity reduction at Fabs 1 and 2 (Chandler/Tempe, AZ) and closure of Hong Kong test facility. Charge includes $2.1M employee severance. Completion by June 30, 2001. | ||
| 2001-06-30 | restructuring | in_progress | 2001-01-16 | USD 10,949 (thousands) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Merger-related accrual from January 16, 2001 TelCom Semiconductor pooling-of-interests merger; $10.7 million of cash expenses incurred through June 30, 2001, $240 thousand accrual remaining. Employee counts not disclosed. | |||||
| 2001-06-30 | restructuring | in_progress | 2001-03-31 | USD 2,454 (thousands) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Restructuring charges taken in quarter ended March 31, 2001, including $2,149 thousand employee severance costs; $2,324 thousand cash expenses incurred through June 30, 2001, $130 thousand accrual remaining. Number of employees affected not disclosed. | |||||
| 2001-06-30 | plant_closure | completed | 2001-04-30 | Manufacturing | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | One-week plant shutdown in April 2001 as a cost-reduction measure; reduced labor costs in R&D and SG&A and contributed to gross margin factors. Temporary shutdown, not a permanent closure; no headcount impact disclosed. | |||||
| 2001-06-30 | restructuring | in_progress | USD 2,454 (thousands) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance and other restructuring charges recorded in the quarter ended March 31, 2001; $2,324 thousand paid through June 30, 2001, $130 thousand accrual remaining. Employee severance component was $2,149 thousand (fully paid). No employee count disclosed. | ||||||
| 2001-06-30 | other | completed | 2001-01-16 | USD 912 (thousands) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Severance costs associated with the January 16, 2001 merger with TelCom Semiconductor, Inc.; fully paid through June 30, 2001 with no accrual remaining. Merger accounted for as a pooling of interests; no headcount added disclosed. | |||||
| 2001-06-30 | restructuring | in_progress | 2001-03-31 | USD 2,149 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Employee severance costs incurred during the quarter ended March 31, 2001. Cash expenses incurred through June 30, 2001 were $2,149 thousand with no remaining accrual. | |||||
| 2001-06-30 | restructuring | in_progress | 2001-03-31 | USD 305 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Other restructuring costs incurred during the quarter ended March 31, 2001. Cash expenses incurred through June 30, 2001 were $175 thousand with $130 thousand remaining accrual. | |||||
| 2001-03-31 | restructuring | completed | 2001-02-01 | 2001-03-31 | United States (Chandler and Tempe, Arizona) | Wafer fabrication (Fabs 1 and 2) | USD 6 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Cumulative wafer fab capacity reduced approximately 24%; charge includes $4.0M equipment write-off, $2.1M severance, $0.3M other. Capacity reduction completed by end of March 2001 quarter. Headcount impact not separately disclosed. | ||
| 2001-03-31 | plant_closure | in_progress | 2001-02-01 | 2001-06-30 | Hong Kong | Test operations | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Hong Kong test facility acquired via TelCom merger to be closed; test requirements migrating to Thailand facility. Expected to reduce operating expenses by $4.4M annually when complete. Charge included in consolidated $6.4M restructuring charge. Headcount impact not disclosed. | |||
| 2001-03-31 | acquisition_addition | completed | 2001-01-16 | 2001-01-16 | United States | Analog and mixed-signal products | USD 11 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Merger with TelCom Semiconductor completed January 16, 2001; 9,801,456 Microchip shares issued. Headcount added not disclosed. $10.9M special charge for transaction costs including $7.3M investment banking, $1.6M legal/accounting, $0.9M severance. | ||
| 2001-03-31 | restructuring | in_progress | 2001-02-01 | 2001-06-30 | Global | Manufacturing | USD 6 (millions) | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Announced in February 2001. Includes 24% reduction in wafer fab capacity at Fabs 1 and 2 and closure of Hong Kong test facility. Charge includes $4.0M equipment write-off, $2.1M severance, and $0.3M other costs. Hong Kong closure expected to complete by end of June 2001. | ||
| 2001-03-31 | acquisition_addition | completed | 2001-01-16 | 2001-01-16 | Global | All | MD&A f5-10k / Qwen3.6-27B-Q8_0 | Merger with TelCom Semiconductor, Inc. completed January 16, 2001. Specific headcount added not disclosed in filing. | |||
| 2000-12-31 | acquisition_addition | completed | 2000-10-26 | 2001-01-16 | United States | Analog and mixed-signal integrated circuits (TelCom Semiconductor) | subsequent_events f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of TelCom Semiconductor completed 2001-01-16 as a pooling of interests; 9,801,456 Microchip shares issued and TelCom stock options assumed. Filing does not disclose TelCom headcount added. | |||
| 2000-12-31 | acquisition_addition | announced | 2001-01-16 | subsequent_events f5-10q / Qwen3.6-27B-Q8_0 | Acquisition of TelCom Semiconductor, Inc. completed Jan 16, 2001. Issued ~9.8M shares and assumed all outstanding TelCom stock options. No specific headcount disclosed. | ||||||
| 2000-06-30 | acquisition_addition | completed | 2000-05-23 | 2000-07-26 | Puyallup, Washington, United States | Wafer fabrication / manufacturing | USD 80 (millions) | subsequent_events f5-10q / MiMo-V2.6-Flash-fp8-HTML | Closed 2000-07-26; $80 million cash purchase price for an inoperative semiconductor manufacturing complex from Matsushita Semiconductor Corporation of America. No employee or headcount figures disclosed; facility was inoperative, with equipment installation planned from November 2000 and volume production expected August 2001. | ||
| 2000-03-31 | other | completed | 2000-04-01 | 2000-06-30 | Americas | Sales | USD 1 (millions) | MD&A f5-10k / MiMo-V2.6-Flash-fp8-HTML | Terminated contractual relationships with predominantly all manufacturers' representatives in the Americas; $0.6M termination costs recorded in quarter ended March 31, 2000. Direct sales force resources to be in place by June 30, 2000. Affects external representatives, not employee headcount. | ||
| 2000-03-31 | restructuring | completed | 1999-03-31 | 1999-03-31 | United States | Manufacturing | USD 8 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Closure of 5-inch wafer line. Charge includes equipment write-off, severance, and other costs. Employee count not explicitly disclosed. | ||
| 2000-03-31 | plant_closure | completed | 1999-03-31 | 1999-03-31 | Taiwan | Test Operations | USD 6 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Closure of Kaohsiung facility and migration to Thailand. Charge includes severance and other costs. Employee count not explicitly disclosed. | ||
| 2000-03-31 | restructuring | completed | 1999-03-31 | 1999-03-31 | Global | Sales | USD 0 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Restructure of a portion of the sales infrastructure. Employee count not explicitly disclosed. | ||
| 1999-06-30 | plant_closure | in_progress | 1999-03-31 | Chandler, Arizona, United States | Wafer fabrication | USD 13,650 (thousands) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Shutdown of 5-inch wafer production line announced in March 1999 quarter; reduces production capacity by approximately 20%, to be replaced with 8-inch wafer production. No employee count disclosed. Remaining restructuring accrual of $4,311 thousand at June 30, 1999. | |||
| 1999-06-30 | plant_closure | completed | 1999-03-31 | 1999-06-30 | Kaohsiung, Taiwan | Test operations | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Test facility in Kaohsiung closed and capacity transferred to the more cost-effective test facility in Thailand; restructuring completed during the June 1999 quarter. No employee count disclosed. | |||
| 1999-06-30 | plant_closure | in_progress | Chandler, Arizona (5-inch wafer line); Kaohsiung, Taiwan (test facility) | Manufacturing / Test operations | USD 13,650 (thousands) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Program initiated during the quarter ended March 31, 1999; no specific announcement date or employee-impact count disclosed. Charge line combines 5-inch wafer fab restructuring and Kaohsiung closure; $9,339K paid and $4,311K accrual remaining at June 30, 1999. Kaohsiung test capacity transferred to Thailand. | ||||
| 1999-06-30 | restructuring | in_progress | Chandler, Arizona | Manufacturing | USD 13,650 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | 5-inch wafer fab restructuring. Charge incurred in prior quarter (March 1999); $9.3M cash paid, $4.3M remaining accrual as of June 30, 1999. | ||||
| 1999-06-30 | plant_closure | completed | Kaohsiung | Test Operations | USD 0 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Kaohsiung closure included in 5-inch wafer fab restructuring charge. Capacity transferred to Thailand. | ||||
| 1999-06-30 | restructuring | in_progress | Sales | USD 350 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Sales infrastructure actions. Charge incurred in prior quarter; $0.15M cash paid, $0.2M remaining accrual as of June 30, 1999. | |||||
| 1999-03-31 | plant_closure | completed | 1999-03-31 | 1999-03-31 | Chandler, Arizona, United States | Wafer fabrication (5-inch wafer line, Fab 1) | USD 8 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Closure completed in March 1999 quarter; reduced productive capacity ~20%. Charge comprised $6.758M equipment write-off, $0.310M severance, $0.493M other. | ||
| 1999-03-31 | plant_closure | in_progress | 1999-03-31 | 1999-09-30 | Kaohsiung, Taiwan | Final test operations | USD 6 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Test capacity migrating to Thailand facility over first two quarters of fiscal 2000. Charge comprised $5.579M severance and $0.510M other. | ||
| 1999-03-31 | restructuring | completed | 1999-03-31 | 1999-03-31 | United States | Sales infrastructure | USD 0 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Restructuring of a portion of sales infrastructure recorded in March 1999 quarter. | ||
| 1999-03-31 | restructuring | completed | 1999-03-31 | 1999-03-31 | United States | Manufacturing | USD 8 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Closure of 5-inch wafer line at Fab 1. Charge includes $6.758M equipment write-off, $0.31M severance, $0.493M other. Employee count not explicitly disclosed. | ||
| 1999-03-31 | restructuring | in_progress | 1999-03-31 | 2000-06-30 | Taiwan | Manufacturing | USD 6 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Closure of Kaohsiung test facility and migration to Thailand. Charge includes $5.579M severance, $0.51M other. Employee count not explicitly disclosed. | ||
| 1999-03-31 | restructuring | completed | 1999-03-31 | 1999-03-31 | Global | Sales | USD 0 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Restructuring of a portion of the Company's sales infrastructure. Employee count not explicitly disclosed. | ||
| 1998-12-31 | restructuring | announced | 1999-03-31 | Manufacturing | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Company will close its 5-inch wafer line, its least cost-effective capacity, reducing productive capacity by roughly 20%; capacity to be replaced with 6-inch and 8-inch production once inventories are reduced. Expected special restructuring charge of $15 to $17 million in the March 1999 quarter; no employee count disclosed. | |||||
| 1998-12-31 | restructuring | announced | 1999-06-30 | Assembly and Test Operations | MD&A f5-10q / GLM-5.3-flash-fp4-HTML | Company plans to restructure assembly and test operations over the next two quarters, migrating more test and a portion of assembly to lower-cost company-owned facilities; part of the same $15-17 million expected restructuring charge as the wafer line closure. | |||||
| 1998-12-31 | restructuring | completed | Sales organization | USD 1 (millions) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Part of a $5.5 million special charge recognized in the quarter ended June 30, 1998, which also included a $3.3 million legal settlement and a $1.7 million obsolete product write-off; the $0.5 million component related to restructuring a portion of the sales organization. No employee count disclosed. | |||||
| 1998-12-31 | plant_closure | announced | 1999-02-12 | 1999-03-31 | United States | Wafer Fabrication | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Closure of the 5-inch wafer line in the March 1999 quarter; reduces productive capacity ~20%. Combined with the assembly/test restructuring, expected special restructuring charge of $15-17 million in the March 1999 quarter. No employee count disclosed. | |||
| 1998-12-31 | restructuring | announced | 1999-02-12 | 1999-09-30 | Not specified | Assembly and Test Operations | MD&A f5-10q / MiMo-V2.6-Flash-fp8-HTML | Restructuring of assembly and test operations over the next two quarters, migrating test and part of assembly to lower-cost Company-owned facilities. Shares the combined $15-17 million expected charge with the 5-inch wafer line closure. No employee count disclosed. | |||
| 1998-12-31 | restructuring | announced | 1998-12-31 | 1999-03-31 | Global | Manufacturing, Assembly, Test | USD 16 (millions) | MD&A f5-10q / Qwen3.6-27B-Q8_0 | Company announced closure of 5-inch wafer line and restructuring of assembly/test operations. Expected special charge of $15-17 million in March 1999 quarter. Employee count not disclosed. | ||
| 1998-12-31 | restructuring | completed | 1998-06-30 | 1998-06-30 | Global | Sales | USD 1 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charge associated with restructuring of a portion of the Company's sales organization recognized in quarter ended June 30, 1998. Employee count not disclosed. | ||
| 1998-09-30 | restructuring | completed | 1998-06-30 | Sales organization | USD 500,000 (units) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Part of a $5.5M special charge recognized in the quarter ended June 30, 1998 (Q1 FY1999), within the YTD period. No employee count disclosed. | ||||
| 1998-09-30 | restructuring | completed | 1998-06-30 | 1998-06-30 | Sales | USD 500 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charge associated with the restructuring of a portion of the Company's sales organization. Employee count not disclosed. | |||
| 1998-06-30 | restructuring | completed | Sales | USD 1 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Part of a $5.5M special charge; $500,000 related to restructuring a portion of the sales organization. No employee count, dates, or geography disclosed. | |||||
| 1998-06-30 | restructuring | completed | 1998-06-30 | 1998-06-30 | Sales | USD 500 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Charge associated with the restructuring of a portion of the Company's sales organization. Employee count not disclosed. | |||
| 1998-03-31 | restructuring | completed | 3% | 1996-04 | Worldwide | USD 6 (millions) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Headcount reduction representing approximately 3% of worldwide employees in early April 1996. Pre-tax special charge of $5.969 million recorded in quarter ended June 30, 1996. | |||
| 1997-03-31 | restructuring | completed | 3% | 1996-04-01 | 1996-07-31 | Worldwide | Wafer fabrication and corporate | USD 6 (millions) | restructuring_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Headcount reduction of approximately 3% of worldwide employees in April 1996; charge covered idled 5-inch wafer fab capacity, two-week fab shutdown in July 1996, and severance costs. Fiscal 1997 Q1 (quarter ended June 30, 1996). | |
| 1997-03-31 | acquisition_addition | completed | 1996-06-25 | 1996-06-25 | United States | QuickASIC gate array products | USD 2 (millions) | business_combinations_footnote f5-10k / MiMo-V2.6-Flash-fp8-HTML | Acquisition of ASIC Technical Solutions, Inc. completed June 25, 1996; headcount added not disclosed. Charge represents write-off of in-process R&D. | ||
| 1997-03-31 | restructuring | completed | 3% | 1996-04-01 | Worldwide | USD 5,969 (thousands) | restructuring_footnote f5-10k / Qwen3.6-27B-Q8_0 | Headcount reduction representing approximately 3% of worldwide employees occurred in early April 1996. Pre-tax restructuring charge of $5,969,000 recorded in Q2 FY1996 for idling wafer fab capacity, shutdown costs, and severance. | |||
| 1996-12-31 | restructuring | completed | 3% | 1996-04-01 | Worldwide | Company-wide | USD 5,969 (thousands) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | April 1996 headcount reduction of roughly 3% of worldwide employees, part of broader actions including a 15% wafer fab production cutback and a two-week fab shutdown in July 1996; pre-tax charge of $5,969,000 recorded in the nine months ended December 31, 1996 covering fab idling costs, shutdown expenses and severance. | ||
| 1996-12-31 | restructuring | completed | 3% | 1996-04-01 | Worldwide | Wafer fabrication and general operations | USD 6 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Headcount reduction of approximately 3% of worldwide employees in early April 1996; absolute count not disclosed. Charge also covers idling 5-inch wafer fab capacity and a two-week fab shutdown in July 1996. | ||
| 1996-12-31 | acquisition_addition | completed | 1996-06-25 | United States | Quick-turn gate array devices (fabless) | USD 2 (millions) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of ASiC Technical Solutions, Inc. completed 1996-06-25 for $1.75M total; headcount added not disclosed. $1.575M charged to in-process R&D write-off. | |||
| 1996-12-31 | restructuring | completed | 3% | 1996-04 | Worldwide | USD 5,969 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Headcount reduction in early April 1996 representing approximately 3% of worldwide employees. Pre-tax restructuring charge of $5,969,000 recorded for nine months ended Dec 31, 1996, covering idling of 5-inch wafer fab capacity, shutdown expenses, and severance. | |||
| 1996-09-30 | restructuring | in_progress | 3% | 1996-04-01 | Worldwide | Company-wide | USD 5,969 (thousands) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Actions taken in quarter ended June 30, 1996 in response to customer inventory correction: delayed capital expansion, 15% wafer fab production cutback, headcount reduction in early April 1996 of approximately 3% of worldwide employees, and a two-week wafer fab shutdown in early July 1996. Pre-tax charge covers idling part of 5-inch wafer fab capacity, continuing expenses during the shutdown, and severance costs from the April 1996 headcount reduction. | ||
| 1996-09-30 | restructuring | completed | 3% | 1996-04 | Worldwide | Wafer fabrication and general operations | USD 5,969 (thousands) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Headcount reduction of approximately 3% of worldwide employees in early April 1996; part of broader restructuring including 15% wafer fab production cutback and two-week fab shutdown in July 1996. Charge covers idled 5-inch capacity, shutdown expenses, and severance. | ||
| 1996-09-30 | acquisition_addition | completed | 1996-06-25 | United States | Quick-turn gate array devices (fabless) | USD 1,575 (thousands) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of ASiC Technical Solutions, Inc. for $1,750,000 total; $1,575,000 one-time write-off of in-process R&D. No headcount added disclosed; impact described as immaterial. | |||
| 1996-09-30 | restructuring | completed | 3% | 1996-04-01 | Worldwide | USD 6 (millions) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Headcount reduction in early April 1996 representing approximately 3% of worldwide employees. Pre-tax charge of $5.969 million covers severance, wafer fab shutdown, and idling capacity. | |||
| 1996-06-30 | restructuring | completed | 3% | 1996-04 | worldwide | USD 5,969 (thousands) | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Pre-tax charge covers idling part of 5-inch wafer fab capacity, expenses during a two-week July 1996 fab shutdown, and severance from an April 1996 headcount reduction of roughly 3% of worldwide employees. Related actions included a 15% wafer fabrication production cutback and deferred capital spending. | |||
| 1996-06-30 | plant_closure | completed | 1996-07 | 1996-07 | wafer fabrication | restructuring_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Two-week wafer fab shutdown in early July 1996, part of capacity-reduction actions; continuing expenses during the shutdown are covered by the restructuring charge. | ||||
| 1996-06-30 | acquisition_addition | completed | 1996-06-25 | USD 1,750 (thousands) | business_combinations_footnote f5-10q / GLM-5.3-flash-fp4-HTML | Acquired ASiC Technical Solutions, a fabless gate array provider, for $1.75 million including related costs; $1,575,000 written off as in-process R&D. No headcount added disclosed. | |||||
| 1996-06-30 | restructuring | in_progress | 3% | 1996-04 | 1996-07 | Worldwide | Wafer fabrication / operations | USD 6 (millions) | restructuring_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Program responded to customer inventory corrections: 15% wafer fab production cutback, headcount reduction in early April 1996 equal to about 3% of worldwide employees, and a two-week wafer fab shutdown in early July 1996. Charge covers idled 5-inch capacity, shutdown-period expenses, and severance. Absolute headcount not disclosed; only month-level dates given. | |
| 1996-06-30 | acquisition_addition | completed | 1996-06-25 | Quick-turn gate array devices (fabless) | USD 2 (millions) | business_combinations_footnote f5-10q / MiMo-V2.6-Flash-fp8-HTML | Acquisition of ASiC Technical Solutions, Inc. for $1.75 million including related costs; purchase price largely allocated to in-process R&D written off ($1.575 million). No employee headcount added disclosed. | ||||
| 1996-06-30 | restructuring | completed | 3% | 1996-04-01 | Worldwide | USD 5,969 (thousands) | restructuring_footnote f5-10q / Qwen3.6-27B-Q8_0 | Headcount reduction in early April 1996 representing approximately 3% of worldwide employees. Pre-tax charge of $5,969,000 covers severance, idling 5-inch wafer fab capacity, and shutdown expenses. |